Title of Invention

VACUUM PROCESSING DEVICE

Abstract To provide a vacuum processing apparatus applicable to various manufacturing processes, by efficiently and highly reliably stacking films of various types and thicknesses and by downsizing the manufacturing apparatus by suppressing size increase of the apparatus due to increase of the number of film forming chambers caused by increase and complexity of process steps. [MEANS FOR SOLVING PROBLEMS] A vacuum processing apparatus is provided with a plurality of film forming process parts (10, 20), which are provided with rotating transfer tables (15, 25) and film forming chambers (12, 22). The rotating transfer tables form a transfer path for a work to be processed, in chambers (11, 21) which can be vacuum-exhausted. The film forming chambers are provided for depositing a film on the work to be processed which is arranged and transferred along a circumference which has a rotating shaft of the rotating transfer table as a center. The vacuum processing apparatus is also provided with a connecting part (30), which connects the film forming process parts so as to share a vacuum space between the chambers, and the work to be processed in the film forming process parts is mutually transferred in the vacuum. A load lock mechanism (14) is provided in one of the film forming process part or in the connecting part.
Full Text [Title of the invention] Vacuum Processing Device
Field of the Technology
0001
The present invention relates to a vacuum processing device depositing continuously a multilayer film on a substrate of such an optical disk or an optical component.
Description of the Background Technology
0002
Optical disks such as the compact disk (CD) or the digital versatile disk (DVD) have been diversified recently, and therefore availability thereof has been still growing from an information medium of reading-only to an optical information medium capable of writing. Synthetic resin, typically polycarbonate, having a low mold shrinkage ratio or a low expansion coefficient is used for substrate materials of the optical disk. Information is recorded on the surface of the substrate as a pit row in the case of the read-only disk, and a guide groove to become the track for laser is formed on the surface of the substrate in the case of the disk capable of writing. A multilayer film containing a writing layer is deposited on the surface to constitute the disk.
0003
FIG. 11 shows an example of a structure of the writable optical disk in which a guide groove 101a guiding a laser beam from an optical head is formed on one surface of a transparent substrate 101 of polycarbonate of 0. 6 mm in thickness, then a first dielectric material film layer 102, a phase change writing

layer 103, a second dielectric material film layer 104 and a reflection layer 105 are deposited on the surface in this order, and further a UV-cured overcoat layer 106 is coated thereon. The optical disk of approximately 1.2 mm in thickness is obtained by laminating a substrate with films and another substrate 110 of polycarbonate of 0.6 mm in thickness through a lamination adhesive layer 107.
0004
Because quantity of information to be recorded on a disk increases, a structure of the film that enables sure read has been required for densification of recorded information and acceleration of reading speed (Patent Document 1). In order to respond such requirement, it is necessary that the device forming the film should be much more improved on the performance thereof, for example, increasing the number of layers of the multilayer film, or regulating precisely the thickness of the layer.
0005
For example, FIG. 12 shows the layer structure of DVD-RAM type in which a first dielectric material film layer 202, a first interfacial layer 203, a phase change recording layer 204, a second interfacial layer 205, a second dielectric material film layer 206, a thermal buffer layer 207, a reflection layer 208, an overcoat layer 209, an adhesive layer 210 and a substrate 211 of polycarbonate to become a cover are formed by laminating on the surface where a groove 201a of a substrate 201 is formed. Though layers from the first dielectric material layer 202 to the reflection layer 208 of the abovementioned layers are deposited together in one vacuum processing device, the number of film-depositing chambers in which each layer is deposited

must be increased as the number of layers of the multilayer film
is increased.
0006
FIG. 13 shows an example of conventional vacuum processing devices for forming a multilayer film. A chamber 120 capable of maintaining in a vacuum state is provided with a load lock mechanism 121, and further first to eighth film-depositing chambers 122a to 122g are arranged in the chamber 120 together with a load lock mechanism 121 so as to be positioned along a circumference at the angular interval of 45 degrees on the circumference A rotary carrying table 123 having an arm carrying a substrate is disposed at the center of the chamber 120, and rotates intermittently in a horizontal plane about a shaft 124 having an exhaust tube. A_substrate carried from the load lock mechanism 121 is transported into the first film-depositing chamber 122a, and the film is deposited thereon by sputtering. Then, the substrate is transported into the second film-depositing chamber 122b and other film-depositing chambers in sequence so that a multilayer film can be deposited thereon, thereafter returns to the load lock mechanism 121 and is carried out from the chamber 120. The multilayer film-deposited substrate carried out is coated with the overcoat layer, and laminated with the substrate of polycarbonate of 0. 6 mm in thickness through a lamination adhesive layer in order that an optical disk can be obtained. In the above, multilayer film-depositing tact is rate-determined by the film-depositing chamber that requires the most time for film-depositing. 0007
In a general vacuum processing device, a substrate of the object to be processed is carried on the rotary carrying table

