Title of Invention	BINDING ELEMENT
Abstract	Binding element in the form of a U-shaped profile (2) made of a heat-conducting material, which U-shaped profile (2) consists of a back wall (3) and two standing side walls (4), such that a space (5) is enclosed whe reby, in the above-mentioned space (5) , on the above - mentioned back wall (3) is provided a layer of glue (6) which melts under the influence of heat, and whereby on at least one of the above-mentioned side walls (4) is provided an end leaf (8) , characterized in that in the above- mentioned space (5), at least on the side wall (4) onto which the above-mentioned end leaf (8) is provided, is also provided a layer of glue (7) which melts under the influence of heat.

Title of Invention

BINDING ELEMENT

Abstract

Binding element in the form of a U-shaped profile (2) made of a heat-conducting material, which U-shaped profile (2) consists of a back wall (3) and two standing side walls (4), such that a space (5) is enclosed whe reby, in the above-mentioned space (5) , on the above - mentioned back wall (3) is provided a layer of glue (6) which melts under the influence of heat, and whereby on at least one of the above-mentioned side walls (4) is provided an end leaf (8) , characterized in that in the above- mentioned space (5), at least on the side wall (4) onto which the above-mentioned end leaf (8) is provided, is also provided a layer of glue (7) which melts under the influence of heat.

