Title of Invention	METHOD AND DEVICE FOR DETERMINING MACHINING SURFACE OF PLANAR MATERIAL AND FLAT SURFACE MACHINING DEVICE
Abstract	A surface machining method for performing mechanical machining, such as cutting, grinding and electric discharge machining, on a planar material to have a uniform thickness, characterized in that the planar material is mounted on a surface plate, coordinate axes X and Y are set in the plane directions of the planar material, coordinate axis Z is set in the height direction, an XY plane, including the origin in the Z direction measured as a distance (height) Zm,n from the coordinate (Xm, Yn) of a virtual plane ABCD to the plate thickness central plane (S) consisting of the middle point of a line connecting the upper and lower surfaces of the planar material as an object to be measured is assumed, the distance (height) in the Z direction of the plate thickness central plane of the planar material from the origin at an arbitrary XY plane position is measured, and the planar material is cut while being inclined so as to minimize the difference between maximum and minimum values of height data thus obtained. A flat planar material having a uniform thickness is obtained from a planar material having two-or three-dimensional deformation and/or variation in plate thickness, and a method and a device for determining the machining surface of the planar material when surface machining, such as cutting, grinding and electric discharge machining, is performed in order to obtain a flat planar material having a uniform thickness at a lowest machining cost are provided.

Title of Invention

METHOD AND DEVICE FOR DETERMINING MACHINING SURFACE OF PLANAR MATERIAL AND FLAT SURFACE MACHINING DEVICE

Abstract

A surface machining method for performing mechanical machining, such as cutting, grinding and electric discharge machining, on a planar material to have a uniform thickness, characterized in that the planar material is mounted on a surface plate, coordinate axes X and Y are set in the plane directions of the planar material, coordinate axis Z is set in the height direction, an XY plane, including the origin in the Z direction measured as a distance (height) Zm,n from the coordinate (Xm, Yn) of a virtual plane ABCD to the plate thickness central plane (S) consisting of the middle point of a line connecting the upper and lower surfaces of the planar material as an object to be measured is assumed, the distance (height) in the Z direction of the plate thickness central plane of the planar material from the origin at an arbitrary XY plane position is measured, and the planar material is cut while being inclined so as to minimize the difference between maximum and minimum values of height data thus obtained. A flat planar material having a uniform thickness is obtained from a planar material having two-or three-dimensional deformation and/or variation in plate thickness, and a method and a device for determining the machining surface of the planar material when surface machining, such as cutting, grinding and electric discharge machining, is performed in order to obtain a flat planar material having a uniform thickness at a lowest machining cost are provided.