disposed in the chamber, and is transported to the film-depositing chambers disposed on a circumference with an interval for overlapped film-depositing. Because the number of the film-depositing chambers is increased as the number of layers in the multilayer film increases, the radius of the circumference becomes large. As a result, the dimension of the chamber containing the rotary carrying table is enlarged. Therefore, because the volume to be evacuated increases remarkably, the volume of the exhaust system evacuating to a vacuum state must be increased to the extent beyond necessity, and enlarged. Additionally, carrying circumference for the processed object on the rotary carrying table becomes large, so that the centrifugal force subject to the processed object cannot be neglected when the rotary carrying table is rotated with a high speed to shorten the tact time. Furthermore, intermittent drive control of the rotary carrying table becomes complicated. Patent Document 1: Japanese Patent Laid-open No, 2001-209974
DISCLOSURE OF THE INVENTION
Problems to be solved by the invention
0008
As to conventional vacuum processing devices, if an attempt to increase the number of film-depositing chambers is made in an device where aseries of film-depositing processes are carried out by carrying intermittently with horizontal rotation in an evacuated carrying space, the device must result in a large sized one. In the case that a multilayer film-deposited by a small number of film-depositing is fabricated to cope with various

film structures, useless film-depositing chambers would be generated. Though it may be thought that film-depositing is executed with setting a plurality of vacuum processing devices in line, there is a problem that obtaining steadily the quality of products should be difficult because processed objects must be taken out from the vacuum space into the atmosphere while the objects are being processed.
0009
The present invention is intended to obtain a vacuum processing device capable of corresponding to a wide variety of production processes, which can layer efficiently many kinds and thicknesses of films with high reliability and downsize the manufacturing device by suppressing the device become large-sized due to increase of the number of film-depositing chambers according to increase and complication of processing steps.
Means to solve the problems
0010
According to an embodiment of the present invention, an aspect of the present invention is a vacuum processing device comprising:
a first film-depositing process part comprising, a first chamber being evacuated in a vacuum state, a first rotary carrying table disposed in the first chamber and having a plurality of susceptors carrying aprocessedobject at apredeterminedangular interval so as to form a carrying route for the processed object, and a plurality of film-depositing chambers disposed along a circumference centered at a rotating shaft of the first rotary carrying table in the first chamber and depositing a film in

a multilayered form on the processed object to be carried by the rotary carrying table;
a second film-depositing process part comprising, a second chamber being evacuated in a vacuum state, a second rotary carrying table disposed in the second chamber and having a plurality of susceptors carrying a processed object at a predetermined angular interval so as to form a carrying route for the processed object, and at least one film-depositing chamber disposed along a circumference centered at a rotating shaft of the second rotary carrying table in the second chamber and depositing a film on the processed object to be carried by the second rotary carrying table;
a connecting part connecting the first film-depositing process part with the second film-depositing process part, and delivering the processed object processed in the first and the second film-depositing process parts to each other; and
a load lock mechanism disposed on any one of the first film-depositing process part, the second film-depositing process part and the connecting part and carrying the processed object in or out of the chamber while maintaining a vacuum state. 0011
Moreover, the number of the first film-depositing chambers can be different from the number of the second film-depositing chambers. 0012
Additionally, a sequence of processing steps can be performed upon connecting the two film-depositing process parts together, or the same processing can be executed in parallel by the two film-depositing process parts in compliance with the number of the film-depositing processing chambers.

00}3
Furthermore, the first film-depositing process part and the second film-depositing process part can be provided with a coo ling chamber cooling the processed object between respective
film-depositing chambers. 0014
Besides, the vacuum processing device is able to include an operation control part to control the device, wherein the load lock mechanism is arranged in the first film-depositing process part, and a film is deposited on the processed object carried from the load lock mechanism into the first chamber arranged in the first film-depositing process part after the object is carried by the first rotary carrying table, the object being transported to the connecting part and then a film being deposited on the object in the second film-depositing chamber after the object being transported thereto by the second rotary carrying table of the second chamber of the second film-depositing process part from the connecting part, the processed object having the films deposited thereon being transported to the first rotary carrying table via the connecting part and a film being deposited thereon in the first film-depositing chamber, thereafter the object being taken out from the load lock mechanism. 0015
The load lock mechanism is arranged in the connecting part and the connecting part contains a delivering mechanism for the processed object capable of doubling as the load lock mechanism. 0016
The connecting part includes positions delivering the processed object to the first film-depositing process part and