Full Text	1 Binding element. The present invention concerns a binding element. More specifically, the present invention concerns a binding element in the form of a U-shaped profile which is made of a heat-conducting material, which U-shaped profile consists of a back wall and two standing side walls, such that a space is enclosed, whereby in the above-mentioned space, on the above-mentioned back wall, is provided a layer of glue which melts under the influence of heat and whereby an end leaf is provided on at least one of the above-mentioned side walls• In order to bind a bundle of leaves, these leaves are put in the known manner in the above-mentioned space with one edge, and the binding element, together with the leaves, is provided in an appropriate binding device so as to heat the binding element to a temperature whereby the above-mentioned glue becomes liquid and is spread around the above-mentioned edge of the leaves, after which the binding element with the leaves is left to cool so as to make the glue harden again and to thus obtain a bound bundle whose leaves are glued in the binding element. In practice it appears that, while the bundle of leaves is being placed in the above-mentioned space of the binding element, the farthest leaves and in particular 2 the front and back leaves often do not slide into the above-mentioned layer of glue, as they keep sticking to the above-mentioned end leaves, for example due to electrostatic attraction between the end leaves and said farthest leaves. As a result, a good adhesion of said farthest leaves in the above-mentioned layer of glue is often not possible, such that they often come loose out of the above- mentioned binding element. The present invention aims to remedy the above-mentioned and other disadvantages. To this end, the present invention concerns a binding element in the form of a U-shaped profile made of a heat-conduct ing material, which U-shaped profile consists of a back wall and two standing side walls, such that a space is enclosed whereby, in the above-mentioned space, on the above-mentioned back wall, is provided a layer of glue which melts under the influence of heat, and whereby on at least one of the above-mentioned side walls is provided an end leaf which is characterized in that in the above-mentioned space, at least on the side wall onto which the above-mentioned end leaf is provided, is also provided a layer of glue which melts under the influence of heat. An advantage of such a binding element according to the invention is that the farthest leaves of a bundle of leaves to be bound, while this bundle of leaves is being 3 provided in the above-mentioned space of the binding element, always come into contact with a layer of glue, even if they stick to the end leaves in an electrostatic manner, more in particular with the layer of glue which is provided on the side walls of the binding element, such that these leaves can still be glued tight without coming loose. The above-mentioned layer of glue which is provided on the side wall is preferably made such that, while a bundle of leaves to be bound is being provided in the binding element, the farthest leaves of this bundle of leaves cannot remain hanging on the top edge of this layer of glue, more particularly, among other things, because the thickness of this layer of glue is as large as or smaller than the thickness of the above-mentioned end leaf. In order to better explain the characteristics of the invention, the following preferred embodiment of a binding element according to the invention is given as an example only without being limitative in any way, with reference to the accompanying drawings, in which: figure 1 schematically represents a view in perspective of a binding element according to the invention; figure 2 represents a section according to line II-II in figure 1; figure 3 represents the use of the binding element according to the invention according to 4 figure 2; figure 4 represents a variant of a binding element according to figure 2. Figures 1 and 2 represent a binding element 1 according to the invention which mainly consists of a U-shaped profile 2 made of a heat-conducting material, which U-shaped profile 2 consists of a back wall 3 and two standing side walls 4, such that a space 5 is enclosed. For the above-mentioned heat-conducting material of the U-shaped profile 2, use is preferably made of a metal, a ceramic material or the like. In the above-mentioned space 5, on the back wall 3, a layer of glue 6 is provided which melts under the influence of heat. In this case, in the above-mentioned space 5, on each of the above-mentioned side walls 4, is also provided a layer of glue 7 which melts under the influence of heat. A binding element 1, as represented in the figures, is moreover provided with two end leaves 8, for example in the shape of transparent synthetic leaves, provided against the above-mentioned side walls 4, for example by means of a glue with a higher melting temperature than that of the above-mentioned layers of glue 6 and 7. The above-mentioned layer of glue 7 in this case extends 5 from the above-mentioned layer of glue 6 on the back wall 3 to the edge of the end leaf 8. The use of a binding element 1 according to the invention is very simple and as represented in figure 3 . In order to bind a bundle of leaves 9 in a binding element 1 according to the invention, these leaves 9 are provided in the known manner with one edge in the above- mentioned space 5. The farthest leaves hereby slide along the layers of glue 7 on the side walls 4 of the binding element 1, as the thickness A of these layers of glue 7 is just as large as or less large than the thickness B of the end leaves 8, and as they extend up to the edge of said end leaves 8. Next, the binding element 1 is heated in the known manner up to a temperature whereby the layers of glue 6 and 7 become liquid and are spread around the above- mentioned leaves 9. Next, the binding element 1 with the leaves 9 are left to cool so as to make the layers of glue 6 and 7 harden again, and to thus obtain a bound bundle whose leaves 9 are glued in the binding element 1. Thanks to the presence of the layers of glue 7 on the side walls of the binding element 1, the farthest leaves of the bundle of leaves 9 are fixed as well, even when these farthest leaves have not been provided entirely into the 6 above-mentioned layer of glue 6 on the back wall 3. Figure 4 represents a variant of a binding element 1 according to the invention whereby the end leaves 8 are provided in the extension of the above-mentioned side walls 4, for example as they form a whole with it. The above-mentioned layers of glue 7 are in this case conical towards the end leaves 8. The use of such an embodiment of a binding element 1 is analogous to that of the above-described embodiment. While a bundle of leaves 9 to be bound is being provided, leaves 9 are guided into the above-mentioned space 5 by the conical part of the layers of glue 7. Thus is avoided that the farthest leaves of the above- mentioned bundle of leaves 9, while being provided in the U-shaped profile 2, remain sticking on the edge of the above-mentioned layers of glue 7 and do not slide any further in the U-shaped profile 2, such that, as a consequence, the farthest leaves will be inserted with certainty up against the back wall 3 and will make contact with the layers of glue 7 on the side walls 4. It is clear that only one such end leaf 8 can be provided and that it can also be made of other materials, such as for example paper. Naturally, the above-mentioned layer of glue 7 according 7 to the invention can only be provided on one of the side walls 4, and the above-mentioned layers of glue 7 must not extend up to the layer of glue 6 on the back wall 3, but they can also be realized as separate layers of glue at a distance from the layer of glue 6 on the back wall 3. The above -mentioned layers of glue 7 can be made, according to the invention, as a continuous layer over the entire length of the binding element 1, but they can also be formed of one or several glue segments provided on the respective side walls 4 of the binding element 1. According to a preferred characteristic, the above- mentioned U-shaped profile 2 is at least partly provided with a coating of paper, plastic or the like, which is not represented in the figures. The present invention is by no means limited to the embodiments given as an example and represented in the figures; on the contrary, such a binding element according to the invention can be made in all sorts of shapes and dimensions while still remaining within the scope of the invention. 8 Claims. 1. - Binding element in the form of a U-shaped profile (2) made of a heat-conducting material, which U-shaped profile (2) consists of a back wall (3) and two standing side walls (4), such that a space (5) is enclosed whe reby, in the above-mentioned space (5) , on the above - mentioned back wall (3) is provided a layer of glue (6) which melts under the influence of heat, and whereby on at least one of the above-mentioned side walls (4) is provided an end leaf (8) , characterized in that in the above- mentioned space (5), at least on the side wall (4) onto which the above-mentioned end leaf (8) is provided, is also provided a layer of glue (7) which melts under the influence of heat. 2 . - Binding element according to claim 1, characterized in that on both side walls (4) of the binding element (1) is provided a layer of glue (7) which melts under the influence of heat. 3 . - Binding element according to claim 1, characterized in that the above-mentioned layer of glue (7) on the side wall (4) is formed of one or several glue segments. 4.- Binding element according to claim 1, characterized in that the above-mentioned layer of glue (7) on the side 9 wall (4) extends up to the above-mentioned end leaf (8) . 5.- Binding element according to claim 1, characterized in that the above-mentioned layer of glue {7) on the side wall (4) extends up to the layer of glue (6) on the back wall (3). 6.- Binding element according to claim 1, characterized in that the thickness (A) of the above-mentioned layer of glue (7) on the side wall (4) is as large as the thickness (B) of the above-mentioned end leaf (8) . 7. - Binding element according to claim 1, characterized in that the thickness (A) of the above-mentioned layer of glue (7) on the side walls (4) is smaller than the thickness (B) of the above-mentioned end leaf (8). 8. - Binding element according to claim 1, characterized in that the above-mentioned layer of glue (7) on the side wall (4) is conical towards the end leaf (8) . 10 Binding element. Binding element in the form of a U-shaped profile (2) made of a heat-conducting material, which U-shaped profile (2) consists of a back wall {3) and two standing side walls (4) , such that a space (5) is enclosed whereby, in the above-mentioned space (5) , on the above - mentioned back wall (3) is provided a layer of glue (6) which melts under the influence of heat, and whereby on at least one of the above-mentioned side walls (4) is provided an end leaf (8) , characterized in that in the above- mentioned space (5) , at least on the side wall (4) onto which the above-mentioned end leaf (8) is provided, is also provided a layer of glue (7) which melts under the influence of heat. Figure 3.

