Title of Invention | POWER SEMI-CONDUCTOR MODULE WITH AUX. LEAD |
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Abstract | A semi-conductor module is introduced, preferably a disc cell, with a power semi- conductor component arranged in the inside of the housing. The disc cell has two load leads and at least one aux. lead, wherein the aux. lead originates from the power semi-conductor component and terminates at an allocated external lead element. The external lead element of the aux. lead penetrates the housing and is built-up as pin type metallic molded part. The aux. lead is formed through a contact device at the. aux. lead contact of the power semi-conductor component, an electrically conducting connecting element and a contact element partially built-up as terminal disc/ wherein the terminal disc is arranged on the pin type metallic molded part of the external lead element. (Fig-1) To The Controller of Patents, The Patent Office, Mumbai. |
Full Text | FORM 2 THE PATENT ACT 1970 (39 Of 1970) The Patents Rules, 2003 COMPLETE SPECIFICATION (See Section 10, and rule 13) 1. TITLE OF INVENTION POWER SEMI-CONDUCTOR MODULE WITH AUX. HEAD 2. APPLICANT(S) a) Name : SEMIKRON ELEKTRONIK GMBH & CO. KG b) Nationality : GERMAN Company c) Address : POSTFACH 820251, 90253 NiiRNBERG, GERMANY 3. PREAMBLE TO THE DESCRIPTION The following specification particularly describes the invention and the manner in which it is to be performed : - Description A semi-conductor module is suggested with a secure internal connection of the aux. lead contact of a power semi-conductor component arranged in it with an external lead element. Various designs of semi-conductor modules are known, for example, with a chip having multiple power semi-conductor components arranged on it and with plastic housing encasing these. Some of these kinds of semi-conductor modules have also metallic base plates. Similarly known are disc cells with a hermetically sealed housing and often only a single semi-conductor component in its inside. The suggested designs are suitable for all kinds of semi-conductor module however, have special advantages especially for disc cells. The invention will, therefore, describe also with the example of a disc cell, how it is state of technology known for a long time and how it is produced in varied manner. These kind of disc cells - as the example in DE 101 32 169 A 1 shows - consist of a cylindrical body of insulation material acting as housing. Herein arranged is at least one power semi-conductor component; for example, a power diode, a power transistor or a power thyristor. The invention relates here mainly to those disc cells with controlled power semi-conductor components inside these. Here aux. lead is, therefore, understood mainly as the connection of the control lead of the power semi-conductor component. However, the term also includes aux. emitter leads or leads for sensors integrated in in the semi-conductor module. The aux. leads of a disc cell are designed in accordance to the state of technology as contact, equipment for connecting the aux. lead with the aux. lead contact of power semi-conductor component, a connecting element and a contact element for connecting with an external lead element, normally a through plated contact of the housing. The contact device for connecting the aux. lead with the aux. lead contact of the power semi-conductor component is designed either as indirect material connection mostly as soldered joint or as direct material connection mostly as pressure contact Soldered joints normally are disadvantageous, because these have in comparison with other jointing techniques the lowest durability. Pressure contacted joints are 2 known in a number of variants, wherein a newer variant is disclosed in the not pre- published DE10 2004 050 588. Based on this contact device the aux. lead mostly consists of an electrically insulated wire element which is soldered or welded to the lead element. Herein the welded joint has the advantage of greater durability. All known direct material contact solutions have the disadvantage that through their creation the inside of disc cell, especially that of closely arranged load lead contacts becomes dirty and thus the durability is impaired. Soldered joint has further disadvantage that through production of a soldered joint for the external lead the internal soldered joint is released. For power semi-conductor modules with a chip it is equally necessary that the aux. leads, starting from the power semi-conductor components or from the conductor tracks of the chip are designed as secure and durable electric connections. The basic task of the invention is to introduce a semi-conductor module, preferably a disc cell with an external lead element for aux. leads of a power semi-conductor component and /or of a chip, which allows a secure and durable electrical connection and, which is accessible to an easy mounting. The task is resolved according to the invention through the measures of the features as per Claim 1. Preferred design forms are described in the sub-claims. The invention based semi-conductor module has housing, at least one power semi- conductor component arranged in the inside of the housing and at least two and load leads and at least one aux. lead. Especially, preferred in semi-conductor module - built-up as disc cell - is that its housing with the external lead element is built-up as hermetically sealed. Further the semi-conductor