the second film-depositing process part, and at least one of the delivering positions can double as a cooling chamber. Furthermore, a third film-depositing process part is connected with at least one of the first film-depositing process part and the second film-depositing process part, wherein the third film-depositing process part is comprised of a third chamber capable of being evacuated in a vacuum state, a third rotary carrying table disposed in the third chamber and having a plurality of susceptors carrying a processed object at a predetermined angular interval so as to form a carrying route for the processed object, and a third film-depositing chamber disposed along a circumference centered at a rotating shaft of the rotary carrying table in the third chamber and depositing a film on the processed object to be carried by the rotary carrying table.
Effect of the invention
0017
The present invention can effectively layer various kinds and thicknesses of films with high reliability. In addition, the present invention can aim to downsize a manufacturing device by suppressing enlargement of the size of the device due to increase of the number of film-depositing chambers caused by increase and complexity of process stages . A vacuum processing device capable of responding to various production processes can be obtained, 0018
In the present invention, 'vacuum' means a state that is depressurized to a pressure lower than the atmosphere, and Vacuum processing' means carrying out a process such as

film-depositing by sputtering under a reduced pressure.
Preferred embodiments to carry out the invention
0019
Referring to the drawings, some embodiments of the present invention will be explained hereinafter. An aspect of the present invention is a vacuum processing device where a plurality of film-depositing process parts having a rotary carrying table and a film-depositing chamber are connected together in a chamber capable of being evacuated in a vacuum state, and a processed object is transported to the film-depositing process parts to form a film thereon in a multilayer with a continuous processing. Detailed explanation thereof will be executed with the embodiments. 0020 (Embodiment 1)
FIG. 1 to FIG. 3 illustrate an embodiment of the present invention. As shown in FIG. 1, a main chamber 1 capable of being evacuated in a vacuum state forms a guitar-shaped vacuum chamber 4 lengthened shallowly in the horizontal direction with a main body 2 and a top lid member 3 . A first film-depositing process part 10 is divided by a first chamber 11 constituting one of the swelled portions, and a second film-depositing process part 20 is divided by a second chamber 21 constituting the other of the swelled portions . The first film-depositing process part 10 and the second film-depositing process part 20 are connected together through the neck portion of the guitar-shape, which defines a connecting part 30 forming the part between the first chamber and the second chamber to be a common vacuum space. Degree of vacuum is preferably matched to the best discharging

condition of the film-depositing chamber, e.g. approximately
10-1 Pa.
0021
In the first film-depositing process part 10, four film-depositing chambers 12a, 12b, 12c and 12d are disposed on a circumference cl with a predetermined radius rl centered at the vicinity of the center of the first chamber 11 in such a manner that the centers thereof are positioned on the circumference. Four spaces between respective film-depositing chambers are defined as 'space positions'. A cooling chamber 13a is arranged between the film-depositing chamber 12a and the film-depositing chamber 12b, and a cooling chamber 13b is arranged between the film-depositing chamber 12c and the film-depositing chamber 12d. In addition, a load lock mechanism 14 is disposed between the film-depositing chamber 12d and the film-depositing chamber 12a, and a first delivering position 31 of the connecting part 30 is arranged between the film-depositing chamber 12b and the film-depositing chamber 12c. A load lock chamber 14a of the load lock mechanism and the first delivering position 31 are arranged so that they can be positioned oppositely to each other with respect to the center of the first chamber 11 and on the line dividing the main chamber 1 symmetrically into upper and lower portions in the figure. The load lock chamber 14a can double as a cooling chamber. 0022
As shown in FIG. 2, a first rotary carrying table 15 having a rotating shaft rotating for example in the direction of the arrow is provided at the center of the first chamber 11. The first rotary carrying table 15 is provided with a susceptor 16 in such a manner that the centers of the film-depositing chambers

12,. the cooling chambers 13, the load lock mechanism 14 and the delivering position 3JL are on the circumference cl at the angular interval of 45 degrees dividing equally the circumference corresponding thereto into eight divisions. The susceptor 16 carries a substrate 50, which is a processed object including masks 51 and 52, and transports the substrate to each position. The susceptor 16 also acts as a lid member capable of maintaining the film-depositing chamber 12 and the cooling chamber 13 sealed hermetically upon shutting the openings thereof, and is provided with a susceptor base member 16a and a holder 16b carrying the processed object thereon. 0023
The susceptor 16 is mounted on a susceptor-receiving hole 15b disposed along the circumference of a table plate 15a of the first rotary carrying table 15 so as to be movable vertically. To the bottom portion 2 of the chamber corresponding to each position of the first chamber 11, a susceptor push-up mechanism called 'pusher 17' is fixed. When a pusher piston 17a is driven upward as illustrated by the arrow in the figure, the susceptor 16 arrived at this position is pushed up and closes tightly the openings of the film-depositing chamber 12b or the load lock chamber 14a in FIG. 2. 0024
In the case of operation by actual devices, all of eight susceptors including cooling chamber positions are pushed up simultaneously with synchronization by the pushers. With finishing of task, the pushers descend and the susceptors 16 return to the table plate 15a by the aid of a spring 16c. The first rotary carrying table 15 turns intermittently by 45 degrees to move the susceptor 16 to the next position. The pusher 3/7