Full Text

1
Binding element.
The present invention concerns a binding element.
More specifically, the present invention concerns a
binding element in the form of a U-shaped profile which
is made of a heat-conducting material, which U-shaped
profile consists of a back wall and two standing side
walls, such that a space is enclosed, whereby in the
above-mentioned space, on the above-mentioned back wall,
is provided a layer of glue which melts under the
influence of heat and whereby an end leaf is provided on
at least one of the above-mentioned side walls•
In order to bind a bundle of leaves, these leaves are put
in the known manner in the above-mentioned space with one
edge, and the binding element, together with the
leaves, is provided in an appropriate binding device
so as to heat the binding element to a temperature
whereby the above-mentioned glue becomes liquid and is
spread around the above-mentioned edge of the leaves,
after which the binding element with the leaves is left to
cool so as to make the glue harden again and to thus
obtain a bound bundle whose leaves are glued in the
binding element.
In practice it appears that, while the bundle of leaves
is being placed in the above-mentioned space of the
binding element, the farthest leaves and in particular

2
the front and back leaves often do not slide into the
above-mentioned layer of glue, as they keep sticking to
the above-mentioned end leaves, for example due to
electrostatic attraction between the end leaves and said
farthest leaves.
As a result, a good adhesion of said farthest leaves in
the above-mentioned layer of glue is often not possible,
such that they often come loose out of the above-
mentioned binding element.
The present invention aims to remedy the above-mentioned
and other disadvantages.
To this end, the present invention concerns a binding
element in the form of a U-shaped profile made of a
heat-conduct ing material, which U-shaped profile
consists of a back wall and two standing side walls, such
that a space is enclosed whereby, in the above-mentioned
space, on the above-mentioned back wall, is provided a
layer of glue which melts under the influence of heat,
and whereby on at least one of the above-mentioned side
walls is provided an end leaf which is characterized in
that in the above-mentioned space, at least on the
side wall onto which the above-mentioned end leaf is
provided, is also provided a layer of glue which melts
under the influence of heat.
An advantage of such a binding element according to the
invention is that the farthest leaves of a bundle of
leaves to be bound, while this bundle of leaves is being

