Title of Invention

AN OPTO-THERMO-MECHANICAL IMAGE DISPLAYING DEVICE

Abstract The main object of the present invention is to make an opto - thermo - mechanical integrated uncooled imaging device that captures the thermal image and provides a direct colored display. Infrared radiation passes through an infrared lens system and forms an image onto the device. IR radiation passes through the substrate and the lower diaphragm but gets absorbed in the upper disphragm. The heat so absorbed gets conducted to the substrate through the displaceable bimorph members linked to the diaphragm, thus heating the displaceable bimorph members and causing deflection that raises the upper diaphragm. This increases the gap between the lower and upper diaphragms. White light incident on the upper diaphragm causes constructive interference for a specific color in the visible range. The larger the IR intensity the more will be the shift towards RED. A pattern of colors from a multitude of such pixels will thus result in a direct color image.
Full Text F 0 R M - 2
THE PATENTS ACT, 1970
(39 OF 1970)
COMPLETE SPECIFICATION
(See Section 10)
TITLE OF INVENTION
"Colored Thermal Imaging using uncooled opto-thermo mechanical device without
electronics and electrics"
(a) INDIAN INSTITUTE OF TECHNOLOGY BOMBAY (b) having administrative office at Powai, Mumbai 400076, State of Maharashtra, India and (c) an autonomous educational Institute, and established in India under the Institutes of Technology Act 1961.
The following specification particularly describes the nature of the invention and the manner in which it is to be performed.

Field of Invention
The present invention relates to an opto-thermo-mechanical uncooled image displaying device for direct colored display of thermal images.
Background of Invention
Thermal imaging is used in applications such as night vision, environmental monitoring, astronomy, biomedical diagnostics, and thermal probing of active microelectronic devices.
Conventional thermal imaging device primarily consists of thermal imaging optics, thermal energy sensing, image processing, and image readout. Conventional thermal imaging systems use photoconductive or photovoltaic devices based on low band gap semiconductors. The low band gap, however, makes them susceptible to thermal noise, which necessitates operation at about 80 K. To achieve this temperature, the imaging systems require cryogenic cooling which leads to increased power consumption. Further, electrical interconnects used in conventional photoconductive, photovoltaic devices are good conductors of heat. They carry away heat in the sensors, which reduces the sensitivity of the sensors.
The colored display is desired for the ease of reading the image. It must be noted that the colors do not correspond to the actual visible colors of the object emitting IR radiation. The colors represent the intensities of the thermal radiation. The conventional scheme of colors is - violet for lowest intensity and red for the highest intensity of thermal radiation. The intermediate intensities are displayed by the colors in the visible light spectra.
Optomechanical Uncooled Infrared Imaging System: Design, Microfabrication, and Performance (Yang Zhao, Minyao Mao, Roberto Horowitz, Arunava Majumdar, John

