Title of Invention	SILICON BASED CONDENSER MICROPHONE AND METHOD FOR PACKAGING THE SAME
Abstract	Disclosed are a silicon based condenser microphone and a packaging method for the silicon based condenser microphone. The silicon based condenser microphone comprises a metal case, and a board which is mounted with a MEMS microphone chip and an ASIC chip having a electric voltage pump and a buffer IC and is formed with a connecting pattern for bonding with the metal case,wherein the connecting pattern is welded to the metal case .The method for packaging a silicon based condenser microphone comprises the steps of inputting a board which is mounted with a MEMS chip and and ASIC chip and is formed with a connecting pattern; inputting a metal case, aligning the metal case on the connecting pattern of the board and welding an opened end of the metal case to the connecting pattern of the board. Thus the metal case is welded to the board by the laser.

Title of Invention

SILICON BASED CONDENSER MICROPHONE AND METHOD FOR PACKAGING THE SAME

Abstract

Disclosed are a silicon based condenser microphone and a packaging method for the silicon based condenser microphone. The silicon based condenser microphone comprises a metal case, and a board which is mounted with a MEMS microphone chip and an ASIC chip having a electric voltage pump and a buffer IC and is formed with a connecting pattern for bonding with the metal case,wherein the connecting pattern is welded to the metal case .The method for packaging a silicon based condenser microphone comprises the steps of inputting a board which is mounted with a MEMS chip and and ASIC chip and is formed with a connecting pattern; inputting a metal case, aligning the metal case on the connecting pattern of the board and welding an opened end of the metal case to the connecting pattern of the board. Thus the metal case is welded to the board by the laser.

Full Text	[DESCRIPTION] [Technical Field] The present invention 1elates, to a condenser miciophonc, and, more particularly, to a silicon based condenser microphone which packages a silicon miciophone chip fabricated by a MEMS technology to increase a mechanical firmness and enhance effects for preventing noise from enlenng the microphone and a packaging method foi the silicon based condenser miciophone. [Background Art] Generally, a condenser microphone which has been widely used in a mobile equipment or an audio equipment consists of a voltage bias element, a pan of a diaphragm and aback pate loi forming a capacitor which is changed couesponding to sound piessure, and a JFET foi buffering an output signal This typical condenser microphone has an assembly which is integrally assembled by inserting a diaphragm, a spacer ring, an insulating ung, a back plate, a conductive nng and a PCB into a case. Meanwhile, recently, a semiconductor fabricating technology using a micromachining technology has been introduced for an integrated micro device 2 According to this technology which is called MEMS (MICIO Electio Mechanical System), a sensoi, an actuator arid an electro mechanical stnictiue can be fabricated in a ?m unit using a micromachining technology which applies a semiconductoi fabiicating process, especially, an nuegiated ciicuil technology A MEMS chip microphone nidnufaclined by the- miciomachining technology has mcnls that miniaturization, high-pcifoimance, multifunction and integration can be obtained through the high picase micromachining technology and safety and icliubility can be enhanced. However, since the MEMS chip microphone manufactured by the miciomachmmg technology should perform electrical driving and signal piocessmg, it is rcquned to package the miciophone with another special purpose semiconducloi chip device, that is, an ASIC (Application Specific lntegiated Circuit) A conventional technology for packaging a MEMS chip microphone is disclosed in US Patent No. 6,781,231 which is published in August 25, 2004 and entitled by "Micio Electro Mechanical System Package with Envuonmental and Interieiencc Shield" The above package has a structuie for adhenng a cover which consists of an internal conductive layer and an external conductive layer on a multi-laycied substiatc which is alternately over lapped by a conductive layer and a non conductive layer using a conductive adhesive 2A Thus, the conventional packaging method has pioblems in that a manufacturing cost is raised and a bonding property is detenoiated due to a complex piocess, and it is sensitive to an external noise such as an electromagnetic wave noise and the like since a non conductive matcrud unlike a metal housing is used [Disclosure] [Technical Problem] Accordingly, in order to solve the problems, an object of the present invention is to provide a silicon based condensei microphone for inccasing bonding strength and having high resistance to external noise such as electiomugnelic waves by welding an opened end of a metal case to a substrate which is mounted with MEMS microphone parts and a packaging method foi the silicon based condensei microphone [Technical Solution] According to an aspect of the piesent invention, than is piovidcd a silicon based condenser microphone compnsing: a metal case; and a board which is mounted with a MEMS microphone chip and an ASIC chip having a electric voltage pump and a buffer IC and is formed with a connecting pattern for bonding with the metal case, the connecting pattern being welded to the metal case. Further, accoiding to another aspect of the piesenl invention, there is piovided a method for packaging a silicon based condensei microphone, the method comprising 3 the steps of: inputting a board which is mounted with a MEMS chip and an ASIC chip and is formed with a connecting pattern, inputting a metal case; aligning (he metal case on the connecting pattern of the board, and welding an opened end of the metal case to the connecting pattern of the board Here, the metal case may have any one of a cylindrical shape and a icclangular paiallclepiped shape. Further, an opened end of the metal case may have any one of a straight line shape and a skirt shape which is formed by bending the opened end outwaidly Further, the board may be any one selected from the group of a PCB, a ccianuc board, a FPCB and a metal PCB The metal case may be made of any one selected from the group of brass, aluminum and nickel alloy. Further, the welding may be any one selected from the group of laser welding, electric welding, soldering, and bonding using a conductive adhesive Further, the boaid may be formed with two to eight connecting terminals for connecting with an external device. The board may be fanned with a lear sound inlet hole for collecting a lear sound, whereby the microphone has duecuvity. 4 [Description of Drawings The above and other objects and featuies of the invention will become appaient from the following desciiption of pieferred embodiments taken in conjunction with the accompanying drawings in which: Fig 1 is a sectional .side view of a first modification of a fusl embodiment according to the present invention; Fig 2 is an exploded perspective view of a first modification of a lust embodiment according to the pieseni invention, Fig. 3 is a view showing an example of a structuie tor a MEMS chip of a silicon based condenser microphone applied to each embodiment of the present invention in common; Fig. 4 is a circuit diagram of a silicon based condensci microphone applied to each embodiment of the present invention in common, Fig. 5 is a flow chait showing a packaging piocess of a silicon based condenser microphone according to the present invention; Fig. 6 is an exploded peispective view of a second modification of a fust embodiment accoidmg to the present invention; Fig. 7 is an exploded perspective view of a thud modification oi a first embodiment according to the preseni invention, 5 Fig. 8 is an exploded pcispcclive view of a fouilh modification of a lust embodiment accoiding to the present invention, Fig 9 is a sectional side view of a fifth modification of a lust embodiment accoiding to the piesent invention; Fig 10 is a sectional side view of a first modification of a second embodiment accoiding to the piesent invention, Fig. 11 is a sectional side view ol" mounting example of microphone of fig 10; Fig 12 is an exploded peispective view of a first modification of a second embodiment accoiding to the presenl invention; Fig. 13 is an exploded perspective view of a second modification of a second embodiment accoiding to the present invention, Fig. 14 is an exploded perspective view of a thud modification of a second embodiment accoiding to the present invention, Fig. 15 is an exploded perspective view of a fouith modification of a second embodiment accoiding to the present invention, Fig 16 is a sectional side view of a fifth modification of a second embodiment according to the piesent invention, Fig. 17 is a sectional side view of a sixth modification of a second embodiment according to the present invention, 6 Fig. 18 is a peisjicctive view of a lirst modification oi a Ihnd embodiment accoidmg to the present invention, Fig. 19 is a sectional side view oi" mounting a silicon based condcnsei microphone accoidmg to a third embodiment of the present invention, Fig. 20 is a sectional side view showing that a silicon based condense! miciophone according lo a thud embodiment according to the picsent invention is mounted; Fig. 21 is a perspective view ol a second modification of a third embodiment according to the piesent invention, Fig. 22 is a sectional side view of a third modification of a ihnd embodiment according to the present invention; and Fig 23 is a sectional side view of a fourth modification of a third embodiment accoidmg to the present invention [Best Mode] Heremaftei, prefened embodiments of the piesent invention will be explained in detail with reference to the appended drawings A fiist embodiment is example wherein a case is foinicd with a sound hole loi collecting sound and a number of modifications of the fust embodiment will be shown m ordei. A second embodiment is example wherein a miciophone boaid is formed 7 wilh a sound hole foi collecting sound and a number of modifications of the second embodiment will be shown in orclei. A thud embodiment is example whciein u microphone board is foimed with a sound hole and an mseiling hole is louned with a main PCB and