Full Text	FORM 2 THE PATENTS ACT 1970 (39 of 1970) & The Patents Rules, 2003 COMPLETE SPECIFICATION (See section 10 and rule 13) 1. "METHOD FOR DETERMINING MACHINING PLANE OF PLANAR MATERIAL, MACHINING METHOD AND DEVICE FOR DETERMINING MACHINING PLANE AND FLAT SURFACE MACHINING DEVICE" 2. 1. (A) NIPPON MINING & METALS CO., LTD. (B) A Company incorporated under the Laws of Japan (C) 10-1, Toranomon 2-chome, Minato-ku, Tokyo, 1050001 Japan The following specification particularly describes the invention and the manner in which it is to be performed. TECHNICAL FIELD The present invention relates to a method for determining a work surface of a planar materia) in a surface treatment for obtaining a flat plate of a uniform thickness from a planar material, as well as to a machining method of such a work surface, a device for determining the foregoing work surface, and a flattening device. BACKGROUND ART A ceramic sintered plate such as a sputtering target or a metal plate prepared by metal rolling or forging, in most oases, is subject to be deformed by thermal stress or machining stress during the manufacturing process. Also the thickness is not uniform in some parts. In rrder to obtain a flat planar material of a uniform thickness from a planar material with such three-dimensions! deformation, machining such as cutting, grinding, and electrical discharging is performed. Conventionally, a material with this kind of deformation was subject to the. foregoing orocesses by an operator setting such materia! duactly on a processing machine, or the operator would roughly measure the deformation of the individual planar materials in advance with a straight end or the like, and insert a spacer during the stage of setting such materials in the processing 2- machine in order to maintain flatness. Nevertheless, the current status is that the foregoing methods are conducted based on the operator's instincts. For instance, when grinding a material based on the operator's instincts, even if the operator is an expert, he/she will need to perform such grinding more than necessary in order to obtain a plane. This is because it will not be possible to maintain the accuracy of flatness or uniform thickness without excessive grinding by the operator. Therefore, it was necessary to set the machining cost of the material itself higher, and this led to deterioration in the yield. in addition, this inevitably ied tc increased operation time of the processing machine. As conventional technology, there are. an apparatus to measure preciseiy the thickness of respective warped planar works (for instance, refer to Patent Document 1), a device to measure a warped planar works comprising a measurement reference unit, a measurement unit, a displacement measurement unit for converting into electrical signals, a warp measure display unit, and a control unit (for instance, refer to Patent Document 2), a manufacturing method of a ceramic product comprising the steps of pressurizing and molding ceramic material powder, irradiating a light beam on the surface thereof, and measuring the surface status upon receiving the reflected light (for instance, refer to Patent Document 3), a size measurement ceramic gauge provided with a stepwise portion (for instance, refer to Patent Document 4), a plate flatness measuring device comprising a downward measuring unit for measuring the flatness, a plate support pin, a vertical motion actuator, and a pressure regulation unit (for instance, refer to Patent Document 5), and a method for measuring the shape irregularity of a ceramic substrate using infrared thermography (for instance, refer to Patent Document 6). Nevertheless, the foregoing conventional technologies are methods or devices for measuring flatness, measuring displacement or measuring shape 3 irregularities, and do not provide the concept of improving the yield upon performing surface-machining such as cutting, grinding, and electrical discharging. [Patent Document 1] Japanese Patent Laid-Open Publication No. H6-66549 [Patent Document 2] Japanese Examined Patent Application Publication Nc. S59-36202 [Patent Document 3] Japanese Patent Laid-open Publication No. $63-173607 [Patent Document 4] Japanese Patent Laid-Open Publication No. H7-128002 [Patent Document 5] Japanese Patent No. 3418819 [Patent Document 6] Japanese Patent No. 3183935 DISCLOSURE OF THE INVENTION As described above, a ceramic sintered plate such as a sputtering target or a metai plate prepared by metal rolling or forging, in most instances, is subject to two- or three-dimensional deformation and/or variation in the plate thickness as a result of thermal stress or machining stress during the manufacturing process. Thus, an object of the present invention is to provide a method and a device for determining a work surface of a planar material in a surface treatment for obtaining a flat planar material of a uniform thickness and minima! machining cost from a pjanar materia! with two- or three-dimension deformation and/or having variatidn in the piate thickness. fn order to achieve the foregoing object, as a result of intense study, the present inventors discovered that it is possible to obtain a flat planar material of a uniform thickness with a favorable yield, as a first method, by seeking a plane composed from a center point in the thickness direction based on data obtained by measuring the distance (heighi:) from the respective reference planes of the upper and lower surfaces of the planar material, measuring the distance (height) 4 from the reference plane up to the plane composed from the center points by changing the relative positional relation (tilting) of the planar material and the reference plane within a certain definite range, and performing suriace treatment by adjusting the tilting of the planar material so that the difference between the maximum and minimum