| Title of Invention | A METHOD OF FORMING A PRINTED CIRCUIT BOARD AND A PRINTED CIRCUIT BOARD THEREOF. |
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| Abstract | A printed circuit board and a design method thereof are disclosed. The design method includes: wiring signal lines on an area basis at inner layers adjacent to outer surface layers; arranging the ouster surface layers with no wiring or few wirings and interconnecting the outer surface layers through vias, so that the outer surface layers function as a primary ground; and setting parameters of a line width and a layer height to control a target impedance value. The printed circuit board includes outer surface layers and two inner layers therebetween. The inner layers adjacent to the outer surface layers are used for arranging signal lines ion an area basis; and the outer surface layers are arranged with no wiring or few wirings and are interconnected as a primary ground through vias. The invention also discloses a mainboard of a terminal product using the printed circuit board. |
| Full Text | The present invention relates to Printed Circuit Board (PCB) technologies, and particularly to a multi-layer printed circuit board and a design method thereof. The inventions ............. |
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570-MUM-2008 CORRESPONDENCE (14-9-2009).pdf
570-MUM-2008 FORM 3 (14-9-2009).pdf
570-mum-2008-abstract(21-3-2008).pdf
570-MUM-2008-ABSTRACT(5-7-2012).pdf
570-MUM-2008-CHINA DOCUMENT(12-4-2012).pdf
570-mum-2008-claims(21-3-2008).pdf
570-MUM-2008-CLAIMS(AMENDED)-(14-9-2012).pdf
570-MUM-2008-CLAIMS(AMENDED)-(5-7-2012).pdf
570-MUM-2008-CLAIMS(MARKED COPY)-(14-9-2012).pdf
570-MUM-2008-CLAIMS(MARKED COPY)-(5-7-2012).pdf
570-MUM-2008-CORRESPONDENCE 13-6-2008.pdf
570-MUM-2008-CORRESPONDENCE(12-4-2012).pdf
570-MUM-2008-CORRESPONDENCE(12-9-2012).pdf
570-mum-2008-correspondence(13-6-2008).pdf
570-MUM-2008-CORRESPONDENCE(13-9-2012).pdf
570-MUM-2008-CORRESPONDENCE(17-4-2009).pdf
570-MUM-2008-CORRESPONDENCE(18-4-2012).pdf
570-MUM-2008-CORRESPONDENCE(22-6-2011).pdf
570-MUM-2008-CORRESPONDENCE(4-9-2012).pdf
570-mum-2008-description(complete)-(21-3-2008).pdf
570-MUM-2008-DRAWING(14-9-2012).pdf
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570-MUM-2008-DRAWING(5-7-2012).pdf
570-MUM-2008-ENGLISH TRANSLATION(18-4-2012).pdf
570-MUM-2008-EP DOCUMENT(12-4-2012).pdf
570-MUM-2008-FORM 1 13-6-2008.pdf
570-mum-2008-form 1(13-6-2008).pdf
570-mum-2008-form 1(21-3-2008).pdf
570-MUM-2008-FORM 1(4-9-2012).pdf
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570-MUM-2008-FORM 13(4-9-2012).pdf
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570-mum-2008-form 2(21-3-2008).pdf
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570-MUM-2008-FORM 26(13-9-2012).pdf
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570-MUM-2008-OTHER DOCUMENT(17-4-2009).pdf
570-MUM-2008-PETITION UNDER RULE 137(14-9-2012).pdf
570-MUM-2008-PETITION UNDER RULE 137(5-7-2012).pdf
570-mum-2008-power of attorney(5-6-2008).pdf
570-MUM-2008-REPLY TO EXAMINATION REPORT(14-9-2012).pdf
570-MUM-2008-REPLY TO EXAMINATION REPORT(5-7-2012).pdf
570-MUM-2008-US DOCUMENT(12-4-2012).pdf
| Patent Number | 258153 | ||||||||||||
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| Indian Patent Application Number | 570/MUM/2008 | ||||||||||||
| PG Journal Number | 50/2013 | ||||||||||||
| Publication Date | 13-Dec-2013 | ||||||||||||
| Grant Date | 10-Dec-2013 | ||||||||||||
| Date of Filing | 21-Mar-2008 | ||||||||||||
| Name of Patentee | HUAWEI TECHNOLOGIES CO., LTD. | ||||||||||||
| Applicant Address | HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, GUANGDONG PROVINCES 518129, P. R. CHINA | ||||||||||||
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| PCT International Classification Number | G02B6/10; H05K1/02 | ||||||||||||
| PCT International Application Number | N/A | ||||||||||||
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