Varesi, Paul Norton, and John Kitching. Journal of Microelectromechanical Systems, Vol. 11, No. 2, April 2002. This paper proposes an uncooled imaging system consisting of a focal-plane array (FPA) containing bi-material cantilever pixels made of silicon nitride (SiNx) and gold (Au), which serve as infrared absorbers and thermo-mechanical transducers. Based on wave optics, a visible optical readout system is designed to simultaneously measure the deflections of all the cantilever beams in the FPA and project the visible deflection map onto a charge-coupled device (CCD) imager. The system operates at room temperature and hence doesn't require a cryogenic cooling system.
However, the prominent drawbacks are -
• The output of the imager needs to be deciphered. For that it needs image processing devices and CCD image receptors so as to produce the image. It does not produce a colored image.
• As there is no temperature compensation, the temperature needs to be maintained, so as to get a true image.
• The IR sensing is done by the bi-material pixel array, and image capturing is done by a CCD imager. This is a disadvantage as both are not performed by the same device.
US Patent 6140646: Direct view infrared MEMS structure. This device works on the principle of changing the electric field due to the mechanical displacement of the structures due to the heating effect of the incident radiation. The chip needs an electrical power supply for the generation of electric field in the device. The change in the electric field results in change in the intensity of the display on a luminescent screen. Thus the incident image is directly displayed on the luminescent screen and does not require any image capturing system. The display has varying intensities but is not capable of showing colored image. While both functions namely IR sensing and image display is performed by the invention, it does not produce a colored image and it does require electrical power.
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A study of the prior art related to imaging devices reveals following technological gaps:
One of the IR detector systems which use cryogenic cooling, such as the one described by US patent 5,021,657 titled "Thermal imager" comprises of a telescope for gathering and directing IR radiation onto a cryogenically cooled detector. The invention is about gathering weak signals and minimizing the radiation from telescope parts from reaching the detector. The system is bulky and immobile.
In the prior imaging systems, such as the one described by US patent 4,594,507 titled "Thermal imager", the display system is either grayscale or it involves CCD cameras and processing of display data for obtaining an image. The need for CCD camera or image processing device makes the system complex.
The existing imaging devices, such as the one described by US patent 4,594,507 titled "Thermal imager", achieve colored images by processing the monochrome image using additional devices like computer and display device.
The prior imaging systems, such as the one described by US patent 6,140,646 titled "Direct view infrared MEMS structure", require on-chip electronics. Hence, the system needs an electrical power supply.
The sensitivity of the imaging system depends on the efficiency of absorbing the incident IR energy and the capacity of storing the energy to generate a high output; e.g. if absorption of IR radiation produces heating effect, which is used to generate output, we would like to have a sensor, which absorbs maximum IR energy and stores it to produce high temperatures and hence high sensitivity. The prior imaging systems, such as the one described by US patent 6,140,646 titled "Direct view infrared MEMS structure", have electrical interconnects, which are needed to access each pixel on the chip. As interconnect materials which are good electrical conductors are also good conductors of heat. Hence, existence of electrical or
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electronics increases the overall heat conductivity of the imaging chip, which has adverse effect on the sensitivity of the device.
To reduce the cross-talk between the neighboring pixels, the pixels are placed at a distance. This reduces the fill factor (ratio of used area and total area of the chip) and the resolution also gets affected. Moreover, as the chip area increases the size of the IR optical system increases, IR lenses cost increases rapidly with size, so this is a drawback in the existing systems, such as the one described by US patent 6,140,646 titled "Direct view infrared MEMS structure".
In the prior IR imaging systems, such as the one described by US patent 6,140,646 titled "Direct view infrared MEMS structure", there is always some electrical current flowing through the chip. The current leads to Joule's heating in the chip. This internal heating interferes with the working of the sensors.
Most of the IR sensors work on the principle of heating due to the IR radiation. As the ambient temperature changes it either heats the sensors up or cools them down. So the output of the sensor changes with the room temperature. To avoid this undesirable effect the prior IR imaging systems, such as the one described by US patent 4,594,507 titled "Thermal imager", use additional systems to maintain a constant temperature. This makes the system bulky.