a number of modifications of the first embodiment will be -shown in order. [Embodiment Ij [Modification 1 of embodiment IJ Fig. 1 is a sectional side view of a fust modification of a first embodiment according to the piesenl invention, Fig. 2 is an exploded perspective view of a lust modification of a fust embodiment accoiding to the piesent invention, Fig 3 is a view showing an example oi a stmclurc foi a MEMS chip of a silicon based condenser microphone applied to each embodiment of the present invention in common, and Fig 4 is a circuit diagiam of a silicon based condenser miciophonc accoiding to the piesenl invention. Accoiding to a firsi modification oi a first embodiment, as shown in Figs 1 and 2, a cylindrical metal case 110 is welded IO a PCB 120 which is mounted with a MEMS chip 10 and an ASIC chip 20 by a lasei Referring to Figs. 1 and 2, the PCB 120 is mounted with the MEMS chip 10 and 8 the ASIC chip 20 and i", formed with a cncular connecting pattern 121 on a poition which contacts the mettl case 110. Meanwhile, it necessary, the PCB 120 may be mounted with a capacity oi a lesistor, which is not shown in the drawings, ioi shielding electiomagnetic waves orESD Since the PCB 120 is broader than the metal case 110, connecting pads or connecting terminals foi connecting with an external device can be freely disposed on the bioad PCB The connecting pattern 121 is fomied by forming a coppci clad through a PCB manufacturing process and then plating Ni or Au Here, the boaid 120 may be a PCB, a ceiamic board, a FPCB or a metal PCB. The metal case 110 has a cylindrical shape having an opening which faces the PCB 120 to receive die chip paits theiem, wherein an uppci surface thcicof is foimcd with a sound hole 110a foi collecting sound The metal case 110 is made of any one selected from the group of brass, copper, stainless steel, aluminum, nickel alloy and the like. Furthei, the metal case 110 is plated with Au or Ag. The metal case 110 may have various shapes such as a circle, a ^quaie and the like After aligning the .metal case 110 on the connecting pattern 121 of the PCB 120, a connecting portion 130 thereof is welded by a lasei (not shown), theieby finishing a miciophone package Heie, the connecting pattern 121 is connected wjth a ground terminal 125, wheiem, if the metal case 110 is welded to the connecting pattern 121, 9 there is a ment in that it is easy to eliminate noise by inteiiuptmg the inflow of external noise. As such, accoiding to the packaged miciophone assembly, as shown in Fig I, the metal case J l'O is firmly adhered to the connecting pattern 121 of the PCB 120 by the laser welding, wheiein a space 150 between the metal case 1 10 and the PCB 120 serves as a sound chamber Furthei, the PCB 120 may be formed with connecting terminals 123 and 125 for connecting with the external device on a bottom surface thcicof, wherein the numbci of the connecting terminals 123 and 125 is two to eight. Each of the connecting terminals 123 and 125 is electrically connected through thiough-holc 124 to a chip part surface. Specially, accoiding to the embodiment of the present invention, if extending the connecting terminals 123 and 125 to a cncumfeicnce of the PCB 120, an electric soldering non L> appioached through an exposed suirace, whereby a lewoik opeiation can be easily perfoimed The MEMS chip 10, as shown in Fig. 3, has a sUucluie that a back plate 13 is foimed on a silicon wafer 14 by using a MEMS technology and then the back plate faces a vibration membiane 11 with a spacer 12 interposed between the back plate 13 and the vibiation membiane 11. Since Hie MEMS chip 10 ib applied to each embodiment of the present invention m common and this fabucating technology of the 10 MEMS chip 10 has been opened, the further explanation will be omitted The ASIC chip 20 which is connected with the MEMS chip 10 to pioccss electrical signals., as shown m Fig. 4, consists of an electric voltage pump 22 foi supplying an electnc pressure to allow the MEMS chip 10 to operate as a condensci microphone, and a buffer 1C 24 foi amplifying an electric sound signal sensed through the MEMS chip 10 or performing impendence matching ol the sensed electnc sound signal, thereby supplying the processed signal truough the connecting terminal to the outside. Here, the electric voltage pump 22 may be a DC-DC convener, and the buffei IC 24 may be an analogue amplifier oi ADC. Referring to Fig 4, a condenser symbol "CO" indicates an electrical equilibrium circuit foi the MEMS chip 10. Heie, the MEMS rmctophone package is connected with (he external device through thiee connecting terminals (Vdd, GND, Output) The circuit diagram of fig. 4 is applied to each embodiment m common. According to the first embodiment of the piesent invention, the case i 10 and the PCB 120 aie welded by a lasei, but they may be bonded by anothci means such as electric welding, soldenug, conductive adhesive and the like [Packaging method] Fig 5 is a flow chart showing a packaging piocess oi a silicon based condenser 11 miciophone accoiding lo the piesent invention A method for packaging a silicon based condenser miciophone accoiding to the present invention, as shown m Fig. 5, includes the steps of inputting a boaid (SI), mounting a MEMS pari and an ASIC chip on the board (S2), inputting a metal case (S3), aligning ihe case on a connecting pattern of the board (S4), and welding an opened end of the case to the connecting pattern of the boaid (S5) Heie, the board m.iy be a PCB, a ceramic boaid, a FPCB or a metal PCB. The board is formed with ihe connecting pattern for connecting with the metal case. Meanwhile, although thuie is not shown in the drawing, the PCB 120 may be mounted with a capacity 01 a lesiUorfoi shielding electiomagnclic waves 01 ESD. The metal case is made of any one selected from the gioup of brass, coppei, stainless steel, aluminum, nicke! alloy and the like Furthei, the metal case is plated with Au or Ag The metal case may have various shapes such as a cucle, a squaie and the like. Furthei, m the step 5 (S5), the welding operation is perfoimed by laser welding, but it may be substituted with electric welding, soldenng oi bonding using a conductive cpoxy adhesive According lo the packaging method of the piesent invention, the metal case is welded to the board by Ihe laser, wheieby a bonding force (that is, an electrical boding 12 force and a sealing performance) is strengthened As a lesull, a sound quality is enhanced, and the microphone has a high-resistance Lo noise from the outside Specially, a process expense is saved, thereby shaiply cutting a total manulactuiing cost [Modification 2 of embodiment 1] Fig. 6 is an exploded perspective view of a second modification of a first embodiment according to the piesent invention, wherein a leclangular parallelepiped shaped metal case 210 it. welded to a PCB 220 by a laser. Referring to Fig. , the PCB 220 is mounted with the MEMS chip 10 and the ASIC chip 20 and is formed with a lectangular connecting pattern 221 on a portion which contacts the metal case 210. The connecting pattern 221 is made of a coppei clad film through a genetal PCB pattern forming technology The metal case 210 has a rectangular parallelepiped shape having an opening which faces the PCB 2 10, wherein an uppei surface thereof" is formed with a sound hole 210a for collecting sound. After aligning the metal case 210 on the connecting pattern 221 ol the PCB 220, a connecting portion iherebelween is welded by a laser (not shown), whereby miciophone packaging JS finished Heie, the connecting pattern 221 is connected with 13 a ground terminal, wheiein, if the metal case 210 is welded to the connecting pattern 221, thcie is a merit in that it is easy to eliminate noise by shutting out noise from the outside. Since a M15MS chip of the miciophone assembly which is packaged us described above has the same structure as the MEMS chip shown in Fig. 3, the furthei explanation will be omitted to avoid a lepetition [Modification 3 of embodiment 1J Fig 7 JS an exp'oded perspective view of a thud modification of a first embodiment according lo the piesent invention, wherein a cylindrical metal case 110 which is formed with a :.knt 116 piojccted in a shape of "i—" fiom an opened end oL the case is welded to a PCB 120 by a laser Referring lo Fig. 7, the PCB 120 is mounted with the MEMS chip JO and the ASIC chip 20 and is foimed with a circuhu connecting pattern 121 on a poition which contacts the metal case 110'. Since the PCB 120 is broadei than the metal case 110, connecting pads oi connecting terminals foi connecting with an external device can be fieely disposed on the broad PCB. Preferably, the connecting pattern is formed by forming a copper clad through a PCB manufactuiing process and then plating the copper clad with Ni OJ AU. Picfeiably, the width of the connecting pattern 121 14 accoiding to the thud modification is wider than that of the connecting pattern of the first modification to conespond to the skirt 116 of the metal case The metal case 110' has a cylindncal shape having an opening which faces the PCB J20, wheiem an uppei surface thereof is formed with a sound hole 110a foi collecting sound A case body 114 is foimed with the skirt 1 !6 piojcctcd outwaidly on the opened end Iheieof Aftei aligning [he :¦ fart 116 of the metal case 110' on the connecting pattern 121 of the PCB, a connecting portion therebetween is welded by a laser (not shown), whereby miciophone packaging is finished [Modification 4 of embodiment 11 Fig. 8 is an exploded perspective view of a fouith modification of a first embodiment according io the piesent invention, wherein a lectangular parallelepiped shaped metal case 210 which is formed with a skirt 216 piojected in a shape of ">—" fiom an opened end of the case is welded to a PCB 220 by a laser Refeinng to Fig. 8, the PCB 220 is mounted with the MEMS chip 10 and the ASIC chip 20 and is formed with a lectangular connecting pattern 221 on a poition which contacts the metal case 2JO' Since the PCB 220 is broader than the metal case 210' conned ing pads oi connecting terminals for connecting with an external device 15 can be freely disposed on the broad PCB. Prefetably, the connecting pattern 221 is formed by forming a coppei clad through a PCB manufacturing piocess and then plating the copper clad with Ni or Au Preferably, the width ol the connecting pattern 221 