is 'driven again at the next position and processing is carried
out.
0025
Evacuation of the first chamber 11 is carried out by an external exhaust pump (not shown) connected to an exhausting passage 15d formed in a rotating shaft 15c of the first rotary carrying table 15. 0026
As shown in FIG. 4, the substrate 50 of the processed object is formed by a disk having a hole at the center thereof of synthetic
resin i.e. polycarbonate of 120 mm–§ in diameter and 0.6 mm in thickness in the case of DVD, and film-depositing is not carried out in the vicinity of the center and the periphery thereof. Therefore, the disk is transported together with a disk-shaped center mask 51 at the center and a ring-shaped outer mask 52 at the periphery attached thereon and then a film is deposited on the disk. Both the masks are made of magnetic material, and the bottom portion of the center mask is provided with a mechanical stopper 53 inserted in the disk hole to hold the disk. As a result, if the center mask is lifted up by a magnetic chuck, the disk is also lifted up simultaneously. 0027
The film-depositing chamber 12 (12a to l2d) deposits coated films on the transported substrate 50 by sputtering. Sputtering is carried out by a glow discharge generated in the film-depositing chamber upon applying a direct or alternate voltage between the electrode of the target 12i side and the electrode located in the vicinity of the substrate 50 side, in order that a fine target material can be scattered out by impacting the ions generated by the discharge onto the target, and thereby

the material is deposited on the substrate 50. 0028
The cooling chamber 13 (13a, 13b) has a structure in which a cooling plate is disposed facing the transported substrate 50 and a coolant gas is introduced to cool the substrate by conducting the heat of the substrate 50 to the cooling plate side. Cooling in the vacuum is very difficult if the substrate 50 is heated and the temperature thereof is raised by the sputtering in the film-depositing chamber of the preceding process. Therefore, upon incorporating a vacuum cooling process between respective film-depositing processes of the continuous vacuum process, film-depositing in the next process can be executed at a desired temperature of the substrate. 0029
The load lock mechanism 14 is a mechanism that transports a substrate located in the atmosphere into a vacuum chamber without breaking its vacuum state. Load lock upper lids 14cl and 14c2 are disposed on the both ends of a rotatable pick-and-place-arm 14b to transport the substrate alternately between the load lock chamber 14a and an external conveyor. When the load lock upper lid 14c2, which has conveyed a substrate 50 to be processed using an electromagnetic chuck 14d, seals hermetically an outer opening 14al of the load lock, the susceptor 16 pushed up by the pusher 17 seals hermetically an inner opening 14a2 of the load lock and receives the substrate 50 with masks simultaneously. When the load lock chamber 14a is evacuated by an attached exhaust system (not shown) and the vacuum level thereof comes to reach the extent of the vacuum level in the first chamber 11, the pusher 17 descends and the load lock chamber 14a is opened to the chamber side. Then a substrate 50 to be

processed is loaded on the first rotary carrying table 15. 0030
The processed substrate 50 on which a multilayer film has been deposited in the final film-depositing chamber I2d is transported to the position of the load lock chamber 14a by the first rotary carrying table 15. When the pusher 17 of this position pushes up the susceptor 16having the substrate 50 loaded thereon and the susceptor 16 is hermetically joined to the inner opening 14a2 of the load lock chamber, the substrate 50 with masks is electromagnetically chucked to the upper lid 14c2 simultaneously. When the load lock chamber 14a is leaked up to the atmospheric pressure by the attached exhaust system on the condition above, the upper lid 14c2 is released and lifted by the arm 14b, and then moved to the position of the conveyor. At the same time, the other upper lid 14cl carries a new substrate 50 with masks to be processed to the load lock chamber 14a through the outer opening 14al, and then the load lock chamber is tightly sealed from the atmosphere. Thereafter, the substrate is transported to the first film-depositing chamber 12a in accordance with the processing steps mentioned above. 0031
The second film-depositing process part 20 has the same structure as that of the first film-depositing process part 10 except that the second film-depositing process part 20 does not have a load lock chamber. The second film-depositing process part 20 has a structure in which four film-depositing chambers 22a to 22d and three cooling chambers 23a to 23c are arranged alternately along the circumference of a predetermined radius r2 centered approximately at the central portion of the second chamber 21 formed in the circular swelled portion, and a second

delivering position 32 of the connecting part 30 is disposed at the cooling position between the first film-depositing chamber 22a and the fourth film-depositing chamber 22d. A second rotary carrying table 25 (FIG, 3) having a rotating shaft at the center of the chamber is disposed in the chamber, and transports a. substrate 50transported to the delivering position 32 to the film-depositing chambers 22a to 22d. Namely, a substrate travels sequentially through the film-depositing chamber 22a, the cooling chamber 23a, the film-depositing chamber 22b, the cooling chamber 23b, the film-depositing chamber 22c, the cooling chamber 23c and the film-depositing chamber 22d for film-depositing. Thereafter, the substrate 50 is again carried to the delivering position 32 and returns to the first delivering position of the first film-depositing process part 10 side through the connecting part 30. 0032
Evacuation of the chamber is carried out by an external exhaust pump (not shown) connected to the exhausting passage formed in the rotating shaft (not shown) of the second rotary carrying table 25 in cooperation with the exhaust system of the first film-depositing process part. 0033
The connecting part 30 connects the vacuum spaces of both chambers 11 and 21 in common by the connecting space of chamber surrounded by a chamber wall 33 continuing from the first chamber 11 and the second chamber 21. The connecting part 30 is provided with the first delivering position 31 on the first film-depositing process part 10 side, the second delivering position 32 on the second film-depositing process part 20 side, and a delivering mechanism 34 (FIG. 3) between the two positions .