value of the obtained height data becomes minimum. Based on the foregoing discovery, the present invention provides: 1) A method of determining a work surface of a planar material for cutting a plate of a uniform thickness from a planar material, comprising the steps a setting, with a surface plate of a measuring device as coordinates (X, V): orthogonal coordinates (X, V, Z) composed of the coordinates (X; Y) and e 7 coordinate perpendicular to the coordinates {X, Y) on the surface plate, and mounting a planar material as an object to he measured on the surface plate; virtually configuring a plane ABCD that is parallel to the XY plane; setting the distance (height) from the coordinates (Xm, Yn) of the virtual plane ABCD to the plate thickness center plane composed of midpoints of segments connecting an upper surface and a lower surface of the planar materia! as the object to he measured as Z(mi n)3 measuring Z(m,n) across the entire area of the planar material to be measured for m distances (heights) in the X direction and n distances (heights) in the Y direction while changing the coordinates (X, Y)r and storing the measured data in a storage apparatus of a computer; seeking s maximum and minimum value of Z(m,n) for all coordinate points and calculating the difference thereof, and setting the obtained value as difference H {0.0, 0.0) when the measured value is not manipulated in any way; subsequently fixing end A of the virtual plane ABCD and respectively moving end B and end C vertically at a prescribed deflection width B, C regarding a predetermined maximum deflection width and pitch in the Z-axis direction so as to till the virtual plane ABCD against the surface plate on the computer; calculating the distance 5 (height) Z(m,n)(B,C) from all coordinate points (Xm, Yn) on the virtual plane ABCD to the plate thickness center plane of the coordinate points corresponding to the planar material each time the tilt is changed, and seeking the maximum and minimum value of Z(m,n)(B,C) and calculating the difference H (B, C) thereof; and repeating the calculation for all predetermined B and C combinations, and determining the virtual plane ABCD with the smallest value of H (B, -C) calculated in all B and 0 combinations as a plane that is parallel to a plane of minimum machining cost. This is one of the core inventions of the present application. As a second method, the present invention provides: 2) A method of determining a work surface of a planar material for cutting a plate of a uniform thickness from a planar materia), comprising the steps of setting, with a surface plate of a measuring device as coordinates (X, Y) orthogonal coordinates (X, Y, Z) composed of the coordinates (X, Y) and a Z coordinate perpendicular to the coordinates (X, Y) on the surface plate, ard mounting a planar material as an object to be measured on the surface plate; virtually configuring a plane ABCD that is parallel to the XY plane; setting the distances (heights) from the coordinates (X, Y) of the virtual plane ABCD to an upper surface and a lower surface of the planar material as the object to be measured as S1(m,n), S2(m,n) respectively, measuring S1(m,n), S2(m,n) across the entire area of the planar material to be measured for m distances (heights) in the X direction and n distances (heights) in the Y direction while changing the. coordinates (X, Y), and storing the measured data in a storage apparatus of a computer; seeking a maximum and minimum value of S(m,n) and S2(m,n) for all coordinate points: and calculatirig the difference thereof, and setting the obtained values as difference H1 (0.0, 0.0) and difference H2(0.0, CO), respectively, when the measured value is not manipulated in any wav; subsequently fixing end A of the virtual plane ABCD and respectively moving 6 end B and end C vertically at a prescribed deflection width B, C regarding a predetermined maximum deflection width and pitch in the Z-axis direction so as to tilt the virtual plane ABCD against the surface plate on the computer; calculating the respective distances (heights) S1(m,n)(B, C), S2(m,n)(B, C) from all coordinate points (Xm, Yn) on the virtual plane ABCD.to the upper surface and the lower surface on the planar material of the coordinate points corresponding to the planar material each time the tilt is changed, and seeking the maximum and minimum value of S1(m,n)(B, C) and S2(m,n)(B,C) and calculating the differences H1(B, C) and H2(B, C) thereof; and repeating the calculation for all predetermined B and C combinations, and determining the virtual plane ABCD with the smallest total value of H1(B, C) and H2CB, G) calculated in all 3 and C combinations as a plane that is parallel to a plane of minimum machining cost. This is another core invention of the present application. The present invention further provides: 3) The method of determining a work surface of a planar material according to paragraph i) or paragraph 2) above, wherein a distance (height) S1(m,n) between a virtual plane ABCD thst is parallel to a surface plate positioned at Z = h, which is higher than the upper surface of the planar material, and the upoer surface of the planar material and a distance (height) S2(M,N) between a virtual plane ABCD' that is parallel to a surface plate positioned at Z = I, which is lower than the lower surface of the planar material, and the lower surface of the planar materia! are measured so as to obtain a thickness T(m,n) of the planar material calculated from T(m,n)=r-1 S1=-s2(m,n) Although this metned shows a preferred and specific calculation method for obtaining the thickness T (m,n) of the planar material in the invention described in paragraph 1) or 2) above, this does not preclude the usage of other calculation methods. The present invention further provides: 7- 4) The method of determining a work surface of a planar material