ace01 ding to fourth modification of a lust embodiment is wider than that of the connecting pattern of the second embodiment to conespond to the sknt 216 of a body 214 of the metal case 210' The metal case 230' has a rectangular parallelepiped shape having an opening which faces the PCB 220, wheiem an upper surface theieof is formed with a sound hole 210a foi collecting sound. The case body 214 is foimed with the skirt 216 piojecled outwardly on the opened end theieof. Aftei aligning the skirt 216 of the metal case on the connecting pattern 221 of the PCB, a connecting portion therebetween is welded by a lasci (not shown), wheieby miciophonc packaging i\ finished. [Modification 5 of embodiment 1J Fig 9 is a sectional side view of a fifth modification of a first embodiment accoidmg to the present invention. Accoiding to the fifth modification of a first embodiment ol the piesent invention, piovided is a structure having directivity by forming a front sound inlet hole i 10a on a 16 portion of the metal case 110 which coiresponds to a portion wheic ihe MEMS chip 10 is positioned m the first embodiment to the fourth embodiment and teaming a leai sound inlet hole 120a which is. formed on a portion of the PCB wheie the MEMS chip 10 is jnountcd and then adding a sound lesistor 140 to the inside and outside of the front sound inlet hole 110a or the inside of the rear sound inicl hole 120a According to the packaged directional microphone assembly, as shown in Fig 9, the metal case 110 is firmly adheied lo the connecting pattern 121 of the PCB 120 which is mounted with the MEMS chip 10 and the ASIC chip 20 by husci welding, wherein a space 150 between the melal case 110 and the PCB 120 is scived as a sound chamber. The metal case 110 is formed with the front sound inlet hole 110a for collecting front sound on a portion theieof conesponding to a position of the MEMS chip 10, and the PCB 120 is foimed with a lear sound inlet hole 120a for collecting tear sound at a portion thereof conesponding to a portion where the MEMS chip 10 is mounted. The sound lesistor 140 is attached to the inside of the front sound inlet hole 110a Fuithei, the PCB 120 may be toimed with connecting teiminals 123 and 125 loi connecting with the external device on a bottom suiface thereof, wherein the number of the connecting terminals 123 and 125 may be two to eight Each of the connecting terminals 123 and 125 is electrically connected thiough a thtough-hole 124 to a chip 17 part surface of the PCB Specially, according to the embodiment of the piesent invention, if extending the connecting teiminals 123 and 125 lo a circumieience of the PCB 120, an electiic soldering iron is approached to an exposed surface of the terminal, whereby a revvoik operation can be easily peiformed. According to the fifth modification of a first embodiment, the sound lesistor 140 is positioned at the inside of the front sound inlet hole 110a, but it may be positioned at the outside of the fiont sound inlet hole 110a or the inside oi the outside of Ihe leai sound inlet hole 120a. According to this structure of the fifth modification of a first embodiment, sound collected thiough the front sound iniet hole 110a or the icar sound mlet hole 120a passes through the sound resistoi 140 and then its pha&c is changed, thereby obtaining diiectivity. [Embodiment 2J [Modification 1 of embodiment 2] Fig 10 is a sectional side view of a first modification of a second embodiment according to the piesent invention, Fig. 11 is a sectional side view showing thai a miciophone shown in Fig 10 is mounted on a main PCB, and Fig 12 is an exploded perspective view of a fust modification of a second embodiment according to the present invention. 18 Accoiding to a first modification of a. second embodiment accoiding to the present invention, as shown in Figs. JO and 12, there is piovided an example that a cylindrical metal case 1 [0 is welded to a PCB 120 which is mounted with a MEMS chip 10 and an ASIC chip 20 by a lasei Relernng to Figs 10 and 12, the PCB 320 is formed with a sound hole 120a lor collecting an external sound near the center thereof and is mounted with the MEMS chip 10 and the ASIC chip 20 mound the center thereof Funhci, the PCB is formed with a circuUu connecting pattern 121 on its portion which contacts the metal case 110. Meanwhile, if necessary, the board may be mounted with a capacity oi a icsislor, which is not shown in the drawing, for shielding electiomagnedc waves oi ESD Since the PCB l?,0 is broadei than the metal case 110, connecting pads or connecting terminals foi connecting with an external device can be liccly disposed on the bioad PCB The connecting pattern 121 is foimed by forming a copper clad through a general PCB manufacturing piocess and then plating the copper clad with Ni or Au Here, the board 120 may be a PCB, a ceramic boaid, a FPCB oi a metal PCB. The metal case 110 has a cylindrical shape having an opening which faces the PCB 120 to leceive the chip parts theiein Since the metal case has a strucluie for collecting a sound through the sound hole 120a of the PCB, a bottom surface of the metal case is closed The metal case is made of any one selected from Lhc gioup of 19 brass, coppei, stainless steel, aluminum, nickel alloy and the hke. Fuithci, Ihe metal case may be plated with Au or Ag The metal case may have various shapes such as a cucle, a squaie and the like Alter aligning the metal case 110 on the connecting pattern 121 ol the PCB 120, a connecting portion therebetween is welded by a laser (not shown), theieby finishing a miciophone package. Here, the connecting pattern 121 is connected with a ground terminal 125, wherein, if the metal case 1 10 is welded to the connecting pattern 121, mere is a merit in that it is easy to eliminate noise by interrupting noise collected from the outside. According to the packaged miciophone assembly, as shown in Fig. 10, the metal case 110 is firmly adhered to the connecting pattern 121 ol the PCB 120 by a laser welding, wherein a space 150 between the metal case 110 and the PCB 120 is served as a sound chamber. Further, the PCB 120 is formed with the sound hole 120a for collecting the external sound, wherein the PCB is formed with a sealing teimmal 120b for sealing the sound hole 120a by soldering aiound the sound hole of a bottom suiface of the PCB 120 10 pievent distoition of a sound wave geneiuted in a space between a main PCB 300 and the microphone Heie, the number of the connecting terminals 123 and 125 foi connecting with the exteinal device may be two to eight. Each of the connecting 20 teiminais 123 and 125 may be electrically connected through through-hole 124 to a chip part suiface of the: PCB 120 Specially, according to Ihe embodiment of the present invention, if extending the connecting teiminais 123 and 125 to a circumfeien.ee of the PCB 120, an electnc soldering iron is appioached to an exposed suiface of the teimmal, whereby a rewoik opeiation can be easily performed An example that the miciophone according to the present invention is mounted on the main PCB 300 is shown m Fig. 1 i. Referring to Fig II, the main PCB 300 wheie the miciophone is mounted is formed with a main sound hole 300a for collecting the external sound, whcicin the mam PCB is formed with a sealing teimmal 302 for sealing the main sound hole 300a by soldering around the mam sound hole theieof to prevent distortion of a sound wave generated in a space between a main PCB 300 and the miciophone. Furthei, the main PCB 300 Is formed with connecting pads 304 corresponding to the connecting teiminais 123 and 125 of the miciophone If connecting the miciophone accoiding to the present invention with the main" PCB 300 by a soldei 310, the external sound is collected thiough the mam sound hole 300a of the mam PCB 300 and then passes thiough an area sealed by the sealing terminal 302. Then, the external sound is collected thiough the sojnd hole 120a of the microphone PCB 120 to the inside of the microphone. 21 According to a fust modification of a second embodiment accoidmg to the piesent invention, the case 110 and the PCB 120 ate welded by a laser, but they may be bonded by anothei means such as electric welding, soldering, udheiing by a conductive adhesive and the like [Modification 2 of embodiment 2] Fig 13 is an exploded perspective view of a second modification of a second embodiment according to the piesent invention, whoiein a icctangular paiallelepiped shaped metal case 210 is, welded to a PCB 220 by a lusei Referring to Fig. V), the PCB 220 is formed with a sound hole 220a for collecting an external sound and ts mounted with the MEMS chip L0 and the ASIC chip 20 around the sound hole 220a Fmthei, the PCB is formed with a icctangular connecting pattern 221 on its portion which contacts the metal case 210. The connecting pattern 221 is foimed of a copper clad fiJm by a general PCB pattern foiming technology Although theie is not shown in the drawing, the PCB is formed with a sealing terminal for sealing the sound hole by soldeiing aiound the sound hole of a bottom surface ol thePCB 220 to pi event distortion of a sound wave geneiated in a .space between the main PCB 300 in Fig 11 and the microphone The metal case 210 has a rectangular parallelepiped shape having an opening 22 which faces the PCB 2lJ.O, wheiem, since the external sound is collected through the sound hole 220a of the l'CB, the bottom surface of the case is closed Alter aligning the netal case 210 on the connecting pattern 221 of the PCB 220, a connecting poition therebetween is welded by a laser (not shown), theieby finishing packaging of the miciophone Heie, the connecting pattern 221 is connected with a gtouncl teinimal, wherein, if the metal case 210 is welded to the connecting pattern 221, theie is a merit m that it is easy to eliminate noise itself by interrupting noise collected from the outside. Since a microphone assembly which is packaged as desci ibed above has. ihe same structure as the assembly shown in Fig 10, the further explanation will be omitted to avoid a repetition [Modification 3 of embodiment 2] Fig. 14 is an exploded perspective view of a third modification of a second embodiment accoiding lo the piesent invention, wherein a cylindrical metal case 1101 which is formed with a iikirt 116 pi ejected in a shape of " -" from an opened end of the case is welded to a PCB 120 by a laser. Referring to Fig. 14, the PCB ,120 is formed with a sound hole 120a for collecting an external sound and is mounted with the MEMS chip 10 and the ASIC chip 20. 