3
provided in the above-mentioned space of the binding
element, always come into contact with a layer of glue,
even if they stick to the end leaves in an electrostatic
manner, more in particular with the layer of glue which
is provided on the side walls of the binding element,
such that these leaves can still be glued tight without
coming loose.
The above-mentioned layer of glue which is provided on the
side wall is preferably made such that, while a bundle of
leaves to be bound is being provided in the binding
element, the farthest leaves of this bundle of leaves
cannot remain hanging on the top edge of this layer of
glue, more particularly, among other things, because
the thickness of this layer of glue is as large as or
smaller than the thickness of the above-mentioned end
leaf.
In order to better explain the characteristics of the
invention, the following preferred embodiment of a
binding element according to the invention is given as an
example only without being limitative in any way, with
reference to the accompanying drawings, in which:
figure 1 schematically represents a view in
perspective of a binding element according to the
invention;
figure 2 represents a section according to line
II-II in figure 1;
figure 3 represents the use of the binding
element according to the invention according to

4
figure 2;
figure 4 represents a variant of a binding
element according to figure 2.
Figures 1 and 2 represent a binding element 1
according to the invention which mainly consists of
a U-shaped profile 2 made of a heat-conducting
material, which U-shaped profile 2 consists of a back
wall 3 and two standing side walls 4, such that a space 5
is enclosed.
For the above-mentioned heat-conducting material of the
U-shaped profile 2, use is preferably made of a metal,
a ceramic material or the like.
In the above-mentioned space 5, on the back wall 3, a
layer of glue 6 is provided which melts under the
influence of heat.
In this case, in the above-mentioned space 5, on each of
the above-mentioned side walls 4, is also provided a layer
of glue 7 which melts under the influence of heat.
A binding element 1, as represented in the figures, is
moreover provided with two end leaves 8, for example in
the shape of transparent synthetic leaves, provided
against the above-mentioned side walls 4, for example by
means of a glue with a higher melting temperature than
that of the above-mentioned layers of glue 6 and 7.
The above-mentioned layer of glue 7 in this case extends

5
from the above-mentioned layer of glue 6 on the back
wall 3 to the edge of the end leaf 8.
The use of a binding element 1 according to the
invention is very simple and as represented in figure 3 .
In order to bind a bundle of leaves 9 in a binding
element 1 according to the invention, these leaves 9 are
provided in the known manner with one edge in the above-
mentioned space 5.
The farthest leaves hereby slide along the layers of glue
7 on the side walls 4 of the binding element 1, as the
thickness A of these layers of glue 7 is just as large as
or less large than the thickness B of the end leaves 8,
and as they extend up to the edge of said end leaves 8.
Next, the binding element 1 is heated in the known
manner up to a temperature whereby the layers of glue 6
and 7 become liquid and are spread around the above-
mentioned leaves 9.
Next, the binding element 1 with the leaves 9 are left
to cool so as to make the layers of glue 6 and 7 harden
again, and to thus obtain a bound bundle whose leaves 9
are glued in the binding element 1.
Thanks to the presence of the layers of glue 7 on the side
walls of the binding element 1, the farthest leaves of the
bundle of leaves 9 are fixed as well, even when these
farthest leaves have not been provided entirely into the

