| Title of Invention | RIGID-FLEX WIRING BOARD |
|---|---|
| Abstract | A flex-rigid wiring board has an insulative adhesive interposed between portions, lapping over each other, of the rigid and flexible substrates; and the interconnecting electrode pads on the rigid and flexible substrates are electrically connected to each other through a conductor lump penetrating the insulative adhesive, thereby providing lowered inductance in the high-frequency band, shortened signal-delay time, reduced noise generation due to signal reflected-wave, reduced drop impact, high connection reliability and high freedom of wire connection, and the wiring board can advantageously be manufactured with a reduced cost and a high yield. |
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1585-KOLNP-2005-CORRESPONDENCE.pdf
1585-KOLNP-2005-FORM 27.1.1.pdf
1585-kolnp-2005-granted-abstract.pdf
1585-kolnp-2005-granted-assignment.pdf
1585-kolnp-2005-granted-claims.pdf
1585-kolnp-2005-granted-correspondence.pdf
1585-kolnp-2005-granted-description (complete).pdf
1585-kolnp-2005-granted-drawings.pdf
1585-kolnp-2005-granted-examination report.pdf
1585-kolnp-2005-granted-form 1.pdf
1585-kolnp-2005-granted-form 18.pdf
1585-kolnp-2005-granted-form 3.pdf
1585-kolnp-2005-granted-form 5.pdf
1585-kolnp-2005-granted-reply to examination report.pdf
1585-kolnp-2005-granted-specification.pdf
| Patent Number | 224968 | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Indian Patent Application Number | 1585/KOLNP/2005 | |||||||||
| PG Journal Number | 46/2008 | |||||||||
| Publication Date | 14-Nov-2008 | |||||||||
| Grant Date | 14-Nov-2008 | |||||||||
| Date of Filing | 09-Aug-2005 | |||||||||
| Name of Patentee | IBIDEN CO., LTD. | |||||||||
| Applicant Address | 1, KANDA-CHO 2-CHOME, OGAKI-SHI, GIFU | |||||||||
Inventors:
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| PCT International Classification Number | H05K 3/46, 1/02 | |||||||||
| PCT International Application Number | PCT/JP2004/005460 | |||||||||
| PCT International Filing date | 2004-04-16 | |||||||||
PCT Conventions:
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