23 Fuither, the PCB is formed with a cncular connecting pattern 121 on its portion which contacts the metal case L101 . Although theie is not shown in the drawing, the PCB 120 is formed with a sealing terminal foi sealing the sound hole by soldeung around the sound hole 120a of a bottom surface of the PCB 120 to prevent distortion oi a sound wave geneiated m a space between the mam PCB 300 m Fig 11 and the mitiophonc Since the PCB 120 is broader than the metal case, connecting pads oi connecting terminals for connecting with an external device can be freely disposed on ihc bioad PCB Prefeiably, the connecting pattern is foimed by forming a coppci clad tlnough a gcneial PCB manufactuung piocess and then plating the copper clad with Ni or Au Fuither, prefeiably, the width of the connecting pattern 121 accoidmg to the thud modification is widei than that of ihe connecting pattern of the first modification ol a second embodiment to correspond to the skn t 116 of the metal case. The metal case 110' of third modification of a second embodiment has a cuculai shape having an openm;; which faces the PCB 120, wheiein, since the external sound is collected through the sound hole 120a of the PCB, a bottom surface of the case is closed. Further, a body 114 of the ca,se 110' is formed with the skut 116 projected outwardly on the opened end theieof After aligning the skirt 116 of the metal case 110" on the connecting pattern 121 of the PCB, a connecting portion theiebetween is welded by a lasci (not shown), 24 whereby miciophone packaging is finished. [Modification 4 of embodiment 2] Fig 15 is an exploded perspective view of a fouith modification of a second embodiment according to the piesent invention, whciem a ioctangular parallelepiped shaped metal case 210' which is formed with a skirt 216 piojected m a shape oltL-" fiom an opened end of the case is welded to a PCB 220 by a laser. Referring to Fig. i;>, the PCB 220 is formed with a sound hole 220a for collecting an external sound and is mounted with the MEMS chip 10 and the ASIC chip 20. Further, the PCB is formed with a lectangular connecting pattern 22] on its poition which contacts the metal case 210' Although there is not shown m the drawing, the PCB 220 is ioimed wiih a sealing terminal foi sealing the sound hole by soldering around the sound hole 520a of a bottom suiface of the PCB 220 to pi event distoilion of a sound wave geneiated in a space between the main PCB 300 in Fig 11 and the microphone. Since the FCB 220 is broadei than the metal case 210, connecting pads oi connecting terminals foi connecting with an external device can be freely disposed on the broad PCB. Prefeiahly, the connecting pattern 221 is foimed by forming a coppei clad through a PCB manufacturing process and then plating the coppei clad with Ni or Au Piefeiably, the width of the connecting pattern 221 according to the jourlli 25 modification of a second embodiment is wider than that of the connccimg paUein of the second embodiment to correspond to the skirt 216 of a body 214 of the metal case 210' . The metal case 210' has a shape of a idanguku parallelepiped having an opening which faces tlie PCB 220, wherein, since the external sound is collected through the sound hole 'i20a of the PCB, a bottom surface of the case 210' is closed. Further, a body 214 of the case is formed with the skirt 216 piojected outwaidly on the opened end thereof. After aligning the ;.krrt 216 of the metal case on the connecting pattern 221 of the PCB, a connecting portion therebetween is welded by a lasei (not shown), whereby microphone packaging r; finished. [Modification 5 of embodiment 2] Fig. 16 is a sectional side view of a fifth modification of a second embodiment according to the present invention, wherein a PCB is formed with a sound hole on a portion where a MEMS chip JS positioned. Referring to Fig. [6, the metal case 110 is firmly attached to the connecting pattern 121 of the PCB 120 which is mounted with the MBMS chip 10 and the ASIC chip 20 by laser welding 26 Further, the PCB 120 is formed with the sound hole 120a for collecting an external sound on a position where the MEMS chip 10 is mounted, and is formed with the sealing terminal 120a foi sealing the sound hole 120a by soldenng on the outside oi the sound hole to pie vent distortion of a sound wave in a space between the mam PCB 300 and the nuciophone. Further, the PCB 120 may be formed with the connecting terminals 12 5 and 125 for connecting with the external device on a bottom surface thereof, wherein the number of the connecting terminals 123 and 125 may be two to eight Each of the connecting terminals 123 and 125 is electrically connected through thiough-hole 124 to a chip pait surface of the PCB 120 Specially, according to the embodiment of the piesent invention, if extending me connecting teiminals 123 and 125 to a cncumfeience of the PCB 120, an electric t»oldcnng non is appiouched to an exposed surface of the terminals, whereby a lework operation can be easily peifoimed. Accoidmg to the siructure of the fifth modification of a second embodiment, the external sound collected thiough the sound hole 120a passes thiough the sound hole of the back plate 13 of the MEMS chip 10 and then vibiates the .sound plate 11 to geneiate an electiical signal. Although theic is not shown in the drawing, in ordei to mount the microphone on the main PCB 300, the PCB 300 is formed with a hole conesponding the sound hole 120a and further is formed with a scaling terminal lor 27 sealing the hole by soldunng around the hole of the PCB 300 to prevent distortion of a sound wave generated m a space between the main PCB 300 in Fig 300 and the miciophone. [Modification 6 of embodiment 2] Tig. 17 is a sectional bide view of a sixth modification of a second embodiment according to the present invention In the embodiment of the picsont invention, whiic a sound collected from a J'CB side is called a front sound, a sound collected j mm a ca.se side is called a tear sound Accoiding to the sixth modification of a second embodiment of the present invention, piovided is a structuie having directivity by forming a front sound inlet hole 120a on the portion of the PCB 120 which conesponds to a poition whcie the MEMS chip 10 is mounted in the fifth embodiment and forming a reai sound inlet hole 110a on the portion of the metal case 110 which corresponds to a portion where the MEMS chip 10 is positioned and then adding a sound lesistor 140 to the inside of the fiont sound inlet hole 120a oi the inside and outside of the reai sound inlet hole 110a. Referring to Fig 17, in the packaged directional microphone assembly, the metal case 110 is firmly attached to the connecting pattern of the PCB 120 which is mounted with the MEMS chip 10 and the ASIC chip 20 by laser welding 28 The PCB 120 is formed with the hont bound inlet hole I20a lor collecting front sound on the petition thereof conespondmg to a portion wheie the MEMS chip 10 is mounted. The metal case 110 is loaned with the ieai sound mlct hole 110a for collecting rear sound on the portion thereof conespondmg to a position of the MEMS chip 10. The sound lesistoi 140 is attached to the inside oi (he reai sound inlet hole 110a Furthei, the PC1S 120 is formed with the sealing tcimmal 120a for sealing the sound hole 120a by soldering aiound the outside oi the sound hoic to prevent distortion of a sound wave in a t.pace between the mam PCB 300 and the miciophone. Further, the PCB 120 may be formed with the connecting terminals 123 dud 125 foi connecting with the external device on a bottom surface thereof, wheiein the number of the connecting terminals 123 and 125 may be two to eight Each of the connecting leiminals 123 and 125 may be electrically connected thiough through-hole 124 to a chip pan surface of the VCB 120. According to this structuie of the sixth modification of a second embodiment, the sound collected througl the fiont sound inlet hole 120a or the lear sound inlet hole 110a passes thiough thi sound resistor 140 and then its phase is changed, theteby obtaining duectivity [Embodiment 3J 29 [Modification 1 of embodiment 3] Fig. IS is a perspective view of a first modification of a thud embodiment accoidmg to ttie preset't invention, Fig. 19 is a sectional side view of mounting a silicon based condensei microphone according to a third embodiment of the piescnt invention, and Fig. 20 is a sectional side view showing that a silicon based condensei miciophone accoiding IO a third embodiment accoiding to the present invention is mounted. According lo a silicon based condenser microphone, as shown in Fig. 18, a cylindrical metal case 110 having a bottom surface which is closed is attached to a board 120 which is broadci than the metal case 110, wheiem the board is formed with connecting pads 122-1 to 122-4 1 which aie connected with connecting pads 304-1 lo 304-4 of a main PCB '!00 of a product using the miciophone on a part side 120c thereof. In the embodiment of the present invention, foui connecting teiminals aic provided, but the number is merely an example. That is, two to eight connecting terminals may be piovided. Further, if extending the connecting teiminals 122-1 and 122-4 to a encumference of the PCB 120 ot the reverse side of the pail side, a heal transfei oi an electric noil and the like is impioved, whereby a rework operation can be moie convenient. The mam PCB 300 wheic the silicon based condenser miciophone is mounted, as 30 shown in Fig 18, is fanned with a cuculai mseitmg hole 306 lor mounting the case 110 of the silicon based condenser mictophone and the connecting pads 304-1 to 304-4 corresponding to the connecting terminals 122-1 to 122-4 which is formed on the board 120 of the microphone Then, an example for mounting the silicon based condenser miciophonc on the mam PCB 300 will be explained with reference to Fig 19. Referring to Fig 19, the part side 120c of the microphone board which is fonned with a sound hole 120a for collecting sound from the outside and the connecting teiminals 122-1 to 122-4 and is provided with the metal case 1J0 having the bottom surface which is closed faces the mam PCB 300 and then the case 110 of the microphone is inserted into the hole 306 of the mam PCB 210 Then, the connecting pads 304-1 to 