- The- delivering mechanism 34 is constituted of a
pick-and-place-arm 36 having a rotating shaft 35 at the center thereof and an electromagnetic chuck 37 provided on the both ends thereof. The arm 36 is rotated and controlled by a motor 38 connected with the rotating shaft. The electromagnetic chuck 37 is comprised of a part 371 for the center mask and a part 372 for the outer mask. The position of the center mask is on a circumference c3, which is in contact with the circumferences cl and c2 of the first and second rotary carrying tables 15 and 25. 0034
Upon driving the pusher 171 located on the delivering position 31 of the first chamber 11 side, a substrate 50i with masks is adsorbed by the electromagnetic chuck 37A of the first rotary carrying table 15 side. The pusher 172 on the second delivering position 32 of the second chamber 21 side is operated in the same time. A susceptor 26 of the second chamber 21 side is then pushed up and a substrate 502 with masks is adsorbed by another electromagnetic chuck 37B. When both the substrates are adsorbed to the arm 36 side, both the pushers retract downward and respective susceptors return to the first rotary carrying table 15. Next, the arm 36 turns by 180 degrees and exchanges with each other the positions on which the substrates 501 and 502 are located respectively. The pushers 171 and 172 are again operated and push up each susceptor so as to come into contact with the substrates exchanged like the above. On the other hand, upon stopping operation of the electromagnetic chuck 37, respective substrates are placed on each susceptor. By repeating the operation mentioned above, exchange of substrates between both chambers can be continuously carried out in a vacuum

with ease. 0035
As mentioned above, the vacuum processing device of this embodiment has a structure in which the first film-depositing process part 10 constituted of four film-depositing chambers, two cooling chambers and one .load lock chamber, and the second film-depositing process part 20 constituted of four film-depositing chambers and three cooling chambers, both the process parts being connected together through the connecting part as a common vacuum space. 0036
By carrying out continuously multilayered film-depositing with two film-depositing process parts, the whole device can be made compact. If film-depositing positions or cooling positions in the continuous vacuum film depositing using a rotary carrying table are increased, the radius of the rotary carrying table increases proportionally in compliance with the number of the positions, so that the volume of the chamber increases by about the second power thereof- In this embodiment, upon merely increasing the space of the connecting part a little, the vacuum space can be confined to the minimum, and exhausting efficiency can be ameliorated. Furthermore the diameter of the rotary carrying table becomes small and control of the driving motor can be easily executed. Quick intermittent rotation can be also realized. 0037
In the case of fabricating optical disks having a multilayer film shown in FIG. 12, operation of the device according to this embodiment will be explained referring to FIG. 5. 0038

, The multilayer film has seven layers and the first dielectric material film 202 is an insulating material such as ZnS-SiO2 and must be thicker than other layers, so that film-depositing is carried out by means of two film-depositing chambers for sharing the processes. Shared film-depositing can make the tact shorten. 0039
Respective film-depositing process parts and the connecting part of the vacuum processing device are controlled together by the operation control part 60. 0040
(1) The first f22d mechanism 14 to transport a substrate
201 molded by a stamper machine into the load lock chamber 14a
after attaching a mask thereto.
0041
1-2 The first film-depositing chamber (1) 12a to form
a part of the first dielectric material film layer 202 by
sputtering on the transported substrate.
0042
1-3 The cooling chamber 13a to cool the substrate taken
out from the first film-depositing chamber (1) 12a. 0043
1-4 The first film-depositing chamber (2) 12b to form
the remaining part of the first dielectric material film layer
202 by sputtering on the transported substrate.
0044
1-5 To transport the substrate having the first dielectric material film layer 2 02 deposited thereon to the first delivering position 31. 0045

1-6 To transport a multilayer substrate having the second dielectric material film layer 206 deposited thereon in the second film-depositing chamber (4) 22d to the first film-depositing chamber (3) 12c at the first delivering posit ion. 0046
1-7 The first film-depositing chamber (3) 12c to form
a thermal buffer layer 207 on the transported substrate by
sputtering.
0047
1-8 The cooling chamber 13b to cool the substrate taken
out from the first film-depositing chamber (3), 12c, 0048
1-9 The first film-depositing chamber (4) 12d to form
a reflection layer 208 on the transported substrate by
sputtering.
0049
1-10 To carry the substrate taken out from the first film-depositing chamber (4) 12d to the load lock chamber 14a, 0050
1-11 To take out the substrate having a multilayer film-deposited thereon from the load lock chamber 14a. 0051
(2) The connecting part 30
2-1 To transfer the substrate transported to the first delivering position 31 onto the second delivering position 32. 0052
2-2 To transfer simultaneously the substrate transported to the second delivering position 32 onto the first delivering position 31. 0053