according to any one of paragraphs 1) to 3) above, wherein, upon reversing the planar material and mounting it on a surface plate of a processing machine, a point on a plane facing the virtual plane ABCD of the planar material corresponding to the coordinate points in which a value {Z(m,n) - 1/2 T(m,n) obtained by deducting 1/2 of the thickness T,(m,n) of the planar material at the coordinate points (Xm, Yn) from the distance (height) Z(m, n) up to the planar material among the coordinate points (Xm, Yn) of the virtual plane ABCD that is parallel to the minimum machining cost determined according to any one of paragraphs 1} -o 3) above becomes the smallest value {Z(m. n) 1/2 T(m,n)}min is set as a point for coming in contact with the surface plate. This method shows preferred and specific conditions for reversing the planar materia! and mounting it on a surface piate of a processing machine in the invention described in paragraphs 1) to 3) above. Nevertheless, although this method of setting the planar materia! on the surface plate can be used as a reference upon deciding the final work surface, it does not preclude the usaae of other conditions. The present invention further provides: 5) The method of determining a work surface of a planar material according to any one of paragraphs 1) to 4) above, wherein, upon reversing the planar material and mounting it on a surface plate of a processing machine, a value sought by deducting a value {Z(m. n) - 1/2T(m,n) which is obtained by subtracting 1/2 of the thickness T(m. n) of the planar material at the coordinate points (Xn, Yn) from the distance (height) Z(m,n) up to the planar material among the coordinate points (Xm. Yn) of the virtual plane ABCD becomes the smallest value. (Z(m,n) - 1/2T(m,n) from the measured value of the distance (height) of four corners of a-plane facing the virtual plane ABCD of the planar material is set as the thickness of a spacer to be inserted into the four corners upon mourning the 8 planar material on the processing machine. This method shows a preferred and specific calculation method for setting a spacer in the processing machine in the invention described in paragraphs i) to 4) above. Although this spacer plays an important role in determining the machining cost of the planar material, this does not preclude the usage.of other calculation methods. The present invention further provides: 6) The method of determining a work surface of a planar material according-to any one of paragraphs 1).to 5) above, wherein the distance (height) of the 2 direction is measured at positions in intervals or 20 mm or less ;n both the X direction and Y direction of the coordinate axis of the planar material; 7) The method of determining a work surface of a planar materia! according to any one of paragraphs 1) to 6) above, wherein the distance (height) from the planar material is measured with a laser distance sensor or a contact distancs sensor; and 8) The method of determining a work surface of a planar material according to any one ot paragraphs 1) to 7) above, wherein the tilt of a biaxial tift machining table of an NC-controllable processing machine is adjusted in order to set the work surface of the planar materia! to a prescribed position in relation to the surface plate based on the data. These conditions show preferable and ; additional conditions. The present invention further provides: 9) A machining method of determining a work surface of a planar material based on a method according to any one of paragraphs 1) to 8) above, and, based thereon, performing a machining process such as cutting work, Grinding process and electrical discharging in order to cut out a plate having a uniform thickness from a planar material; 10) A machining method of determining s work surface of a planar material 9 based on a method according to any one of paragraphs 1) to 8) above, and based thereon, grinding one surface of "the planar material, subsequenty reversing the planar material and mounting it on a surface plate, and processing the rear surface; and 11) A machining method of fixing a planar material on a surface plate of a processing machine doubling as a measuring device by way of adhesive, bonding or electromagnetic adsorption or the like, determining the optimal; tiltin conditions based on the measurements performed with the method according to any one of paragraphs 1) to 7) above, subsequently using the biaxial ti't mechanism of the surface plate of the processing machine so as to tile the surface piate to be parallel to the plane obtained with the optimal tilting conditions1 and machining the planar material in such a state without reversing the material. These conditions snow preferable and additional conditions. The present invention further provides: 12) A device of determining a work surface of a planar material] for cutting a plate of a uniform thickness from a planar material, comprising a system for setting, with a surface plate of a measuring device as coordinates (X, Y), orthogonal coordinates (X, Y, Z) composed of the coordinates (X, Y) and a Z coordinate perpendicular to the coordinates (X, Y) on the surface plate, mounting a planar material as an object to be measured on the surface plate, and virtually configuring a plane ABCD that is parallel to the XY plane: a system for setting the distance (height) from the coordinates (Xm! Yn) of the virtual plane ABCD to the plate thickness center plane composed of midpoints of segments connecting an upper surface and a lower surface of the planar material as the object to be measured as Z(m,n), measuring Z(m,n) across the entire area of the planar material to be measured for m distances (heights) in the X direcnon and n distances (heights) in the Y direction while changing the coordinates (X, Y), and storing the measured data in a storage apparatus of a computer; a. system 10