304-4 are connected with the connecting pads 122-1 to 122-4 by a soldering operation. As such, accoiding to a structuie of Fig. 20 showing that the silicon based condensei nnciophone l > mounted on the main PCB 300, the metal case 110 projected from the central portion of the part side 120c of the board is nisei ted the inserting hole 306 of the mam PCB 300 and the connecting pads 304 ol the mam PCB and the connecting terminals 12'i of the microphone aie connected by a solder 310 Thus, according to a mounting method of the present invention, since the case 110 piojected from die board of the nnciophone is mseited into the inserting hole 306 31 of the main PCB 300, a total height t of an assembly according to the picsent invention is lower than that of an esscmbly assembled when the conventional miciophone having the boaid which is formed with the connecting terminals on the icverse bide oi the pait side thereof, theieby efficiently saving a space for mounting a pait of the pioducl. Refeinng again to Fig. 20, the boaid 120 is mounted with a MEMS chip 10 and an ASIC chip 20 within the metal case of the silicon based condenser microphone. Furthei, the boaid 120 is formed with a sound hole 120a for collecting sound fiom the outside in the ccntial portion thereof and is formed with a cncular connecting pattern 121 on thepoition thereof which contacts the metal case 110 having (he closed bottom side. Meanwhile, although there is not shown in the drawing, il necessary, (he board may be mounted with a capacity OF a lesistor for shielding clcctiomagnetic waves or ESD Hcie, the board 120 may be selected among a PCB, a ceramic boaid, a FPCB, a metal PCB and the like. The metal case may be made of any one selected fiom the gioup of biass, copper, stainless steel, aluminum, nickel alloy and the like. Fuithei, the metal case may be plated with Au ot Ag Further, as shown m Fig. 20, if extending the connecting terminal 122 through the cncuinferential part to the reveise side of the pait side, a heat transfer of an clectiic iron is improved, whereby a rework operation can be moie easily performed 32 Meanwhile, although there xs not shown in ihe drawing, the connecting terminal 122 may be extended up to the cncumfeiential pait of the boaid [Modification 2 of embodiment 3J Figs. 21A and 21]! are a perspective view of a second modification of a third embodiment accoiding to the pjesent invention, wheiem Fig. 21A is a view showing a silicon based condense microphone including a rectangular paiallclepipcd shaped metal case havjng a boitom side which is closed, and Fig 21B is a view showing a main PCB 300 of a product for mounting the silicon based condenser microphone having the rectangular p.iraiJelepiped shaped metal case According to the silicon based condenser nuciophonc of the second modification of a thud embodiment of the pi esent invention, the lectangulai paiallelepipcd shaped metal case 210 having the closed bottom side is attached to a board 120, wheiein the boaid is foimcd with connecting pads 122 which aie connected wilh connecting pads 304 of a mam PCB of a produce using the microphone on a pait side 120c thereof Further, there is not shown in the diawing, the board 120 is formed with a sound hole 120a for collecting soum t fiom the outside on the cential poi lion thereof The main PCB 300 of the pioduct where the silicon based condenser miciophone is mounted, as shown in Fig. 21B, is formed with a rectangular inseitmg hole 306 foi 33 mounting the case 210 of the silicon based condenser miciophone and the connecting pads 304 conespondmg to the connecting terminals 122 which aie loimed on the boaid 120 of the microponc Then, a piocess for mounting the silicon based condenser miciophone on Ihc main PCB 300 will be explained with rcfeience to Fig 6, The mounting includes lhe steps of preparing the main PCB 300 which is formed with the hole 306 for inseiUng the miciophone and ths connecting pads 304 foi elcctncaliy connecting with the miciophone, prepaing ihe condenser microphone having the boaid which is formed with the rectangular paiallelepiped shaped metal case projected fioin ihc ccnlral portion of the part side 120c of the board and the connecting teiminals 122 for connecting with the connecting pads 304 on the part side thereof and is foimed wiih Ihe sound hole 120a, and soldcung the connecting pads 304 of the main PCB and the connecting teimmals 122 of the miciophone aftei mseiting the case 210 of the condenser miciophone into the hole 306 of the main PCB This piocess is substantially identical to the mounting piocess of the a first modification of a thud embodiment except that the case has I he lectangular paiallelepiped shape. [Modification 3 of embodiment 3] Fig 22 is a sectional side view of a thud modification of a Ihnd embodiment 34 according to the present invention. According to the silicon based condense: microphone shown in Fig 22, the metal case 110/210 piojected horn the board is inserted the hole 306 of the main PCB 300, and the connecting teimmals 122 of the pait side 120c of the miciophone boaid aie connected with the connecting pads 304 of the main PCB by a solder 310. Further, the bouid J20 is formed with a hound hole 120a for collecting sound from the outside on the position where the MEMS chip 10 is mounted. Here, according to the silicon based condenser miciophone oi the lirst or the second modification of the third embodiment of the present invention, while the metal case 110/210 is not formed with the sound hole and the bottom side thereof is closed, the board is foimed with the sound hole 120a for collecting sound from the outside on the position wheie the MEMS chip is mounted. According to the simctuie shown in Fig 22, the external sound collected through the sound hole 120a of ihe PCB passes through the sound hole of the back plate 13 of the MEMS chip 10 and (hen vib] ates the sound plate 11 to geneiate an electiicat signal (.Modification 4 of embodiment 3] Fig 23 is a sectional side view of a fourth modification of a thud embodiment according to the present invention. In the embodiment of the fourth modification of a 35 third embodiment accoiding to the piesent invention, while a sound collected fiom a PCB side is called a front sound, a sound collected lioin a case side is calied a leai sound. According to the silicon based condenser microphone shown in Fig 23, the metal case 110/210 piojected horn the boaid is inserted the hole 306 of the main PCB 300, and the connecting terminals 122 of the pait side 120c of the miciophone boaid arc connected with the connecting pads 304 of the main PCB by a solder 310. The microphone boaid 120 is formed with the front sound inlet hole 120a foi collecting the front sound on the position where the MEMS chip 10 is mounted The metal case 110/210 is formed with the rear-sound inlet hole 110a for collecting the rear sound. Here, according to the dneclional silicon based condenser miciophone of the third embodiment according to (he piesent invention, an additional sound resistor 140 is attached on the inside and outside of the fiont sound inlet hole 120a oi the inside and outside of the rear sound inlet hole 110a so that the microphone has ducctivity. Accoiding to this stincture shown in Fig. 23, the sound collected through the front sound iniet hole 120a or the leai sound inlet hole 110a passes ihiough the sound lesistoi 140 and then its phase is changed, theieby obtaining a directivity 36 [Industnal Applicability] Fiom the foregoing, the metal case is welded to the board by the lasei, iheieby stiengthening a bonding ibice and thus enhancing a mechanical firmness and highly lesistmg noise fiom the outside As a lesult, the piocess expense is saved, theieby shai-ply cutting a total manufacturing eost Furthei, a curling process for joining a metal case with a PCB is removed jn a conventional miciopnone manufacturing process and the metal case is diieclly welded to the PCB which is mounted with condenser microphone pails, theieby enhancing an electrical conductivity between the case and the PCB and also enhancing a sound chaiactenstic by sealing the case so that a sound piessuie liom the outside does not enter the case. Furthei, since a sh.ipe of the PCB is not limited by the size of the case, the PCB winch is used foi the microphone is fiecly designed, theieby ioiming various shapes of tciminals. Further, since an assembling work can be peifoimed without a physical force applied in the cuiling process, a thinnei PCB can be adapted As a result, the height of a product can be lowered, wheieby a thmncr miciophonc can be manufactured. While the picsenl invention has been described m connection with what u> 37 presently eonsideied Lo he the mo:>l piaeucal and piciciicd unbodiments, it it, Lo be undcisiood thai Lho picsuit inveuLion is not limited lo the disclosed embodiment, bul, on the contraiy, n is intended to cover vaiious moditications and equivalent auangements included within the spnil and ^cope of the appeirled claims l;uitbei, accoidmg 10 the silicon based condenser miciojihonc which is mounted on the main PC13 atcoiding to Die picsent invention, since the case piojected fiom the boaid of the nnuophone is inseitcd into the mseiting hole oJ the mam PCB, the total height of the assembly alter mounting the miciophone of the jjicsent invention us lowei than that of the conventional assembly, thcieby efficiently saving a pail space within Ihepioducl 3% 14£ "CLAIM: [Claim 1] A silicon based condenser miciopbonc compnsing a metal case' and a boaid which is mounted with a MEMS rmciophone chip and an ASIC chip having a electric voltage pump and a buffci IC and is formed with a connecting pattern for bonding with the metal case, the connecting pattern being welded Lo the melal case fClaim 2] The silicon basod condense) microphone according to claim I, whcicin (he melal 3£ case has any one of a cylindrical shape and a iectangular parallelepiped shape [Claim 3] The silicon based condenser microphone accoiding to claim 2, wheiein an opened end of the metal case has any one of a stiaight line shape and a skill shape which is formed by bending the opened end outwaidly. [Claim 4] The silicon based condenser miciophonc according lo claim 1, whet em the board is any one selected from the gioup of a PCB, a ceramic boaid, a FPCB and a metal PCB. [Claim 5] The silicon based condenser microphone according to claim 1, wheiem the