There has been a longstanding need to provide IR imaging device with following characteristics
• IR sensing and colored image display capability
• A device that operates at room temperature and does not require cryogenic cooling
• Inherent room temperature compensation
• No need of image capturing devices like charge coupled devices
• No need for further image processing for captured IR image
• Direct coloured display of image without any processing device or electronics
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• No intervening electronics and electrical connections
• Reduced thermal cross-talk between neighboring pixels in the chip
• No internal heat generation implying absence of electrical current
• Device be simple and robust requiring minimum parts
Summary of the Invention
The main object of the present invention is to make an opto-thermo-mechanical un-cooled image creating device that captures the thermal image and provides a direct colored display.
Yet another object of the invention is to provide the device with room-temperature compensation.
Thus in accordance with the present invention the device comprises of:
substrate;
plurality of imaging elements
wherein
the said imaging element comprises of a pair parallel planer members, substantially
parallel to each other, that are linked to the said substrate via plurality of
displaceable bimorph members;
wherein first planer member is transparent to visible light and opaque to thermal
radiation and the second planer member, that is disposed between the said first
member and the said substrate, is transparent to thermal radiation and reflects
visible radiation.
Infrared radiation from the IR source passes through an infrared lens system onto the device. The IR image is formed at the level of the planer member herein afterwards called as diaphragms. The description below is for the working principle for one "pixel" or "cell" of the device. IR radiation passes through the silicon (Si) substrate and the lower polycrystalline-silicon (Poly-Si) diaphragm which are
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transparent to thermal radiation. It gets absorbed in the upper diaphragm made up of SiNx, and the heat so absorbed gets conducted to the Si substrate through the stubs to the displaceable bimorph members that support the diaphragm, thus heating the displaceable bimorph members and causing deflection. The displaceable bimorph members are attached to the upper diaphragm in such a way that beam deflection raises the diaphragm. This results in an increase in the gap between the upper and lower diaphragms. The visible radiation gets partially reflected by the upper diaphragm and the transmitted radiation gets fully reflected by the lower diaphragm. The resulting optical interference develops different interference colors which can be seen directly by the viewer.
Detailed Description of the Invention
Features and advantages of this invention will become apparent in the following
detailed description and the preferred embodiments with reference to the
accompanying drawings.
Figure 1 Schematic of the device (Sheet 1)
Figure 2 Working principle of the device (Sheet 2)
Figure 3 Mechanical construction and deflection illustration (Sheet 3)
Figure 4 Transient response of the device (Sheet 4)
The device is shown in Figure 1. The upper Silicon Nitride (SiNx), that is first planer member herein afterwards called as upper diaphragm 4 and the lower poly-Si, that is second planer member herein afterwards called as lower diaphragm 3 are structurally linked to the displaceable bimorph member (5 and 6) suspended from the extended Si substrate 2. The poly-Si diaphragm 3, SiNx diaphragm 4 and surface of the substrate 1 are parallel to each other.
Figure 2 illustrates working principle of the device. As shown in Figure 2, infrared radiation from the IR source falls on the Si substrate. Infrared (IR) radiation 7 passes through the Si substrate 1 which is transparent to the IR radiation. Further, the IR radiation passes through the lower poly-Si diaphragm 3 which is also transparent to
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IR radiation to the upper diaphragm 4 made up of SiNx. The IR radiations are absorbed in 4.
As a result of absorption of the IR, temperature of 4 increases and heat is conducted to the displaceable members 5 and 6 (Shown in Figure 1). This leads to the change of temperature of 5 and 6 resulting in their bending. This in turn leads to the vertical displacement of the SiNx diaphragm away from the poly-Si diaphragm. As a result of this, the thickness of the air film 8 between the two diaphragms increases.
As shown in Figure 2, the incoming visible white light rays 9 fall on the SiNx diaphragm 4 which is transparent to visible radiation. This visible light passes through this diaphragm and reaches the lower surface 12 of the upper diaphragm 4 where a part of the light 10 reflects back. The remaining portion of the light passes through the air film 8 between the two diaphragms and reaches 14 on the upper surface 13 of the lower diaphragm 3 which is made up of poly-Si which reflects the incident light back towards the upper diaphragm 4. This light again passes through the air-film and reaches the lower surface 12 of the SiNx diaphragm where a part of the light passes through as ray 11 and the remaining gets reflected back (not shown in this diagram). The reflected light 11 again travels a similar path as that of 10 and 11. Each time the light that comes from the lower surface of the SiNx diaphragm has different phases of different wavelengths depending on the air-film thickness.
