Title of Invention

POWER SEMICONDUCTOR MODULE WITH FIXING FITMENT

Abstract The invention describes a power semiconductor module with rectangular base grid, with housing, with load connection elements, with two fixing fitments arranged at first diagonally opposite corners and recesses arranged at second diagonally opposite corners. The load connection elements are arranged at two opposite first sides of the power semiconductor module. The fixing fitments are built-up as partial molded component of the power semiconductor module and project at both the opposite second sides without connection elements over the power semiconductor module the respective side. The recesses at the second sides are built-up in such a manner that each time one fixing fitment of another power semiconductor module arranged directly immediate at a second side in the allocated recess.
Full Text The invention describes a power semiconductor module for mounting on a heat sink, wherein the power semiconductor module has a rectangular shaped base grid. The power semiconductor module further has housing, load connection elements, and two fixing fitments arranged at the corners, preferably for a screw fitting. Modem designs of power semiconductor modules with higher capacity based on their building group, which are the starting point of this invention, are known from the documents DE 10 2004 025 609 A1 or DE 103 16 356 A 1.
The DE 10 2004 025 609 A 1 reveals a power semiconductor module for mounting on a heat sink, with a housing and with connecting elements for load and aux. connections. The load connection elements herein are built-up as metallic molded component with a recess for a screw fitting. The aux. connections are built-up as spring contact elements for pressure contacting with a PCB arranged above the power semiconductor module. This PCB builds-up preferably the entire external supply line and the load as well as aux. connections.
This kind of a design is especially suitable for power semiconductor modules with multiple half bridge circuits arranged in these, for example, a 3-phase bridge circuit. For this purpose, it is advantageous to arrange both the DC connections on a narrow side and the AC connections on a broad side. Especially advantageous on this design of a power semiconductor module is that this is built-up extremely compact and for this purpose the fixing fitments are arranged in the extreme corners of the housing.
From the DE 103 16356 A1 a power semiconductor module in modular design is known, which is built-up through serial arrangement of sub-modules one next to the other. Herein the sub-modules are joined together to form a single power semiconductor module or are arranged directly next to each other in series and joined with a common lid. The advantage here is that the sub-modules are arranged in extremely compact fashion, immediately next to each other. But the disadvantage however, is that due to the common lid the replacement of individual sub-modules
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is not easily possible.
The present invention is based on the task of presenting a compact power semiconductor module, which allows a space saving arrangement directly next to each other of several identical power semiconductor modules in a simple manner.
This task is resolved through an arrangement according to claim 1, special designs can be found in the sub-claims. The primary idea of the invention is on a power semiconductor module with rectangular base grid for mounting on a heat sink. The power semiconductor module has at least one housing and load connection elements, which are arranged at one or two opposite first sides of the power semiconductor module.
Similarly, the power semiconductor module has two fixing fitments arranged in the area of the first diagonally opposite corners. Preferably, these are fitments for the arrangement of a screw fitting to a heat sink. The fixing fitments are designed as partially molded component of the power semiconductor module and project above its side surfaces partially in the direction of normal lines of these side surfaces at both the opposite second sides not equipped with connection elements.
Further, the power semiconductor module has two recesses arranged in the area of the second diagonally opposite corners, wherein these recesses on the second sides are built-up in such a manner that one each of fixing fitment of a next power semiconductor module arranged directly immediate can protrude at second side in the recess.
The invention is explained more in detail on the basis of design examples in
conjunction with the Fig. 1 and 2.
Fig. 1 shows an invention based power semiconductor module.
Fig. 2 shows a series of several invention based power semiconductor modules.
Fig. 1 shows a design of power semiconductor module (1) further developed
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according to the invention, wherein Fig. la shows the power semiconductor module (1) in 3-D plane view, whereas Fig. 1 b shows the related base plate (2). The power semiconductor module (1) according to Fig. la has a base plate (2) and a plastic housing (3), which covers the power semiconductor elements arranged in it. For external electrical connectivity the power semiconductor module (1) has elements for load connections and aux. connections not shown here. The load connection elements (4) are built-up as metallic molded component with one recess each for screwed connections and are arranged at one first side or as represented here at two opposite first sides (10) of the power semiconductor module (1).
According to the state of technology the housing (3) has recesses (36) for fixing of a PCB. This PCB serves, for example, for controlling the power semiconductor element and for contacting the sensors inside the module.
According to the invention the housing (3) has two fixing fitments (140) arranged at first diagonally opposite corners (14), which form a partial component of the power semiconductor module. For this purpose, the electrically insulated plastic housing (3) has extensions (34), which project out at both the opposite second sides (12) not provided with connection elements (4) above the power semiconductor module (1) this respective side (12) partially in the area of the allocated corner (14) in the direction of the allocated normal lines (120).