metal case is made of any one selected from the group of brass, aluminum and nickel alloy [Claim 6] The silicon based condenser microphone accoiding to claim 1, wheiein the welding is laser welding [Claim 7] The silicon based condensei microphone accoiding to claim 1, wherein the welding is electric welding. [Claim 8] 40 The silicon based condensei miciophone accoiding lo claim 1, vvhciein the welding is soldering [Claim 9] The silicon based condensei miciophone according to claim 1, whciein the welding is bonding usm;; a conductive adhesive. [Claim 10] The silicon based condenser miciophone according to claim 1, whciein the board is formed with two to eight connecting terminals for connecting with an external device. [Claim 11] The silicon based condensei miciophone accoidmg to claim 1, wheiein the boaid is formed with a leai sound inlet hole for collecting a rear sound, whereby the miciophone has directivity. [Claim 12] A method for packaging a silicon based condensei miciophone, the method comprising the steps of inputting a boaid which is mounted with a MEMS chip and an ASIC chip and is formed with a connecting pattern, inputting a metal case, 4) aligning the metal case on the connecting pattern of the board, and welding an opened end of the metal case to the connecting pattern of the boaid [Claim 13] A silicon based condenser .microphone comprising. a metal case having a bottom surface which is closed; and a board which is formed with a sound hole for collecting an external sound and a sealing terminal for sealing the sound hole by soldering to pi event distoition of d sound wave in the space between a main PCB and the nuciophone, the boaid being mounted with a MEMS miciophone chip and an ASIC chip having an elecluc voltage pump and a buffer 1C, the boaid being formed with a connecting pattern f 01 connecting with the metal case so that the metal case is bonded on the connecting pattern by welding [Claim 14] The silicon based condenser miciophone according to claim 13, wheiein the metal case has any one of a cylindrical shape and a rectangular parallelepiped shape [Claim 15] The silicon based condenser microphone according lo claim 13, wherein an opened end of the metal case has any one of a straight Imc shape and a skut shape which is fonncd by bending the opened end 4Z [Claim 16] The silicon based condenser nuciophone according to claim 13, wheicin [he board is any one selected fiom the gioup of a PCB, a ceiamic boaid, a FPCB and a metal PCB [Claim 17] The silicon based condenser microphone according to claim 13, wherein the metal case is made of any one selected irom the group of biass, aluminum and nickel alloy. [Claim 18] The silicon based condensei nuciophone accoiding to claim 13, wheicin the board is formed with two to eight connecting terminals ioi connecting with an external device. [Claim 19] The silicon based condenser nuciophone according to claim 13, wherein the sound hole of the boaid is formed on a poition wheie the MEMS chip is mounted and is not formed in the cenbal portion of the boaid. [Claim 20] The silicon based condenser microphone accoiding to claim 19, wherein the case is formed with a sound hole for collecting an external sound and is mounted with a 43 sound resister on the inside and outside of the sound hole, whcicby the microphone has directivity. [Claim 21] A silicon based condenser miciophone which is mounted on a main PCB having a inserting hole into which the condensei microphone is mseiled and connecting pads, the condenser microphone comprising: a metal case which is inserted into the inserting hole ol' the mum PCB and has a closed bottom side; a board which is broader than the metal case, the boaid being formed with a sound hole on the cential portion thereof and mounted with a MEMS microphone chip and an ASIC chip having a electric voltage pump and a buffer IC, the boaid being formed with a connecting pattern for bonding with the meLal case so that the metal case is bonded to the connecting pattern; and connecting teimmals which are formed on a pait side of the boaid which is mounted with the metal case to connect with the connecting pads of the main PCB [Claim 22] The silicon based condense! miciophone accoidmg to claim 21, wherein the metal case has any one of a cylindrical shape and a rectangular paiallelepiped shape [Claim 23] 44 The silicon based condense: miciophone accoiding to claim 21, wherein an end of the metal case has any one of a stiaight line shape and a skat shape which is formed by bending the end oulwaidly [Claim 24] The silicon based condenser microphone according to claim 21, wheicin the boaid is any one selected fiom the gioup of a PCB, a ceramic boaid, a FPCB and a metal PCB. [Claim 25] The silicon based condense! miciophone according to claim 21, wheicin the metal case is made ol any one selected fiom the gioup ol brass, aluminum and nickel alloy [Claim 26] The silicon based condenser microphone according to claim 21, wherein the connecting terminals are formed with two to eight connecting leimmais. [Claim 27] The silicon based condenser miciophone according to claim 21, wheiein the sound hole of the boaid is not foimed in the central portion of the boaid, but lbimed on the position where the MEMS chip is mounted. [Claim 28] 45" The silicon based cundensei miuophone according (to clams 27, where the case is lound wall a sound hole lot collecting .sound lrom the outside and is mounted with an addniunal .sound rossler on the in side and outside of the sound iolc, wheieby the tontlesei mn-ioplione has Uueclilly.

Full Text

[DESCRIPTION]
[Technical Field]
The present invention 1elates, to a condenser miciophonc, and, more particularly, to a silicon based condenser microphone which packages a silicon miciophone chip fabricated by a MEMS technology to increase a mechanical firmness and enhance effects for preventing noise from enlenng the microphone and a packaging method foi the silicon based condenser miciophone. [Background Art]
Generally, a condenser microphone which has been widely used in a mobile equipment or an audio equipment consists of a voltage bias element, a pan of a diaphragm and aback pate loi forming a capacitor which is changed couesponding to sound piessure, and a JFET foi buffering an output signal This typical condenser microphone has an assembly which is integrally assembled by inserting a diaphragm, a spacer ring, an insulating ung, a back plate, a conductive nng and a PCB into a case.
Meanwhile, recently, a semiconductor fabricating technology using a micromachining technology has been introduced for an integrated micro device
2
According to this technology which is called MEMS (MICIO Electio Mechanical
System), a sensoi, an actuator arid an electro mechanical stnictiue can be fabricated in a ?m unit using a micromachining technology which applies a semiconductoi fabiicating process, especially, an nuegiated ciicuil technology A MEMS chip microphone nidnufaclined by the- miciomachining technology has mcnls that miniaturization, high-pcifoimance, multifunction and integration can be obtained through the high picase micromachining technology and safety and icliubility can be enhanced.
However, since the MEMS chip microphone manufactured by the miciomachmmg technology should perform electrical driving and signal piocessmg, it is rcquned to package the miciophone with another special purpose semiconducloi chip device, that is, an ASIC (Application Specific lntegiated Circuit)
A conventional technology for packaging a MEMS chip microphone is disclosed in US Patent No. 6,781,231 which is published in August 25, 2004 and entitled by "Micio Electro Mechanical System Package with Envuonmental and Interieiencc Shield" The above package has a structuie for adhenng a cover which consists of an internal conductive layer and an external conductive layer on a multi-laycied substiatc which is alternately over lapped by a conductive layer and a non conductive layer using a conductive adhesive
2A
Thus, the conventional packaging method has pioblems in that a manufacturing cost is raised and a bonding property is detenoiated due to a complex piocess, and it is sensitive to an external noise such as an electromagnetic wave noise and the like since a non conductive matcrud unlike a metal housing is used [Disclosure] [Technical Problem]
Accordingly, in order to solve the problems, an object of the present invention is to provide a silicon based condensei microphone for inccasing bonding strength and having high resistance to external noise such as electiomugnelic waves by welding an opened end of a metal case to a substrate which is mounted with MEMS microphone parts and a packaging method foi the silicon based condensei microphone [Technical Solution]
According to an aspect of the piesent invention, than is piovidcd a silicon based condenser microphone compnsing: a metal case; and a board which is mounted with a MEMS microphone chip and an ASIC chip having a electric voltage pump and a buffer IC and is formed with a connecting pattern for bonding with the metal case, the connecting pattern being welded to the metal case.
Further, accoiding to another aspect of the piesenl invention, there is piovided a method for packaging a silicon based condensei microphone, the method comprising
3
the steps of: inputting a board which is mounted with a MEMS chip and an ASIC chip and is formed with a connecting pattern, inputting a metal case; aligning (he metal case on the connecting pattern of the board, and welding an opened end of the metal case to the connecting pattern of the board
Here, the metal case may have any one of a cylindrical shape and a icclangular paiallclepiped shape. Further, an opened end of the metal case may have any one of a straight line shape and a skirt shape which is formed by bending the opened end outwaidly
Further, the board may be any one selected from the group of a PCB, a ccianuc board, a FPCB and a metal PCB The metal case may be made of any one selected from the group of brass, aluminum and nickel alloy. Further, the welding may be any one selected from the group of laser welding, electric welding, soldering, and bonding using a conductive adhesive
Further, the boaid may be formed with two to eight connecting terminals for connecting with an external device. The board may be fanned with a lear sound inlet hole for collecting a lear sound, whereby the microphone has duecuvity.