All such rays with different phases interfere and vector addition of different phases for different wavelengths of light results in different amplitudes of different wavelengths of visible light. A constructive interference occurs for only one wavelength which corresponds to the air-film thickness. The wavelength should be double the air gap thickness "t" for a view angle of 90° and for a view angle of 6 it should be 2t / Sin(0). Multiple interference results in a major amplitude loss for the wavelengths for which the interference is not constructive and hence, we can observe a peak in the amplitude versus wavelength graph which corresponds to the wavelength of constructive interference.
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Each wavelength in visible range of light corresponds to a different color (violet for the lowest wavelength and red for the highest wavelength). The light coming back from the cells have a dominant color corresponding to the wavelength of constructive interference. As other wavelengths die down significantly due to the destructive interference only the dominant color can be seen. As the IR rays are incident on the cell, the heat of the IR rays leads to the bending of the displaceable bimorph members for the upper diaphragm and the distance between the two diaphragms increases. This increase of the air film thickness shifts the wavelength for which the constructive interference occurs for a higher wavelength and the visible color for that cell shifts towards the red color. This way the violet color is obtained for the default air gap which implies zero intensity of the IR light and red color will be for the highest air gap implying the highest intensity.
The purpose of keeping identical displaceable members attached to the lower and upper diaphragms is that both the displaceable members will respond identically to room temperature (increase or decrease) and thus the gap between the two diaphragms will not be affected. However, the focused IR image on any pixel or cell will be absorbed by the upper SiNx diaphragm and will cause change in the displaceable bimorph member attached to it. This will result in change in the air gap thickness which in turn will cause change in the observed interference color. The invention thus assures 'room temperature compensation".
In one embodiment the planer members are structurally linked to the substrate via the said displaceable bimorph members.
In another embodiment the said planer members are structurally linked to the substrate optionally via stubs that are in turn structurally linked to the displaceable bimorph members.
In yet another embodiment the said planer members are diaphragms.
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In one of the embodiments, the displaceable bimorph member is made of Silicon Dioxide (SiO2) with a gold coating.
In another embodiment, the two bimorph materials, namely silicon-dioxide and gold, can be replaced by any other microfabrication compatible materials that have different coefficients of linear expansion.
In one of the embodiments, the stub that structurally links the displaceable bimorph member to the diaphragm is made of Silicon Dioxide (SiO2).
In another embodiment, the stub can be made of any other microfabrication compatible materials that has required stiffness and good thermal conductivity
In one of the embodiments, Silicon is used as the substrate.
In another embodiment, Silicon could be replaced by any other microfabrication compatible material that is transparent to IR.
In one of the embodiments, poly-Si is used as the second, lower planer member.
In another embodiment, Poly-Si can be replaced by any other microfabrication compatible material that is transparent to IR and reflects visible light.
In one of the embodiments, SiNx is used as the material for first, upper planer member.
In another embodiment, SiNx could be replaced by any other microfabrication compatible material that absorbs IR and is transparent to visible radiation.
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In one of the embodiments, various parts of the device have dimensions like lengths, widths and thicknesses which have been arrived at by considering material properties and design objectives.
In another embodiment, the dimensions can be changed, increased or decreased, such that desired objective of the device are still met.
In yet another embodiment optical light source and lens system are placed above the device for observing the colored display
In another embodiment Infra-red lens system below Substrate is used to focus IR image onto diaphragms
Example
The steady state heating effect of the incident radiation and resulting deflection of the bimorph beam and the transient response of the system is illustrated in the following example:
Following are the specifications of the dimensions of various components that the device comprises of:
a. Displaceable bimorph members, stubs and diaphragms
Dimensions (all lengths in meters)