(3) The second film-depositing process part 20
3-1 To transport the substrate carried in the second
delivering position 32_to the second film-depositing chamber
(1) 22a.
0054
3-2 The second film-depositing chamber (1) 22a to form
a first interfacial layer 203 on the transported substrate by
sputtering,
0055
3-3 The cooling chamber 23a to cool the substrate taken
out from the second film-depositing chamber (1) 22a. 0056
3-4 The second film-depositing chamber (2) 22b to form
a recording layer 204 on the transported substrate by sputtering. 0057
3-5 The cooling chamber 23b to cool the substrate taken
out from the second film-depositing chamber (2)22b. 0058
3-6 The second film-depositing chamber (3) 22c to form
a second interfacial layer 205 on the transported substrate by
sputtering.
0059
3-7 The cooling chamber 23c to cool the substrate taken
out from the second film-depositing chamber (3) 22c. 0060
3-8 The second film-depositing chamber (4) 22d to form
a second dielectric material film layer 206 on the transported
substrate by sputtering.
0061
3-9 To transport the film-deposited substrate to the

second delivering position 32. 0062
In the fabrication process of a substrate, the steps from 1-6 to 1-11 of the first film-depositing process part 10' correspond to the after process of the process steps of the second film-depositing process part 20. 0063
In this embodiment, the rotating direction of the rotary carrying table of the first film-depositing process part 10 is the same as the rotating direction of the rotary carrying table of the second film-depositing process part 2_0. However the rotating directions above are free from each other for each film-depositing process part, so that they can be set in accordance with the processed object. In addition, operation of each susceptor can also be controlled individually in order to carry out necessary processing* 0064
Because many steps such as combination of film-depositing chambers and cooling chambers can be installed in a downsized device in accordance with the present invention, multilayer film substrates to be processed by the sheet-fed system can be processed on variety of conditions. Therefore, evenness of the film thickness and uniformity of the film quality are improved, and thereby substrates of multilayer film with high quality can be obtained. 0065
Besides, the structure of this embodiment can cope with variety of changes of the fabrication process. 0066
With respect to fabrication of multilayer films constituted

of four layers CD-R shown in FIG. 11, the films can be deposited by operating only the first film-depositing process part 10, or the same film-depositing processes are executed in parallel upon operating the first and the second film-depositing process parts. Moreover, one of the film-depositing process parts can be turned twice in accordance with the type of multilayer film. 0067
As mentioned above, the process can be flexibly changed in compliance with the type of the optical disk, and fabrication can be performed without useless film-depositing chambers. 0068 (Embodiment 2)
As shown in FIG. 6, arrangement of the first film-depositing process part 10 and the second film-depositing process part 20 of this embodiment is the same as that of the Embodiment 1, but the number of the film-depositing chambers in the second film-depositing process part 20 is three (22a to 22c) different from the Embodiment 1 and the number of the cooling chambers is two (23a, 23b). The remaining parts are the same as the Embodiment 1, so that the same part is denoted by the same mark and explanation thereof will be omitted. Upon decreasing the number of the film-depositing chambers in the second film-depositing process part 20 compared to the first film-depositing process part 10 in accordance with various types of optical disks, the volume of the chamber can be set to be a bare minimum. Downsizing, reducing the installation area and facilitating the control can also be improved. Besides, at least one of the delivering positions 31 and 32 can double as a cooling chamber. 0069

(Embodiment 3)
As shown in FIG. 7, arrangement of the first film-depositing process part 10 and the second film-depositing process part 20 of this embodiment is the same as that of the Embodiment 1, but the load lock mechanism 14A is located at the position of the cooling chamber 13a in the Embodiment 1 and the cooling chamber 13c is located at the position of the load lock mechanism 14A in the Embodiment 1. The remaining parts are the same as the Embodiment 1, so that the same part is denoted by the same mark and explanation thereof will be omitted. This embodiment can be operated like the Embodiment 1. 0070 (Embodiment 4)
As shown in FIG. 8, arrangement of the first film-depositing process part 10 and the second film-depositing process part 20 of this embodiment is the same as that of the Embodiment 1, but the load lock mechanism 14B is located at the position of the first film-depositing chamber 12b in the Embodiment 1. Locating the cooling chamber 13c at the position of the load lock chamber 14a in the Embodiment 1 is the same as the Embodiment 3, The remaining parts are the same as the Embodiment 1, so that the same part is denoted by the same mark and explanation thereof will be omitted. This embodiment can be operated like the Embodiment 1. 0071
(Embodiment 5)
As shown in FIG. 9, this embodiment has a structure in which the load lock mechanism 70 is disposed in the connecting part 30. The same part as that of the Embodiment 1 is denoted by the same mark and explanation thereof will be omitted. The load