4
[Description of Drawings
The above and other objects and featuies of the invention will become appaient from the following desciiption of pieferred embodiments taken in conjunction with the accompanying drawings in which:
Fig 1 is a sectional .side view of a first modification of a fusl embodiment according to the present invention;
Fig 2 is an exploded perspective view of a first modification of a lust embodiment according to the pieseni invention,
Fig. 3 is a view showing an example of a structuie tor a MEMS chip of a silicon based condenser microphone applied to each embodiment of the present invention in common;
Fig. 4 is a circuit diagram of a silicon based condensci microphone applied to each embodiment of the present invention in common,
Fig. 5 is a flow chait showing a packaging piocess of a silicon based condenser microphone according to the present invention;
Fig. 6 is an exploded peispective view of a second modification of a fust embodiment accoidmg to the present invention;
Fig. 7 is an exploded perspective view of a thud modification oi a first embodiment according to the preseni invention,
5
Fig. 8 is an exploded pcispcclive view of a fouilh modification of a lust embodiment accoiding to the present invention,
Fig 9 is a sectional side view of a fifth modification of a lust embodiment accoiding to the piesent invention;
Fig 10 is a sectional side view of a first modification of a second embodiment accoiding to the piesent invention,
Fig. 11 is a sectional side view ol" mounting example of microphone of fig 10;
Fig 12 is an exploded peispective view of a first modification of a second embodiment accoiding to the presenl invention;
Fig. 13 is an exploded perspective view of a second modification of a second embodiment accoiding to the present invention,
Fig. 14 is an exploded perspective view of a thud modification of a second embodiment accoiding to the present invention,
Fig. 15 is an exploded perspective view of a fouith modification of a second embodiment accoiding to the present invention,
Fig 16 is a sectional side view of a fifth modification of a second embodiment according to the piesent invention,
Fig. 17 is a sectional side view of a sixth modification of a second embodiment according to the present invention,
6
Fig. 18 is a peisjicctive view of a lirst modification oi a Ihnd embodiment accoidmg to the present invention,
Fig. 19 is a sectional side view oi" mounting a silicon based condcnsei microphone accoidmg to a third embodiment of the present invention,
Fig. 20 is a sectional side view showing that a silicon based condense! miciophone according lo a thud embodiment according to the picsent invention is mounted;
Fig. 21 is a perspective view ol a second modification of a third embodiment according to the piesent invention,
Fig. 22 is a sectional side view of a third modification of a ihnd embodiment according to the present invention; and
Fig 23 is a sectional side view of a fourth modification of a third embodiment accoidmg to the present invention [Best Mode]
Heremaftei, prefened embodiments of the piesent invention will be explained in detail with reference to the appended drawings
A fiist embodiment is example wherein a case is foinicd with a sound hole loi collecting sound and a number of modifications of the fust embodiment will be shown m ordei. A second embodiment is example wherein a miciophone boaid is formed
7
wilh a sound hole foi collecting sound and a number of modifications of the second embodiment will be shown in orclei. A thud embodiment is example whciein u microphone board is foimed with a sound hole and an mseiling hole is louned with a main PCB and a number of modifications of the first embodiment will be -shown in order.
[Embodiment Ij
[Modification 1 of embodiment IJ
Fig. 1 is a sectional side view of a fust modification of a first embodiment according to the piesenl invention, Fig. 2 is an exploded perspective view of a lust modification of a fust embodiment accoiding to the piesent invention, Fig 3 is a view showing an example oi a stmclurc foi a MEMS chip of a silicon based condenser microphone applied to each embodiment of the present invention in common, and Fig 4 is a circuit diagiam of a silicon based condenser miciophonc accoiding to the piesenl invention.
Accoiding to a firsi modification oi a first embodiment, as shown in Figs 1 and 2, a cylindrical metal case 110 is welded IO a PCB 120 which is mounted with a MEMS chip 10 and an ASIC chip 20 by a lasei
Referring to Figs. 1 and 2, the PCB 120 is mounted with the MEMS chip 10 and
8
the ASIC chip 20 and i", formed with a cncular connecting pattern 121 on a poition which contacts the mettl case 110. Meanwhile, it necessary, the PCB 120 may be mounted with a capacity oi a lesistor, which is not shown in the drawings, ioi shielding electiomagnetic waves orESD
Since the PCB 120 is broader than the metal case 110, connecting pads or connecting terminals foi connecting with an external device can be freely disposed on the bioad PCB The connecting pattern 121 is fomied by forming a coppci clad through a PCB manufacturing process and then plating Ni or Au Here, the boaid 120 may be a PCB, a ceiamic board, a FPCB or a metal PCB.
The metal case 110 has a cylindrical shape having an opening which faces the PCB 120 to receive die chip paits theiem, wherein an uppci surface thcicof is foimcd with a sound hole 110a foi collecting sound The metal case 110 is made of any one selected from the group of brass, copper, stainless steel, aluminum, nickel alloy and the like. Furthei, the metal case 110 is plated with Au or Ag. The metal case 110 may have various shapes such as a circle, a ^quaie and the like
After aligning the .metal case 110 on the connecting pattern 121 of the PCB 120, a connecting portion 130 thereof is welded by a lasei (not shown), theieby finishing a miciophone package Heie, the connecting pattern 121 is connected wjth a ground terminal 125, wheiem, if the metal case 110 is welded to the connecting pattern 121,
9
there is a ment in that it is easy to eliminate noise by inteiiuptmg the inflow of external noise.
As such, accoiding to the packaged miciophone assembly, as shown in Fig I, the metal case J l'O is firmly adhered to the connecting pattern 121 of the PCB 120 by the laser welding, wheiein a space 150 between the metal case 1 10 and the PCB 120 serves as a sound chamber
Furthei, the PCB 120 may be formed with connecting terminals 123 and 125 for connecting with the external device on a bottom surface thcicof, wherein the numbci of the connecting terminals 123 and 125 is two to eight. Each of the connecting terminals 123 and 125 is electrically connected through thiough-holc 124 to a chip part surface. Specially, accoiding to the embodiment of the present invention, if extending the connecting terminals 123 and 125 to a cncumfeicnce of the PCB 120, an electric soldering non L> appioached through an exposed suirace, whereby a lewoik opeiation can be easily perfoimed
The MEMS chip 10, as shown in Fig. 3, has a sUucluie that a back plate 13 is foimed on a silicon wafer 14 by using a MEMS technology and then the back plate faces a vibration membiane 11 with a spacer 12 interposed between the back plate 13 and the vibiation membiane 11. Since Hie MEMS chip 10 ib applied to each embodiment of the present invention m common and this fabucating technology of the
10
MEMS chip 10 has been opened, the further explanation will be omitted
The ASIC chip 20 which is connected with the MEMS chip 10 to pioccss electrical signals., as shown m Fig. 4, consists of an electric voltage pump 22 foi supplying an electnc pressure to allow the MEMS chip 10 to operate as a condensci microphone, and a buffer 1C 24 foi amplifying an electric sound signal sensed through the MEMS chip 10 or performing impendence matching ol the sensed electnc sound signal, thereby supplying the processed signal truough the connecting terminal to the outside. Here, the electric voltage pump 22 may be a DC-DC convener, and the buffei IC 24 may be an analogue amplifier oi ADC. Referring to Fig 4, a condenser symbol "CO" indicates an electrical equilibrium circuit foi the MEMS chip 10. Heie, the MEMS rmctophone package is connected with (he external device through thiee connecting terminals (Vdd, GND, Output) The circuit diagram of fig. 4 is applied to each embodiment m common.
According to the first embodiment of the piesent invention, the case i 10 and the PCB 120 aie welded by a lasei, but they may be bonded by anothci means such as electric welding, soldenug, conductive adhesive and the like
[Packaging method]
Fig 5 is a flow chart showing a packaging piocess oi a silicon based condenser
11
miciophone accoiding lo the piesent invention
A method for packaging a silicon based condenser miciophone accoiding to the present invention, as shown m Fig. 5, includes the steps of inputting a boaid (SI), mounting a MEMS pari and an ASIC chip on the board (S2), inputting a metal case (S3), aligning ihe case on a connecting pattern of the board (S4), and welding an opened end of the case to the connecting pattern of the boaid (S5)
Heie, the board m.iy be a PCB, a ceramic boaid, a FPCB or a metal PCB. The board is formed with ihe connecting pattern for connecting with the metal case. Meanwhile, although thuie is not shown in the drawing, the PCB 120 may be mounted with a capacity 01 a lesiUorfoi shielding electiomagnclic waves 01 ESD.
The metal case is made of any one selected from the gioup of brass, coppei, stainless steel, aluminum, nicke! alloy and the like Furthei, the metal case is plated with Au or Ag The metal case may have various shapes such as a cucle, a squaie and the like.
Furthei, m the step 5 (S5), the welding operation is perfoimed by laser welding, but it may be substituted with electric welding, soldenng oi bonding using a conductive cpoxy adhesive
According lo the packaging method of the piesent invention, the metal case is welded to the board by Ihe laser, wheieby a bonding force (that is, an electrical boding
12
force and a sealing performance) is strengthened As a lesull, a sound quality is enhanced, and the microphone has a high-resistance Lo noise from the outside Specially, a process expense is saved, thereby shaiply cutting a total manulactuiing cost
[Modification 2 of embodiment 1]
Fig. 6 is an exploded perspective view of a second modification of a first embodiment according to the piesent invention, wherein a leclangular parallelepiped shaped metal case 210 it. welded to a PCB 220 by a laser.
Referring to Fig. , the PCB 220 is mounted with the MEMS chip 10 and the ASIC chip 20 and is formed with a lectangular connecting pattern 221 on a portion which contacts the metal case 210. The connecting pattern 221 is made of a coppei clad film through a genetal PCB pattern forming technology
The metal case 210 has a rectangular parallelepiped shape having an opening which faces the PCB 2 10, wherein an uppei surface thereof" is formed with a sound hole 210a for collecting sound.