NAME VALUE
Length of STUB 5.00E-06
Length of GOLD Layer 2.25E-04
Length of OXIDE Layer 3.00E-04
Length of DIAPHRAGM 2.90E-04
Thickness of GOLD Layer 1.00E-06
Thickness of NITRIDE Layer 3.00E-06
Thickness of OXIDE Layer 1.00E-06
Width of STUB 5.00E-06
Width of GOLD Layer 1.00E-05
Width of OXIDE Layer 1.00E-05
Width of DIAPHRAGM 2.90E-04
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Following are the specifications of the materials used for various components that the device comprises of:
b. Displaceable bimorph members, stubs and diaphragms
Displaceable bimorph members

MATERIAL PROPERTIES FOR MATERIAL Si02
Young's modulus 0.69E+11 Pa
Thermal Conductivity 0.8 W/m/K
Thermal expansion coefficient 0.50E-05 K-1
Density 2200 kg/m3
Poisson's ratio 0.17
Specific heat 1000 J/kg/K

MATERIAL PROPERTIES FOR MATERIAL Gold
Young's modulus 0.75E+11 Pa
Thermal Conductivity 315 W/m/K
Thermal Expansion Coefficient 0.14E-04 K1
Density 19280.0 kg/m3
Poisson's ratio 0.22
Specific heat 128.7 J/kg/K
Diaphragm which is transparent to thermal radiation and reflects visible radiation

MATERIAL PROPERTIES FOR MATERIAL Silicon or Poly- Si
Young's modulus 1.30E+11 Pa
Thermal Conductivity 157 W/m/K
Thermal expansion coefficient 0.42E-05 K-1
Density 2320.0 kg/m3
Poisson's ratio 0.28
Specific heat 690 J/kg/K
DiaDhraam which absorbs thermal radiation and is transparent to visible light

MATERIAL PROPERTIES FOR MATERIAL SiNx
Young's modulus 3.80E+11 Pa
Thermal Conductivity 19 W/m/K
Thermal expansion coefficient 0.50E-05 K1
Density 3100 kg/m3
Poisson's ratio 0.22
Specific heat 1000 J/kg/K
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Substrate