loqkmechanism 70 doubles as delivering function of the substrate between the first film-depositing process part l0 and the second film-depositing process part 20 as well as the primary load lock function, and is constituted of the load lock chamber 71 located in the connecting part and the pick-and-place-arm 72 having three arms extending toward the load lock chamber 71, the first deliveringposition 31 of the first film-depositing process part 10 side and the second delivering position 32 of the second film-depositing process part 20 side respectively at the angular interval of 120 degrees together. 0072
In the horizontal rotary table system in which the rotary carrying tables of respective f ilm-depositingprocess parts have rotating shafts in the vertical direction, a processed substrate to be loaded on each susceptor is carried on the condition of top-loading. Inconsequence, the electromagnetic chucks fitted on each arm of the pick-and-place-arm 72 are attached downward. The substrate having arrived at each delivering position or the load lock chamber is fixed to the top side of the susceptor on the condition of being hung in compliance with vertical movement of the arm, and is delivered to another position upon turning the arm by 120 degrees. The load lock chamber 71 opens in the bottom direction of the chamber and a substrate to be processed is carried in or out from the bottom side. When the pick-and-place-arm 72 is turned in the direction of the arrow of the figure, the film-depositingprocess starts from the second film-depositing process part 20 and the last-half film-depositing process is carried out in the first film-depositing process part 10 after passing through the connecting part. The substrate, on which the film has been

deposited, is again carried to the first delivering position 31, and then moved to the load lock chamber 71 so as to be carried outside . Rotating direction can be arbitrarily selected at each film-depositing process part and the connecting mechanism. 0073
Because the load lock mechanism is disposed between the first and the second film-depositing process parts in this embodiment, independency of the film-depositing process part can be raised and the process step corresponding to the type of optical disks can be easily changed. 0074 (Embodiment 6)
In this embodiment as shown in FIG. 10, a third film-depositing process part 80 as well as the second film-depositing process part 20 is branched from the first film-depositing process part 10 having the load lock mechanism 14C. The third film-depositing process part 80 contains a rotary carrying table and film-depositing chambers, and is connected with the first film-depositing process part 10 through a connecting part 81. The same part as that of the Embodiment 1 is denoted by the same mark and explanation thereof will be omitted. This example has four first film-depositing chambers (12a to 12d) in the first film-depositing process part 10, the cooling chamber 13a, three second film-depositing chambers (22a to 22c) in the second film-depositing process part 20, and two third film-depositing chambers (82a, 82b) in the third film-depositing process part 80. Upon allocating film-depositing process parts in compliance with the sort of multilayer to be layeredaccordingto this embodiment, sputtering can be precisely controlled. In addition, it becomes easy to

match the tact- Besides, deposition of sputtered material inside the chamber is so restricted that maintenance such as cleaning can be facilitated. 0075
Though the present invention has been explained heretofore using the embodiments mentioned above, it is needless to say that the present invention is not restricted to the embodiments mentioned above and many kinds of variations are possible unless they deviate from the scope of the present invention.
Brief Description of the Drawings
0076
FIG.l is a schematic plan view of the embodiment 1.
FIG. 2 is a schematic cross sectional view cut along the line A - A of FIG. 1.
FIG. 3 is a schematic cross sectional view cut along the line B - B of FIG. 1.
FIG. 4 is a schematic cross sectional view of the substrate equipped with masks.
FIG. 5 is a chart of the process steps explaining operation of the embodiment 1.
FIG. 6 is a schematic plan view of the embodiment 2.
FIG, 7 is a schematic plan view of the embodiment 3.
FIG. 8 is a schematic plan view of the embodiment 4.
FIG. 9 is a schematic plan view of the embodiment 5.
FIG. 10 is a schematic plan view of the embodiment 6.
FIG. 11 is a schematic cross sectional view explaining the multilayer film structure of the optical disk.
FIG. 12 is a schematic cross sectional view explaining the multilayer film structure of the optical disk.

FIG. 13 is a schematic plan view of a conventional device.
Explanation of the Marks
0077
1: Main chamber
10: First film-depositing process part
11: First chamber
12 (12a, 12b, 12c, 12d): First film-depositing chamber
13: Cooling chamber
14: Load lock mechanism
14a; Load lock chamber
15: First rotary carrying table
16: Susceptor
16a: Susceptor base
16b: Holder
17: Pusher
17a: Pusher piston
20: Second film-depositing process part
21: Second chamber
22 (22a, 22b, 22c, 22d): Second film-depositing chamber
23 (23a, 23b, 23c): Cooling chamber
25; Second rotary carrying table
30: Connecting part
31: First delivering position
32: Second delivering position
34: Delivering mechanism
35: Rotating shaft
36: Pick-and-place-arm
37 (37A, 37B): Electromagnetic chuck
50: Substrate

