Title of Invention | “COPPER FOIL COMPOSITE” |
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Abstract | A copper foil composite comprising a copper foil and a resin layer laminated thereon wherein elongation after fracture of the copper foil is 5% or more and wherein (F x T)/(f x t) => 1 is satisfied when t is a thickness of the copper foil f is a stress of the copper foil under tensile strain of 4% T is a thickness of the resin layer and F is a stress of the resin layer under tensile strain of 4%. |
Full Text | PLEASE SEE THE SPECIFICATION ATTACHED |
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Patent Number | 277196 | ||||||||
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Indian Patent Application Number | 92/DELNP/2012 | ||||||||
PG Journal Number | 48/2016 | ||||||||
Publication Date | 18-Nov-2016 | ||||||||
Grant Date | 15-Nov-2016 | ||||||||
Date of Filing | 03-Jan-2012 | ||||||||
Name of Patentee | JX Nippon Mining & Metals Corporation | ||||||||
Applicant Address | 6-3 Otemachi 2-chome Chiyoda-ku Tokyo 1008164 Japan. | ||||||||
Inventors:
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PCT International Classification Number | C09K | ||||||||
PCT International Application Number | PCT/JP2010/059416 | ||||||||
PCT International Filing date | 2010-06-03 | ||||||||
PCT Conventions:
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