The extensions (34) of the housing (3) have themselves round recesses (32) for putting through a screw fitting with a heat sink not shown here. The base plate (2) itself does not have in the area of corners (14) of the power semiconductor module (1) any extensions and thus does not project out also its respective side. In the allocated corners (214) of the base plate (2) flush aligned recesses (24) are arranged with the recesses (32) of the extension (30) of the housing (3). These are built-up as segments of a circle, wherein the missing segment of a circle is built-up through a part of the extension (34) of the housing (3).
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The housing (3), as well as also the base plate (2) of the power semiconductor module (1) have two recesses (160) arranged in the area of the second diagonally opposite corners (16). These recesses (160) at the second sides (12) are built-up in such a manner that one each fixing fitment (140) can project along with the extension (34) of the housing (3) of another power semiconductor module (1) arranged at a second side immediately next in the allocated recess (160).
Since in case of the invention based design of the power semiconductor module (1) it can be fixed only at two first corners (14) on a heat sink, it is especially advantageous, if the base plate (2) is diagonally bent. Herein the base plate has a diagonal, cylindrically convex design in such manner that the corners (214) of the base plate (2) allocated to the first corners (14) of the power semiconductor module (1) are bent in the direction of the housing (3). This bending of the base plate (2) has in the corners (214) a deviation of a plane base plate of less than two of hundred times of the maximum edge length of the base plate (2).
It can be further advantageous that the base plate (2) of the power semiconductor module (1) at its corners (216) has recesses (26), which have less strong cavity than the recesses (36) of the housing opposite the side line. Hereby the base plate (2) builds-up a contact pressure edge (22). This contact pressure edge (22), without it being graphically represented, can be at least partially overlapped by parts of the extension (34) of another power semiconductor module (1) arranged immediately next at a second side (12) and at least partially by the extension (34) projecting in the allocated recess (160). Thus this portion of the extension (34) of a second power semiconductor module acts on the corner (16) of the first power semiconductor module (1) and presses it at a screwed fitting of the second power semiconductor module on the heat sink.
Fig. 2 shows a serial arrangement of several invention based power semiconductor modules (1). Represented here are three power semiconductor modules, wherein each of these has a series circuit of two diodes with a center tapping of two diodes with a single diode. The entire circuit topology hereby implement able is thus a 3-
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phase input bridge circuit. On the left side three input phases of the AC voltage are arranged each with two load connections per power semiconductor module, whereas on the right side the load connections (4) of the DC outputs are arranged, which are yet to be connected in appropriate circuit.
The representation shows how the power semiconductor modules (1) with their second sides (12) are arranged immediately next to each other. Herein the fixing fitments (140) of a power semiconductor module (1) protrude in the allocated recess (160) of the neighboring power semiconductor module.
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CLAIMS:
1. Power semiconductor module (1), for mounting on a heat sink, with rectangular base grid, with a housing (3), with load connection elements (4), with two fixing fitments (140) arranged at first diagonally opposite corners (14) and two recesses (160) arranged at second diagonally opposite corners (16), wherein the load connection elements (4) are arranged at one or two opposite first sides (10) of the power semiconductor module (1), wherein the fixing fitments (140) are built-up as partial molded component of the power semiconductor module (1) and at the twp second sides (12) not provided with connection elements (4) the power semiconductor module (1) project over the respective side (12) partially in the direction of the normal lines (120) of this side surface and wherein the recesses (160) at the second sides (12) are built-up in a manner that one fixing fitment (140) each of another power semiconductor module (1) arranged on a second side (12) directly immediate project in the allocated recess (160).
2. Power semiconductor module (1) as per claim 1,
wherein the housing (3) has the extensions (34) forming the partial molded component of the fixing fitment (140) and these on their part have recesses (32) for putting through a screw fitting of the power semiconductor module (1) with a heat sink.
3. Power semiconductor module (1) as per claim 1,
wherein the power semiconductor module has a base plate (2), which also has at the corners (216) recesses (26), as well as at the corners (214) recesses (24) for putting through a screw fitting of the power semiconductor module (1) with a heat sink.
4. Power semiconductor module (1) as per claim 3,
wherein the recess (160) is built-up through recesses (36) of the housing (3) and through recesses (26) of the base plate (2).
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5. Power semiconductor module (1) as per claim 4,
wherein the recess (36) of the housing is built-up larger than the recess (26) of the base plate (2) and thus a contact pressure edge (22) is built-up.
6. Power semiconductor module (1) as per claim 2,
wherein base plate (2) is bent diagonally in a manner that the corners (214) of the base plate (2) allocated to the first corners (14) of the power semiconductor module (1) are bent in the direction of the housing (3).
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ABSTRACT
The invention describes a power semiconductor module with rectangular base grid, with housing, with load connection elements, with two fixing fitments arranged at first diagonally opposite corners and two recesses arranged at second diagonally opposite corners. The load connection elements are arranged at two opposite first sides of the power semiconductor module. The fixing fitments are built-up as partial molded component of the power semiconductor module and project at both the opposite second sides without connection elements over the power semiconductor module the respective side. The recesses at the second sides are built-up in such a manner that each time one fixing fitment of another power semiconductor module arranged directly immediate at a second side in the allocated recess.
(Fig. la)
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160