Full Text

FORM 2
THE PATENTS ACT 1970
(39 of 1970)
&
The Patents Rules, 2003
COMPLETE SPECIFICATION
(See section 10 and rule 13)
1. "METHOD FOR DETERMINING MACHINING PLANE OF PLANAR MATERIAL, MACHINING METHOD AND DEVICE FOR DETERMINING MACHINING PLANE AND FLAT SURFACE MACHINING DEVICE"
2.
1. (A) NIPPON MINING & METALS CO., LTD.
(B) A Company incorporated under the Laws of Japan
(C) 10-1, Toranomon 2-chome, Minato-ku, Tokyo, 1050001 Japan

The following specification particularly describes the invention and the manner in which it is to be performed.

TECHNICAL FIELD
The present invention relates to a method for determining a work surface of a planar materia) in a surface treatment for obtaining a flat plate of a uniform thickness from a planar material, as well as to a machining method of such a work surface, a device for determining the foregoing work surface, and a flattening device.
BACKGROUND ART
A ceramic sintered plate such as a sputtering target or a metal plate prepared by metal rolling or forging, in most oases, is subject to be deformed by thermal stress or machining stress during the manufacturing process. Also the thickness is not uniform in some parts. In rrder to obtain a flat planar material of a uniform thickness from a planar material with such three-dimensions! deformation, machining such as cutting, grinding, and electrical discharging is performed.
Conventionally, a material with this kind of deformation was subject to the. foregoing orocesses by an operator setting such materia! duactly on a processing machine, or the operator would roughly measure the deformation of the individual planar materials in advance with a straight end or the like, and insert a spacer during the stage of setting such materials in the processing
2-

machine in order to maintain flatness. Nevertheless, the current status is that the foregoing methods are conducted based on the operator's instincts.
For instance, when grinding a material based on the operator's instincts, even if the operator is an expert, he/she will need to perform such grinding more than necessary in order to obtain a plane. This is because it will not be possible to maintain the accuracy of flatness or uniform thickness without excessive grinding by the operator. Therefore, it was necessary to set the machining cost of the material itself higher, and this led to deterioration in the yield. in addition, this inevitably ied tc increased operation time of the processing machine.
As conventional technology, there are. an apparatus to measure preciseiy the thickness of respective warped planar works (for instance, refer to Patent Document 1), a device to measure a warped planar works comprising a measurement reference unit, a measurement unit, a displacement measurement unit for converting into electrical signals, a warp measure display unit, and a control unit (for instance, refer to Patent Document 2), a manufacturing method of a ceramic product comprising the steps of pressurizing and molding ceramic material powder, irradiating a light beam on the surface thereof, and measuring the surface status upon receiving the reflected light (for instance, refer to Patent Document 3), a size measurement ceramic gauge provided with a stepwise portion (for instance, refer to Patent Document 4), a plate flatness measuring device comprising a downward measuring unit for measuring the flatness, a plate support pin, a vertical motion actuator, and a pressure regulation unit (for instance, refer to Patent Document 5), and a method for measuring the shape irregularity of a ceramic substrate using infrared thermography (for instance, refer to Patent Document 6).
Nevertheless, the foregoing conventional technologies are methods or devices for measuring flatness, measuring displacement or measuring shape
3