module has at least one aux. lead coming from the power semi-conductor component, preferably from its control lead contact. Alternatively, this aux. lead can also originate from a chip. The respective aux. lead ends at an allocated external lead element, wherein the respective external lead element penetrates the housing. In the inside of housing this lead element is built-up here as pin type metallic molded part. 3 The aux. lead itself is built-up through a contact device at the aux. lead contact of the power semi-conductor component or at a respective lead contact of the chip, continuing further by means of an electrically conducting connection element and terminating in a contact element partially built-up as terminal disc. Herein, the terminal disc is arranged on the pin type metallic rnolded part of the external lead element. Preferably the contact element is built-up as a metallic molded part with a crimp connection with the connecting element built-up preferably as electrically insulated wire element. The terminal disc is built-up as an external ring with a number of (preferably three or five) free terminal lips. Preferred is the contact device at the aux. lead contact of the power semi-conductor component built-up as a plastic molded part for fixing a contact pin and as a spring element for pressure contacted connection of the contact pin with the aux. lead contact of me power semi-conductor component. The inventive thought is explained in more detail on the basis of design examples of Fig. 1 to 3. Fig. 1 shows a 3-D representation of a disc cell. Fig. 2 shows a cut through the middle of this disc cell. Fig. 3 shows the invention based contact element for connecting the aux. lead with an external lead element. Fig. 1 shows an inside view of an invention based power semi-conductor module, here of a disc cell. Represented here is a ceramic housing (300), arranged in it is a power semi-conductor component (200); here especially a power thyristor (200) has a centrally located aux. lead contact, here the control lead contact. The remaining area serves as load contact, here as cathode contact. Its load lead towards outside is not shown here. However, this corresponds to the major extent the state of technology that means it has a cavity for the arrangement of the aux. lead (100). The aux. lead (100) itself is built from a contact device (140), an electrically conducting connection element (120) and a contact element (110) partially developed as terminal 4 disc (114). Herein, the connecting element is developed as a contact pin (124) with a connecting wire element (122). The contact pin is supported and guided by means of contact device (140). This contact device (140) consists of a plastic molded body (144) and a spring element (142). The contact pin (124) is built-up in such a way, that after the assembly of the disc cell pressure acts on the contact device (120), which presses the contact pin (130) on the aux. lead contact of the power semi-conductor component (200) and thus establishes secure and durable electrical contact with the aux. lead (100). The second end of the aux. lead (100) form the contact element (110). This is built-up as a metallic molded part with a crimp connection (112). Hereby, the wire element (120) is electrically connected using a crimp connection. The contact element (110) further has a terminal disc (114), which is arranged on a pin type metal molded part of an external lead element. Fig. 2 shows a cut through the center of disc cell as per Fig. 1. Also represented is the cylindrical housing (300), the external surface of which is built-up in wave shape for reasons of electrical safety. The housing (300) has an external lead element (310). This lead element is built-up in the inside of housing (300) as pin type metallic molded part. The main lead element (190) of the anode is built-up here as metallic cylinder, on which another metallic disc is arranged, preferably made of molybdenum, and the power semi-conductor component (200) on it. The aux. lead (100) for connecting the aux. lead contact of the power semi-conductor component (200) with the external lead element (310) is in-turn formed from the contact device (140), electrically conducting connection element (120) and contact element (110). The arrangement of the contact element (110) on the pin type metallic molded part of the external lead element (310) is also represented here. Through this invention based design of the aux. lead (100), it protrudes in the area of the external lead element (310) only very minimal in the inside of the disc cell and allows thus enough space for the load lead element of the cathode, which is not represented. By means of this load lead element the plastic molded body (142) of the contact device (140) is pressed in the direction of the power semi-conductor component (200). Hereby, with the help of spring element (144) pressure is applied on the contact pin (124), which is thus connected electrically secure and permanent 5 with the aux. lead contact of the power semi-conductor component (200). The aux. lead (100) can alternatively - as per design mentioned above - also originate from a chip, which is designed as an aux. PCB in the inside of housing. This chip has then at least one metallic surface, which is connected - as electrically conducting - with the control lead of the semi-conductor component by means of a wire bond connection. Fig. 3 shows the invention based contact element (110) in plane view as well as in 3D representation. The contact element (110) is the connecting link of the aux. lead (100) with an external lead element (310). The contact element (110) is built-up as a metallic molded part with crimp lead (112) for the crimp joint with the connecting element (120) designed as wire element and with a terminal disc (112). The terminal disc consists of an external ring (118) with preferably three, or five not shown here, free terminal lips (116). The diameter of the central cavity of the terminal disc (114) is preferably smaller by O.lmm to 0.5mm than the diameter of the pin type metallic molded part of the external lead element (310, compare Fig. 1). [t is especially preferred, if the terminal lips (116) pre-bent from within the level formed through the external ring (118) in the direction of the inside of the power semi-conductor module, hi this case, it has again proved to be specially advantageous, if the tangents of the angle of terminal lips is smaller with respect to level than the sliding friction factor between the materials of the pin type molded part of the external lead element (310) and the terminal disc (114). The angle area of he pre-bend is then between the limit angle and the half limit angle. Thereby, the counting on the pin type metallic molded part of the external lead element (310) is simplified and slipping out is certainly prevented. 6 We Claims: 1. Semi-conductor module with a housing (300), at least one power semi-conductor component (200) arranged in the inside of the housing (300), at least two load leads (190) and at least one aux. lead (100), wherein one aux. lead (100) originates from the power semi-conductor component (200) and / or from a chip and ends at an allocated external lead element (310), wherein at least one external lead element (310) of at least one aux. lead (100) penetrates the housing (300) and is built-up in the inside as pin type metallic molded part and wherein the aux. lead (100) is formed through a contact device (140) at the aux. lead contact of the power semi- conductor component (200) or of the chip, an electrically conducting connection element (120) and a contact element (110) partially built-up as terminal disc (114), wherein the terminal disc (114) is arranged on the pin type metallic molded part of the external lead element (310). 2. Semi-conductor module as per Claim 1, Wherein the contact element (110) is built- up as a metallic molded part with a crimp lead (112) for crimp connection with the connecting element (120) designed as wire element (122) and the terminal disc (112), which is designed as an external ring (118) with multiple free terminal lips (116). 3. Semi-conductor module as per Claim 2, Wherein the terminal lips (116) are pre- bent from within the level formed through the external ring (118) in the direction of the inside of the power semi-conductor module. 4. Semi-conductor module as per Claim 1, Wherein the contact device (140) at the aux. lead contact of the power semi-conductor component (200) has a plastic molded part for fixing a contact pin (124) and a spring element for the pressure contacted connection of the contact pin (124) with aux. lead contact of the power semi-conductor component (200). 7 5. Semi-conductor module as per Claim 1, Wherein the semi-conductor module is built-up as disc cell, whose housing (300) is built-up as hermetically sealed with external lead element (310) and wherein the chip is designed as an aux. PCB in the inside of the housing. 8 Dated this 20th day of November, 2005 |
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1465-mum-2005-abstract(24-11-2005).doc
1465-mum-2005-abstract(24-11-2005).pdf
1465-MUM-2005-ABSTRACT(3-8-2011).pdf
1465-MUM-2005-CANCELLED PAGES(3-8-2011).pdf
1465-mum-2005-claims(24-11-2005).doc
1465-mum-2005-claims(24-11-2005).pdf
1465-MUM-2005-CLAIMS(AMENDED)-(3-8-2011).pdf
1465-mum-2005-correspondence(2-9-2007).pdf
1465-MUM-2005-CORRESPONDENCE(3-8-2011).pdf
1465-mum-2005-description(complete)-(24-11-2005).pdf
1465-mum-2005-drawing(24-11-2005).pdf
1465-MUM-2005-DRAWING(3-8-2011).pdf
1465-MUM-2005-ENGLISH TRANSLATION(3-8-2011).pdf
1465-mum-2005-form 1(24-11-2005).pdf
1465-mum-2005-form 18(5-9-2007).pdf
1465-mum-2005-form 2(24-11-2005).doc
1465-mum-2005-form 2(24-11-2005).pdf
1465-mum-2005-form 2(title page)-(24-11-2005).pdf
1465-mum-2005-form 3(24-11-2005).pdf
1465-MUM-2005-FORM 3(3-8-2011).pdf
1465-mum-2005-form 5(24-11-2005).pdf
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1465-mum-2005-general power of attorney(24-11-2005).pdf
1465-MUM-2005-GENERAL POWER OF ATTORNEY(3-8-2011).pdf
1465-MUM-2005-PETITION UNDER RULE 137(3-8-2011).pdf
1465-MUM-2005-REPLY TO EXAMINATION REPORT(3-8-2011).pdf
1465-MUM-2005-US DOCUMENT(3-8-2011).pdf
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Patent Number | 249005 | ||||||||
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Indian Patent Application Number | 1465/MUM/2005 | ||||||||
PG Journal Number | 38/2011 | ||||||||
Publication Date | 23-Sep-2011 | ||||||||
Grant Date | 20-Sep-2011 | ||||||||
Date of Filing | 24-Nov-2005 | ||||||||
Name of Patentee | SEMIKRON ELEKTRONIK GMBH & CO. KG | ||||||||
Applicant Address | POSTFACH-820251 90253 NURNBERG, | ||||||||
Inventors:
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PCT International Classification Number | H01L21/02 | ||||||||
PCT International Application Number | N/A | ||||||||
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