FORM 2
THE PATENT ACT 1970 (39 of 1970)
The Patents Rules, 2003 COMPLETE SPECIFICATION (See Section 10, and rule 13)
TITLE OF INVENTION
POWER SEMICONDUCTOR MODULE WITH FIXING FITMENT

APPLICANT(S)
a) Name
b) Nationality
c) Address

SEMIKRON ELEKTRONIK GMBH &CO.
GERMAN Company
POSTFACH 82 0251,
90253 NURNBERG,
GERMANY

KG

PREAMBLE TO THE DESCRIPTION
The following specification particularly describes the invention and the manner in which it is to be performed : -

Documents:

1309-MUM-2006-ABSTRACT(16-7-2009).pdf

1309-mum-2006-abstract(complete)-(21-8-2006).pdf

1309-mum-2006-abstract(granted)-(16-9-2009).pdf

1309-mum-2006-abstract.doc

1309-mum-2006-abstract.pdf

1309-MUM-2006-CANCELLED PAGES(16-7-2009).pdf

1309-MUM-2006-CLAIMS(16-7-2009).pdf

1309-mum-2006-claims(complete)-(21-8-2006).pdf

1309-mum-2006-claims(granted)-(16-9-2009).pdf

1309-mum-2006-claims.doc

1309-mum-2006-claims.pdf

1309-mum-2006-correspondence received-ver-21-08-2006.pdf

1309-mum-2006-correspondence received-ver-24-08-2006.pdf

1309-mum-2006-correspondence(16-7-2009).pdf

1309-mum-2006-correspondence(ipo)-(17-9-2009).pdf

1309-mum-2006-description (complete).pdf

1309-MUM-2006-DESCRIPTION(COMPLETE)-(16-7-2009).pdf

1309-mum-2006-description(complete)-(21-8-2006).pdf

1309-mum-2006-description(granted)-(16-9-2009).pdf

1309-MUM-2006-DRAWING(16-7-2009).pdf

1309-mum-2006-drawing(complete)-(21-8-2006).pdf

1309-mum-2006-drawing(granted)-(16-9-2009).pdf

1309-mum-2006-drawings.pdf

1309-MUM-2006-ENGLISH TRANSLATION VARIFICATION(16-7-2009).pdf

1309-mum-2006-form 1(12-10-2006).pdf

1309-MUM-2006-FORM 1(21-8-2006).pdf

1309-mum-2006-form 18(21-8-2006).pdf

1309-mum-2006-form 2(16-7-2009).pdf

1309-mum-2006-form 2(complete)-(21-8-2006).pdf

1309-mum-2006-form 2(granted)-(16-9-2009).pdf

1309-MUM-2006-FORM 2(TITLE PAGE)-(16-7-2009).pdf

1309-mum-2006-form 2(title page)-(complete)-(21-8-2006).pdf

1309-mum-2006-form 2(title page)-(granted)-(16-9-2009).pdf

1309-MUM-2006-FORM 3(16-7-2009).pdf

1309-MUM-2006-FORM 5(16-7-2009).pdf

1309-mum-2006-form-1.pdf

1309-mum-2006-form-2.doc

1309-mum-2006-form-2.pdf

1309-mum-2006-form-26.pdf

1309-mum-2006-form-3.pdf

1309-mum-2006-form-5.pdf

1309-MUM-2006-GENERAL POWER OF ATTORNEY(16-7-2009).pdf

1309-MUM-2006-REPLY TO EXAMINATION REPORT(16-7-2009).pdf

abstract1.jpg


Patent Number 236036
Indian Patent Application Number 1309/MUM/2006
PG Journal Number 39/2009
Publication Date 25-Sep-2009
Grant Date 16-Sep-2009
Date of Filing 21-Aug-2006
Name of Patentee SEMIKRON ELEKTRONIK GMBH & CO.KG
Applicant Address POSTFACH 820251, 90253 NURNBERG,
Inventors:
# Inventor's Name Inventor's Address
1 JURGEN STEGER SHULSTR.3 90355 HILTPOLTSTEIN,
2 FRANK EBERSBERGER KARLSBADER STR.15 90537 FEUCHT GERMANY
PCT International Classification Number H03K17/94
PCT International Application Number N/A
PCT International Filing date
PCT Conventions:
# PCT Application Number Date of Convention Priority Country
1 102005039947.9 2005-08-24 Germany