MATERIAL PROPERTIES FOR MATERIAL Silicon
Young's modulus 1.90E+11 Pa
Thermal Conductivity 157 W/m/K
Thermal expansion coefficient 0.23E-05 K"1
Density 2300.0 kg/m3
Poisson' s ratio 0.28
Specific heat 700 J/kg/K
The Figure 3 shows the simulation results for one of the embodiments of the invention. It has two displaceable members structurally linked to the upper and lower diaphragms by stubs. In other embodiments, multiple displaceable members, 4 or more, may be structurally linked to the diaphragms. As an example, assume that the incident radiation of 100W/m2 falls on the upper nitride diaphragm and gets absorbed. The absorbed heat gets conducted through the stubs and passes through the displaceable bimorph members to the substrate (sink for heat - not shown in Fig 3). This leads to an increase in the temperature of the displaceable bimorph members by ~5°C. The displaceable bimorph members bend upwards due to the increase in temperature and unequal expansion of the two materials that constitute the bimorph member. The stub is structurally linked to the displaceable bimorph members and the diaphragms and in turn lifts the nitride diaphragm upwards. The simulation results of deflected displaceable bimorph members and the displaced nitride diaphragm with the deflection scale are shown in the Figure 3
The transient response of the invention is shown in Figure 4. A time constant of around 2 sec has been obtained. This indicates sensitivity of the order of 4E-9 m3/W. Room temperature changes are compensated by the same system with the time constant of 2 sec. It may be noted that the time constant and sensitivity is governed by the material selection of the diaphragms, stubs and displaceable bimorph members. In other embodiments, the time constant can be adjusted by scaling the pixel size and/or selecting materials that have different thermal properties like heat conductivity and heat capacity.
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We Claim:
1. An opto-thermo-mechanical image displaying device for display of thermal
images comprising:
substrate;
plurality of imaging elements
wherein
the said imaging element comprises of a pair parallel planer members,
substantially parallel to each other that are linked to the said substrate via
plurality of displaceable bimorph members;
wherein first planer member is transparent to visible light and opaque to
thermal radiation and the second planer member, that is disposed between
the said first planer member and the said substrate, is transparent to thermal
radiation and reflects visible radiation.
2. An opto-thermo-mechanical image displaying device as claimed in claim 1 wherein the said planer members are structurally linked to the substrate via the said displaceable bimorph members.
3. An opto-thermo-mechanical image displaying device as claimed in claim 1 wherein the said planer members are structurally linked to the substrate optionally via stubs that are in turn structurally linked to the displaceable bimorph members.
4. An opto-thermo-mechanical image displaying device as claimed in claim 1 wherein thermal radiation passes through the said substrate and the said second planer member; absorbs in the said first planer member, and is conducted to the said substrate through the said bimorph members, thus heating them up and causing deflection resulting in changing the distance between the said first and second planer members; the visible radiation partially reflected by the said second planer member and the transmitted radiation reflected by the said first planer member causes optical interference to indicate a color pattern of thermal image.
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An opto-thermo-mechanical image displaying device as claimed in claim 1
wherein the said planer members are diaphragms.
An opto-thermo-mechanical image displaying device as claimed in claim 1
wherein said displaceable members are identically affected by ambient
temperature thereby maintaining constant gap between the said planer
members.
An opto-thermo-mechanical image displaying device as claimed in claim 1
wherein color display is obtained due to constructive optical interference in
the gap between the said planer members.
An opto-thermo-mechanical image displaying device as claimed in claim 1
wherein the materials of construction of the said displaceable bimorph
members are selected from micro-fabrication compatible materials with
different coefficients of linear expansion.
An opto-thermo-mechanical image displaying device as claimed in claim 1
and 8 wherein the displaceable bimorph member is made of gold-coated
silicon dioxide.
An opto-thermo-mechanical image displaying device as claimed in claim 1
wherein material of construction of the stub is selected from any one of the
materials used in the displaceable bimorph member.
An opto-thermo-mechanical image displaying device as claimed in claim 1
wherein micro-fabrication compatible materials those are transparent to
thermal radiation is used as the substrate.
An opto-thermo-mechanical image displaying device as claimed in claim 1
and 11 wherein silicon is used as a substrate.
An opto-thermo-mechanical image displaying device as claimed in claim 1
wherein micro-fabrication compatible materials that are transparent to thermal
radiation and reflects visible light are used for the said second planer
member.
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14. An opto-thermo-mechanical image displaying device as claimed in claim 1 and 13 wherein poly-Si is used for construction of the said second planer member.
15. An opto-thermo-mechanical image displaying device as claimed in claim 1 wherein a micro-fabrication compatible material that absorb thermal radiation and is transparent to visible radiation is used for the said first planer member.
16. An opto-thermo-mechanical image displaying device as claimed in claims 1 and 15 wherein SiNx is used for construction of the said first planer member.
17. An opto-thermo-mechanical image displaying device as claimed in claims 1 and 4, wherein the planar members are of any shape including triangle, square, polygons and the like.
18. An opto-thermo-mechanical image displaying device as claimed in claim 1, wherein the displaceable bimorph members are arranged along two side or all the sides of the said planar members
16

Abstract:
The main object of the present invention is to make an opto-thermo-mechanical integrated uncooled imaging device that captures the thermal image and provides a direct colored display. Infrared radiation passes through an infrared lens system and forms an image onto the device. IR radiation passes through the substrate and the lower diaphragm but gets absorbed in the upper diaphragm. The heat so absorbed gets conducted to the substrate through the displaceable bimorph members linked to the diaphragm, thus heating the displaceable bimorph members and causing deflection that raises the upper diaphragm. This increases the gap between the lower and upper diaphragms. White light incident on the upper diaphragm causes constructive interference for a specific color in the visible range. The larger the IR intensity the more will be the shift towards RED. A pattern of colors from a multitude of such pixels will thus result in a direct color image.
17

Documents:

541-mum-2005-abstract (complete).doc

541-mum-2005-abstract (complete).pdf

541-MUM-2005-ABSTRACT(12-8-2009).pdf

541-mum-2005-abstract(granted)-(30-9-2009).pdf

541-MUM-2005-CANCELLD PAGES(18-9-2009).pdf

541-mum-2005-claims (complete).doc

541-mum-2005-claims (complete).pdf

541-MUM-2005-CLAIMS(12-8-2009).pdf

541-MUM-2005-CLAIMS(18-9-2009).pdf

541-mum-2005-claims(amended)-(18-9-2008).pdf

541-mum-2005-claims(granted)-(30-9-2009).pdf

541-MUM-2005-CORRESPONDENCE(18-9-2008).pdf

541-MUM-2005-CORRESPONDENCE(18-9-2009).pdf

541-mum-2005-correspondence(ipo)-(30-9-2009).pdf

541-mum-2005-correspondence-received-030506.pdf

541-mum-2005-correspondence-received-ver-260505.pdf

541-mum-2005-description (complete).pdf

541-mum-2005-description (provisional).pdf

541-MUM-2005-DESCRIPTION(COMPLETE)-(12-8-2009).pdf

541-MUM-2005-DESCRIPTION(COMPLETE)-(18-9-2009).pdf

541-mum-2005-description(granted)-(30-9-2009).pdf

541-mum-2005-description(provisional)-(3-5-2005).pdf

541-MUM-2005-DRAWING(12-8-2009).pdf

541-MUM-2005-DRAWING(18-9-2009).pdf

541-mum-2005-drawing(granted)-(30-9-2009).pdf

541-mum-2005-drawing(provisional)-(3-5-2005).pdf

541-mum-2005-drawings.pdf

541-MUM-2005-FORM 1(12-8-2009).pdf

541-MUM-2005-FORM 1(18-9-2008).pdf

541-MUM-2005-FORM 1(18-9-2009).pdf

541-mum-2005-form 18(19-10-2006).pdf

541-mum-2005-form 2(18-9-2009).pdf

541-mum-2005-form 2(granted)-(30-9-2009).pdf

541-mum-2005-form 2(provisional)-(3-5-2005).pdf

541-MUM-2005-FORM 2(TITLE PAGE)-(12-8-2009).pdf

541-MUM-2005-FORM 2(TITLE PAGE)-(18-9-2009).pdf

541-mum-2005-form 2(title page)-(complete)-(3-5-2006).pdf

541-mum-2005-form 2(title page)-(granted)-(30-9-2009).pdf

541-mum-2005-form 2(title page)-(provisional)-(3-5-2005).pdf

541-mum-2005-form 26(3-5-2005).pdf

541-MUM-2005-FORM 3(18-9-2008).pdf

541-MUM-2005-FORM 3(18-9-2009).pdf

541-mum-2005-form 3(26-4-2005).pdf

541-MUM-2005-FORM 8(15-5-2008).pdf

541-mum-2005-form-1.pdf

541-mum-2005-form-2 (complete).pdf

541-mum-2005-form-2 (provisional).doc

541-mum-2005-form-2 (provisional).pdf

541-mum-2005-form-26.pdf

541-mum-2005-form-5.pdf

541-MUM-2005-REPLY TO EXAMNIATION REPORT(12-8-2009).pdf

541-mum-2005-specification(amended)-(12-8-2009).pdf

abstract1.jpg


Patent Number 236126
Indian Patent Application Number 541/MUM/2005
PG Journal Number 41/2009
Publication Date 09-Oct-2009
Grant Date 30-Sep-2009
Date of Filing 03-May-2005
Name of Patentee INDIAN INSTITUTE OF TECHNOLOGY BOMBAY
Applicant Address Indian Institute of Technology Powai Mumbai 400 076
Inventors:
# Inventor's Name Inventor's Address
1 PRAKASH APTE BTR - 2 2nd floor Lakeside IIT Bombay campus Powai Mumbai 400 076
2 BHARTENDU SETH B - 62, IIT Bombay campus, Pawai Mumbai 400 076
3 OMKAR KARHADE 7, Ganga, Shivshakti Nager, Ambarnath 421 501
4 SUDHIR CHILUVERU 01, CT - 04, Ambika Apts, Sarvoday Nager, Mulund (W) Mumbai 400 080
PCT International Classification Number G01J5/48H04N5/33
PCT International Application Number N/A
PCT International Filing date
PCT Conventions:
# PCT Application Number Date of Convention Priority Country
1 NA