6
above-mentioned layer of glue 6 on the back wall 3.
Figure 4 represents a variant of a binding element
1 according to the invention whereby the end leaves
8 are provided in the extension of the above-mentioned
side walls 4, for example as they form a whole with it.
The above-mentioned layers of glue 7 are in this case
conical towards the end leaves 8.
The use of such an embodiment of a binding element 1 is
analogous to that of the above-described embodiment.
While a bundle of leaves 9 to be bound is being provided,
leaves 9 are guided into the above-mentioned space 5 by
the conical part of the layers of glue 7.
Thus is avoided that the farthest leaves of the above-
mentioned bundle of leaves 9, while being provided in
the U-shaped profile 2, remain sticking on the edge of the
above-mentioned layers of glue 7 and do not slide any
further in the U-shaped profile 2, such that, as a
consequence, the farthest leaves will be inserted with
certainty up against the back wall 3 and will make
contact with the layers of glue 7 on the side walls 4.
It is clear that only one such end leaf 8 can be provided
and that it can also be made of other materials, such as
for example paper.
Naturally, the above-mentioned layer of glue 7 according

7
to the invention can only be provided on one of the side
walls 4, and the above-mentioned layers of glue 7 must
not extend up to the layer of glue 6 on the back wall 3,
but they can also be realized as separate layers of glue
at a distance from the layer of glue 6 on the back wall 3.
The above -mentioned layers of glue 7 can be made,
according to the invention, as a continuous layer
over the entire length of the binding element 1, but
they can also be formed of one or several glue segments
provided on the respective side walls 4 of the binding
element 1.
According to a preferred characteristic, the above-
mentioned U-shaped profile 2 is at least partly provided
with a coating of paper, plastic or the like, which is
not represented in the figures.
The present invention is by no means limited to the
embodiments given as an example and represented in the
figures; on the contrary, such a binding element
according to the invention can be made in all sorts of
shapes and dimensions while still remaining within
the scope of the invention.

8
Claims.
1. - Binding element in the form of a U-shaped profile
(2) made of a heat-conducting material, which U-shaped
profile (2) consists of a back wall (3) and two standing
side walls (4), such that a space (5) is enclosed
whe reby, in the above-mentioned space (5) , on the above -
mentioned back wall (3) is provided a layer of glue (6)
which melts under the influence of heat, and whereby on at
least one of the above-mentioned side walls (4) is provided
an end leaf (8) , characterized in that in the above-
mentioned space (5), at least on the side wall (4) onto
which the above-mentioned end leaf (8) is provided, is
also provided a layer of glue (7) which melts under the
influence of heat.
2 . - Binding element according to claim 1, characterized
in that on both side walls (4) of the binding element (1)
is provided a layer of glue (7) which melts under the
influence of heat.
3 . - Binding element according to claim 1, characterized
in that the above-mentioned layer of glue (7) on the side
wall (4) is formed of one or several glue segments.
4.- Binding element according to claim 1, characterized in
that the above-mentioned layer of glue (7) on the side

9
wall (4) extends up to the above-mentioned end leaf (8) .
5.- Binding element according to claim 1, characterized in
that the above-mentioned layer of glue {7) on the side
wall (4) extends up to the layer of glue (6) on the back
wall (3).
6.- Binding element according to claim 1, characterized
in that the thickness (A) of the above-mentioned layer
of glue (7) on the side wall (4) is as large as the
thickness (B) of the above-mentioned end leaf (8) .
7. - Binding element according to claim 1, characterized
in that the thickness (A) of the above-mentioned layer
of glue (7) on the side walls (4) is smaller than the
thickness (B) of the above-mentioned end leaf (8).
8. - Binding element according to claim 1, characterized
in that the above-mentioned layer of glue (7) on the
side wall (4) is conical towards the end leaf (8) .

10
Binding element.
Binding element in the form of a U-shaped profile (2)
made of a heat-conducting material, which U-shaped
profile (2) consists of a back wall {3) and two standing
side walls (4) , such that a space (5) is enclosed
whereby, in the above-mentioned space (5) , on the above -
mentioned back wall (3) is provided a layer of glue (6)
which melts under the influence of heat, and whereby on at
least one of the above-mentioned side walls (4) is provided
an end leaf (8) , characterized in that in the above-
mentioned space (5) , at least on the side wall (4) onto
which the above-mentioned end leaf (8) is provided, is
also provided a layer of glue (7) which melts under the
influence of heat.
Figure 3.

BINDING ELEMENT

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