irregularities, and do not provide the concept of improving the yield upon
performing surface-machining such as cutting, grinding, and electrical
discharging.
[Patent Document 1] Japanese Patent Laid-Open Publication No. H6-66549
[Patent Document 2] Japanese Examined Patent Application Publication Nc.
S59-36202
[Patent Document 3] Japanese Patent Laid-open Publication No. $63-173607
[Patent Document 4] Japanese Patent Laid-Open Publication No. H7-128002
[Patent Document 5] Japanese Patent No. 3418819
[Patent Document 6] Japanese Patent No. 3183935
DISCLOSURE OF THE INVENTION
As described above, a ceramic sintered plate such as a sputtering target or a metai plate prepared by metal rolling or forging, in most instances, is subject to two- or three-dimensional deformation and/or variation in the plate thickness as a result of thermal stress or machining stress during the manufacturing process. Thus, an object of the present invention is to provide a method and a device for determining a work surface of a planar material in a surface treatment for obtaining a flat planar material of a uniform thickness and minima! machining cost from a pjanar materia! with two- or three-dimension deformation and/or having variatidn in the piate thickness.
fn order to achieve the foregoing object, as a result of intense study, the present inventors discovered that it is possible to obtain a flat planar material of a uniform thickness with a favorable yield, as a first method, by seeking a plane composed from a center point in the thickness direction based on data obtained by measuring the distance (heighi:) from the respective reference planes of the upper and lower surfaces of the planar material, measuring the distance (height)
4

from the reference plane up to the plane composed from the center points by changing the relative positional relation (tilting) of the planar material and the reference plane within a certain definite range, and performing suriace

treatment by adjusting the tilting of the planar material so that the difference between the maximum and minimum value of the obtained height data becomes minimum.
Based on the foregoing discovery, the present invention provides:
1) A method of determining a work surface of a planar material for cutting a
plate of a uniform thickness from a planar material, comprising the steps a
setting, with a surface plate of a measuring device as coordinates (X, V):
orthogonal coordinates (X, V, Z) composed of the coordinates (X; Y) and e 7
coordinate perpendicular to the coordinates {X, Y) on the surface plate, and
mounting a planar material as an object to he measured on the surface plate;
virtually configuring a plane ABCD that is parallel to the XY plane; setting the
distance (height) from the coordinates (Xm, Yn) of the virtual plane ABCD to the
plate thickness center plane composed of midpoints of segments connecting an
upper surface and a lower surface of the planar materia! as the object to he
measured as Z(mi n)3 measuring Z(m,n) across the entire area of the planar
material to be measured for m distances (heights) in the X direction and n
distances (heights) in the Y direction while changing the coordinates (X, Y)r and
storing the measured data in a storage apparatus of a computer; seeking s
maximum and minimum value of Z(m,n) for all coordinate points and calculating
the difference thereof, and setting the obtained value as difference H {0.0, 0.0)
when the measured value is not manipulated in any way; subsequently fixing
end A of the virtual plane ABCD and respectively moving end B and end C
vertically at a prescribed deflection width B, C regarding a predetermined
maximum deflection width and pitch in the Z-axis direction so as to till the virtual
plane ABCD against the surface plate on the computer; calculating the distance
5

