| Abstract |
The invention relates to a method for structuring transparent, conductive layers, especially for structuring transparent electrode layers in thin-layer components.The selected wavelength of the laser used for structuring should fall substantially within the plasma absorption range of the transparent electrode layer and should full-fill following three requirements: a)the wavelength of the laser must be greater than the cut-off wavelength for optical absorption in the base absorber; (b)the wavelength of the laser must be greater than the cut off wavelength for free sub-strate absorbtion (plasma absorbtion)in the transparent electrode layer; and c)the wavelength of the laser must be less than the cut-off wavelength for metalic reflection on the transparent front electrode. |