51: Center mask 52: Outer mask
60: Operation control part

. What is claimed is:
Claim 1. A vacuum processing device comprising: a first film-depositing process part comprising,
a first chamber being evacuated in a vacuum state,
a first rotary carrying table disposed in the first chamber and carrying a processed object, and
at least one first film-depositing chamber disposed along a circumference centered at a rotating shaft of the first rotary carrying table in the first chamber and depositing a film on the processed object to be carried by the first rotary carrying table;
a second film-depositing process part comprising,
a second chamber having a vacuum space shared by the first chamber,
a second rotary carrying table disposed in the second chamber and carrying a processed object, and
at least one second film-depositing chamber disposed along a circumference centered at a rotating shaft of the second rotary carrying table in the second chamber and depositing a film on the processed object to be carried by the second rotary carrying table;
a connecting part connecting the first film-depositing process part with the second film-depositing process part to share the vacuum space, and delivering the processed object processed in the first and the second film-depositing process parts to each other; and
a load lock mechanism disposed on any one of the first film-depositing process part, the second film-depositing process part and the connecting part and carrying the processed

object in or out of the chamber while maintaining a vacuum state.
Claim 2. The vacuum processing device as set forth in Claim 1, wherein the number of the first film-depositing chambers is different from the number of the second film-depositing chambers .
Claim 3. The vacuum processing device as set forth in Claim 1 or 2, wherein a sequence of processing steps is performed upon connecting the two film-depositing process parts together, or identical processing is executed in parallel by the two film-depositing process parts in compliance with the number of the film-depositing processing chambers.
Claim 4. The vacuum processing device as set forth in Claim 1, wherein the first film-depositing process part and the second film-depositing process part are provided with a cooling chamber cooling the processed object between respective film-depositing chambers.
Claim 5. The vacuum processing device as set forth in Claim 1, comprising an operation control part to control the load lock mechanism, the first film-depositing process part, the first rotary table, the connecting part, the second film-depositing chamber and the second film-depositing process part, applying to process the processed object.
Claim 6. The vacuum processing device as set forth in Claim 1, wherein the load lock mechanism is arranged in the connecting part and the connecting part comprises a delivering mechanism for the processed object, the delivering mechanism double

practically as the load lock mechanism.
Claim 7. The vacuum processing device as set forth in Claim 1, wherein the connecting part comprises delivering positions delivering the processed object to the first film-depositing process part and the second film-depositing process part, and at least one of the delivering positions doubles as a cooling chamber.
Claim 8. The vacuum processing device as set forth in Claim 1, wherein a third film-depositing process part is connected with at least one of the first film-depositing process part and the second film-depositing process part, and the third film-depositing process part comprises a third chamber being evacuated in a vacuum state, a third rotary carrying table disposed in the third chamber and forming a carrying route for the processed object, and a third film-depositing chamber disposed along a circumference centered at a rotating shaft of the rotary carrying table in the third chamber and depositing a film on the processed object to be carriedby the rotary carrying table.
Dated this 16 day of November 2006

Documents:

4226-CHENP-2006 CORRESPONDENCE OTHERS.pdf

4226-CHENP-2006 CORRESPONDENCE PO.pdf

4226-CHENP-2006 FORM-2.pdf

4226-CHENP-2006 FORM-3.pdf

4226-CHENP-2006 PETITION.pdf

4226-CHENP-2006 POWER OF ATTORNEY.pdf

4226-chenp-2006 claims.pdf

4226-chenp-2006 complete specification as granted.pdf

4226-chenp-2006 correspondance others.pdf

4226-chenp-2006-abstract.pdf

4226-chenp-2006-claims.pdf

4226-chenp-2006-correspondnece-others.pdf

4226-chenp-2006-description(complete).pdf

4226-chenp-2006-drawings.pdf

4226-chenp-2006-form 1.pdf

4226-chenp-2006-form 18.pdf

4226-chenp-2006-form 3.pdf

4226-chenp-2006-form 5.pdf

4226-chenp-2006-pct.pdf

EXAMINATION REPORT REPLY.PDF


Patent Number 238339
Indian Patent Application Number 4226/CHENP/2006
PG Journal Number 6/2010
Publication Date 05-Feb-2010
Grant Date 28-Jan-2010
Date of Filing 16-Nov-2006
Name of Patentee SHIBAURA MECHATRONICS CORPORATION
Applicant Address 2-5-1 , KASAWA, SAKAE-KU, YOKOHAMA-SHI, KANGAWA 247-8610
Inventors:
# Inventor's Name Inventor's Address
1 IKEDA ,JIRO SHIZUOKA, JAPAN.
PCT International Classification Number G11B7/26
PCT International Application Number PCT/JP05/08882
PCT International Filing date 2005-05-16
PCT Conventions:
# PCT Application Number Date of Convention Priority Country
1 2004-146770 2004-05-17 Japan