(height) Z(m,n)(B,C) from all coordinate points (Xm, Yn) on the virtual plane ABCD to the plate thickness center plane of the coordinate points corresponding to the planar material each time the tilt is changed, and seeking the maximum and minimum value of Z(m,n)(B,C) and calculating the difference H (B, C) thereof; and repeating the calculation for all predetermined B and C combinations, and determining the virtual plane ABCD with the smallest value of H (B, -C) calculated in all B and 0 combinations as a plane that is parallel to a plane of minimum machining cost. This is one of the core inventions of the present application.
As a second method, the present invention provides: 2) A method of determining a work surface of a planar material for cutting a plate of a uniform thickness from a planar materia), comprising the steps of setting, with a surface plate of a measuring device as coordinates (X, Y) orthogonal coordinates (X, Y, Z) composed of the coordinates (X, Y) and a Z coordinate perpendicular to the coordinates (X, Y) on the surface plate, ard mounting a planar material as an object to be measured on the surface plate; virtually configuring a plane ABCD that is parallel to the XY plane; setting the distances (heights) from the coordinates (X, Y) of the virtual plane ABCD to an upper surface and a lower surface of the planar material as the object to be measured as S1(m,n), S2(m,n) respectively, measuring S1(m,n), S2(m,n) across the entire area of the planar material to be measured for m distances (heights) in the X direction and n distances (heights) in the Y direction while changing the. coordinates (X, Y), and storing the measured data in a storage apparatus of a computer; seeking a maximum and minimum value of S(m,n) and S2(m,n) for all coordinate points: and calculatirig the difference thereof, and setting the obtained values as difference H1 (0.0, 0.0) and difference H2(0.0, CO), respectively, when the measured value is not manipulated in any wav; subsequently fixing end A of the virtual plane ABCD and respectively moving
6

end B and end C vertically at a prescribed deflection width B, C regarding a predetermined maximum deflection width and pitch in the Z-axis direction so as to tilt the virtual plane ABCD against the surface plate on the computer; calculating the respective distances (heights) S1(m,n)(B, C), S2(m,n)(B, C) from all coordinate points (Xm, Yn) on the virtual plane ABCD.to the upper surface and the lower surface on the planar material of the coordinate points corresponding to the planar material each time the tilt is changed, and seeking the maximum and minimum value of S1(m,n)(B, C) and S2(m,n)(B,C) and calculating the differences H1(B, C) and H2(B, C) thereof; and repeating the calculation for all predetermined B and C combinations, and determining the virtual plane ABCD with the smallest total value of H1(B, C) and H2CB, G) calculated in all 3 and C combinations as a plane that is parallel to a plane of minimum machining cost. This is another core invention of the present application.
The present invention further provides: 3) The method of determining a work surface of a planar material according to paragraph i) or paragraph 2) above, wherein a distance (height) S1(m,n) between a virtual plane ABCD thst is parallel to a surface plate positioned at Z = h, which is higher than the upper surface of the planar material, and the upoer surface of the planar material and a distance (height) S2(M,N) between a virtual plane ABCD' that is parallel to a surface plate positioned at Z = I, which is lower than the lower surface of the planar material, and the lower surface of the planar materia! are measured so as to obtain a thickness T(m,n) of the planar material calculated from T(m,n)=r-1 S1=-s2(m,n) Although this metned shows a preferred and specific calculation method for obtaining the thickness T (m,n) of the planar material in the invention described in paragraph 1) or 2) above, this does not preclude the usage of other calculation methods.
The present invention further provides:
7-

4) The method of determining a work surface of a planar material according to any one of paragraphs 1) to 3) above, wherein, upon reversing the planar material and mounting it on a surface plate of a processing machine, a point on a plane facing the virtual plane ABCD of the planar material corresponding to the coordinate points in which a value {Z(m,n) - 1/2 T(m,n) obtained by deducting 1/2 of the thickness T,(m,n) of the planar material at the coordinate points (Xm, Yn) from the distance (height) Z(m, n) up to the planar material among the coordinate points (Xm, Yn) of the virtual plane ABCD that is parallel to the minimum machining cost determined according to any one of paragraphs 1} -o 3) above becomes the smallest value {Z(m. n) 1/2 T(m,n)}min is set as a point for coming in contact with the surface plate.
This method shows preferred and specific conditions for reversing the planar materia! and mounting it on a surface piate of a processing machine in the invention described in paragraphs 1) to 3) above. Nevertheless, although this method of setting the planar materia! on the surface plate can be used as a reference upon deciding the final work surface, it does not preclude the usaae of other conditions.
The present invention further provides: 5) The method of determining a work surface of a planar material according to any one of paragraphs 1) to 4) above, wherein, upon reversing the planar material and mounting it on a surface plate of a processing machine, a value sought by deducting a value {Z(m. n) - 1/2T(m,n) which is obtained by subtracting 1/2 of the thickness T(m. n) of the planar material at the coordinate points (Xn, Yn) from the distance (height) Z(m,n) up to the planar material among the coordinate points (Xm. Yn) of the virtual plane ABCD becomes the smallest value. (Z(m,n) - 1/2T(m,n) from the measured value of the distance (height) of four corners of a-plane facing the virtual plane ABCD of the planar material is set as the thickness of a spacer to be inserted into the four corners upon mourning the
8

planar material on the processing machine.
This method shows a preferred and specific calculation method for setting a spacer in the processing machine in the invention described in paragraphs i) to 4) above. Although this spacer plays an important role in determining the machining cost of the planar material, this does not preclude the usage.of other calculation methods.
The present invention further provides:
6) The method of determining a work surface of a planar material according-to any one of paragraphs 1).to 5) above, wherein the distance (height) of the 2 direction is measured at positions in intervals or 20 mm or less ;n both the X direction and Y direction of the coordinate axis of the planar material;
7) The method of determining a work surface of a planar materia! according to any one of paragraphs 1) to 6) above, wherein the distance (height) from the planar material is measured with a laser distance sensor or a contact distancs sensor; and
8) The method of determining a work surface of a planar material according to any one ot paragraphs 1) to 7) above, wherein the tilt of a biaxial tift machining table of an NC-controllable processing machine is adjusted in order to set the work surface of the planar materia! to a prescribed position in relation to the surface plate based on the data. These conditions show preferable and
; additional conditions.
The present invention further provides:
9) A machining method of determining a work surface of a planar material based on a method according to any one of paragraphs 1) to 8) above, and, based thereon, performing a machining process such as cutting work, Grinding process and electrical discharging in order to cut out a plate having a uniform thickness from a planar material;
10) A machining method of determining s work surface of a planar material
9

based on a method according to any one of paragraphs 1) to 8) above, and based thereon, grinding one surface of "the planar material, subsequenty reversing the planar material and mounting it on a surface plate, and processing the rear surface; and
11) A machining method of fixing a planar material on a surface plate of a
processing machine doubling as a measuring device by way of adhesive,
bonding or electromagnetic adsorption or the like, determining the optimal; tiltin
conditions based on the measurements performed with the method according to
any one of paragraphs 1) to 7) above, subsequently using the biaxial ti't
mechanism of the surface plate of the processing machine so as to tile the
surface piate to be parallel to the plane obtained with the optimal tilting
conditions1 and machining the planar material in such a state without reversing
the material. These conditions snow preferable and additional conditions.
The present invention further provides:
12) A device of determining a work surface of a planar material] for cutting a
plate of a uniform thickness from a planar material, comprising a system for
setting, with a surface plate of a measuring device as coordinates (X, Y),
orthogonal coordinates (X, Y, Z) composed of the coordinates (X, Y) and a Z
coordinate perpendicular to the coordinates (X, Y) on the surface plate,
mounting a planar material as an object to be measured on the surface plate,
and virtually configuring a plane ABCD that is parallel to the XY plane: a system
for setting the distance (height) from the coordinates (Xm! Yn) of the virtual plane
ABCD to the plate thickness center plane composed of midpoints of segments
connecting an upper surface and a lower surface of the planar material as the
object to be measured as Z(m,n), measuring Z(m,n) across the entire area of the
planar material to be measured for m distances (heights) in the X direcnon and
n distances (heights) in the Y direction while changing the coordinates (X, Y),
and storing the measured data in a storage apparatus of a computer; a. system
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METHOD AND DEVICE FOR DETERMINING MACHINING SURFACE OF PLANAR MATERIAL AND FLAT SURFACE MACHINING DEVICE

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