After aligning the metal case 210 on the connecting pattern 221 ol the PCB 220, a connecting portion iherebelween is welded by a laser (not shown), whereby miciophone packaging JS finished Heie, the connecting pattern 221 is connected with
13
a ground terminal, wheiein, if the metal case 210 is welded to the connecting pattern 221, thcie is a merit in that it is easy to eliminate noise by shutting out noise from the outside.
Since a M15MS chip of the miciophone assembly which is packaged us described above has the same structure as the MEMS chip shown in Fig. 3, the furthei explanation will be omitted to avoid a lepetition
[Modification 3 of embodiment 1J
Fig 7 JS an exp'oded perspective view of a thud modification of a first embodiment according lo the piesent invention, wherein a cylindrical metal case 110 which is formed with a :.knt 116 piojccted in a shape of "i—" fiom an opened end oL the case is welded to a PCB 120 by a laser
Referring lo Fig. 7, the PCB 120 is mounted with the MEMS chip JO and the ASIC chip 20 and is foimed with a circuhu connecting pattern 121 on a poition which contacts the metal case 110'. Since the PCB 120 is broadei than the metal case 110, connecting pads oi connecting terminals foi connecting with an external device can be fieely disposed on the broad PCB. Preferably, the connecting pattern is formed by forming a copper clad through a PCB manufactuiing process and then plating the copper clad with Ni OJ AU. Picfeiably, the width of the connecting pattern 121
14
accoiding to the thud modification is wider than that of the connecting pattern of the first modification to conespond to the skirt 116 of the metal case
The metal case 110' has a cylindncal shape having an opening which faces the PCB J20, wheiem an uppei surface thereof is formed with a sound hole 110a foi collecting sound A case body 114 is foimed with the skirt 1 !6 piojcctcd outwaidly on the opened end Iheieof
Aftei aligning [he :¦ fart 116 of the metal case 110' on the connecting pattern 121 of the PCB, a connecting portion therebetween is welded by a laser (not shown), whereby miciophone packaging is finished
[Modification 4 of embodiment 11
Fig. 8 is an exploded perspective view of a fouith modification of a first embodiment according io the piesent invention, wherein a lectangular parallelepiped shaped metal case 210 which is formed with a skirt 216 piojected in a shape of ">—" fiom an opened end of the case is welded to a PCB 220 by a laser
Refeinng to Fig. 8, the PCB 220 is mounted with the MEMS chip 10 and the ASIC chip 20 and is formed with a lectangular connecting pattern 221 on a poition which contacts the metal case 2JO' Since the PCB 220 is broader than the metal case 210' conned ing pads oi connecting terminals for connecting with an external device
15
can be freely disposed on the broad PCB. Prefetably, the connecting pattern 221 is formed by forming a coppei clad through a PCB manufacturing piocess and then plating the copper clad with Ni or Au Preferably, the width ol the connecting pattern 221 ace01 ding to fourth modification of a lust embodiment is wider than that of the connecting pattern of the second embodiment to conespond to the sknt 216 of a body 214 of the metal case 210'
The metal case 230' has a rectangular parallelepiped shape having an opening which faces the PCB 220, wheiem an upper surface theieof is formed with a sound hole 210a foi collecting sound. The case body 214 is foimed with the skirt 216 piojecled outwardly on the opened end theieof.
Aftei aligning the skirt 216 of the metal case on the connecting pattern 221 of the PCB, a connecting portion therebetween is welded by a lasci (not shown), wheieby miciophonc packaging i\ finished.
[Modification 5 of embodiment 1J
Fig 9 is a sectional side view of a fifth modification of a first embodiment accoidmg to the present invention.
Accoiding to the fifth modification of a first embodiment ol the piesent invention, piovided is a structure having directivity by forming a front sound inlet hole i 10a on a
16
portion of the metal case 110 which coiresponds to a portion wheic ihe MEMS chip 10 is positioned m the first embodiment to the fourth embodiment and teaming a leai sound inlet hole 120a which is. formed on a portion of the PCB wheie the MEMS chip 10 is jnountcd and then adding a sound lesistor 140 to the inside and outside of the front sound inlet hole 110a or the inside of the rear sound inicl hole 120a
According to the packaged directional microphone assembly, as shown in Fig 9, the metal case 110 is firmly adheied lo the connecting pattern 121 of the PCB 120 which is mounted with the MEMS chip 10 and the ASIC chip 20 by husci welding, wherein a space 150 between the melal case 110 and the PCB 120 is scived as a sound chamber.
The metal case 110 is formed with the front sound inlet hole 110a for collecting front sound on a portion theieof conesponding to a position of the MEMS chip 10, and the PCB 120 is foimed with a lear sound inlet hole 120a for collecting tear sound at a portion thereof conesponding to a portion where the MEMS chip 10 is mounted. The sound lesistor 140 is attached to the inside of the front sound inlet hole 110a Fuithei, the PCB 120 may be toimed with connecting teiminals 123 and 125 loi connecting with the external device on a bottom suiface thereof, wherein the number of the connecting terminals 123 and 125 may be two to eight Each of the connecting terminals 123 and 125 is electrically connected thiough a thtough-hole 124 to a chip
17
part surface of the PCB Specially, according to the embodiment of the piesent invention, if extending the connecting teiminals 123 and 125 lo a circumieience of the PCB 120, an electiic soldering iron is approached to an exposed surface of the terminal, whereby a revvoik operation can be easily peiformed.
According to the fifth modification of a first embodiment, the sound lesistor 140 is positioned at the inside of the front sound inlet hole 110a, but it may be positioned at the outside of the fiont sound inlet hole 110a or the inside oi the outside of Ihe leai sound inlet hole 120a. According to this structure of the fifth modification of a first embodiment, sound collected thiough the front sound iniet hole 110a or the icar sound mlet hole 120a passes through the sound resistoi 140 and then its pha&c is changed, thereby obtaining diiectivity.
[Embodiment 2J
[Modification 1 of embodiment 2]
Fig 10 is a sectional side view of a first modification of a second embodiment according to the piesent invention, Fig. 11 is a sectional side view showing thai a miciophone shown in Fig 10 is mounted on a main PCB, and Fig 12 is an exploded perspective view of a fust modification of a second embodiment according to the present invention.
18
Accoiding to a first modification of a. second embodiment accoiding to the present invention, as shown in Figs. JO and 12, there is piovided an example that a cylindrical metal case 1 [0 is welded to a PCB 120 which is mounted with a MEMS chip 10 and an ASIC chip 20 by a lasei
Relernng to Figs 10 and 12, the PCB 320 is formed with a sound hole 120a lor collecting an external sound near the center thereof and is mounted with the MEMS chip 10 and the ASIC chip 20 mound the center thereof Funhci, the PCB is formed with a circuUu connecting pattern 121 on its portion which contacts the metal case 110. Meanwhile, if necessary, the board may be mounted with a capacity oi a icsislor, which is not shown in the drawing, for shielding electiomagnedc waves oi ESD
Since the PCB l?,0 is broadei than the metal case 110, connecting pads or connecting terminals foi connecting with an external device can be liccly disposed on the bioad PCB The connecting pattern 121 is foimed by forming a copper clad through a general PCB manufacturing piocess and then plating the copper clad with Ni or Au Here, the board 120 may be a PCB, a ceramic boaid, a FPCB oi a metal PCB.
The metal case 110 has a cylindrical shape having an opening which faces the PCB 120 to leceive the chip parts theiein Since the metal case has a strucluie for collecting a sound through the sound hole 120a of the PCB, a bottom surface of the metal case is closed The metal case is made of any one selected from Lhc gioup of
19
brass, coppei, stainless steel, aluminum, nickel alloy and the hke. Fuithci, Ihe metal case may be plated with Au or Ag The metal case may have various shapes such as a cucle, a squaie and the like
Alter aligning the metal case 110 on the connecting pattern 121 ol the PCB 120, a connecting portion therebetween is welded by a laser (not shown), theieby finishing a miciophone package. Here, the connecting pattern 121 is connected with a ground terminal 125, wherein, if the metal case 1 10 is welded to the connecting pattern 121, mere is a merit in that it is easy to eliminate noise by interrupting noise collected from the outside.
According to the packaged miciophone assembly, as shown in Fig. 10, the metal case 110 is firmly adhered to the connecting pattern 121 ol the PCB 120 by a laser welding, wherein a space 150 between the metal case 110 and the PCB 120 is served as a sound chamber.
Further, the PCB 120 is formed with the sound hole 120a for collecting the external sound, wherein the PCB is formed with a sealing teimmal 120b for sealing the sound hole 120a by soldering aiound the sound hole of a bottom suiface of the PCB 120 10 pievent distoition of a sound wave geneiuted in a space between a main PCB 300 and the microphone Heie, the number of the connecting terminals 123 and 125 foi connecting with the exteinal device may be two to eight. Each of the connecting
20
teiminais 123 and 125 may be electrically connected through through-hole 124 to a chip part suiface of the: PCB 120 Specially, according to Ihe embodiment of the present invention, if extending the connecting teiminais 123 and 125 to a circumfeien.ee of the PCB 120, an electnc soldering iron is appioached to an exposed suiface of the teimmal, whereby a rewoik opeiation can be easily performed
An example that the miciophone according to the present invention is mounted on the main PCB 300 is shown m Fig. 1 i.
Referring to Fig II, the main PCB 300 wheie the miciophone is mounted is formed with a main sound hole 300a for collecting the external sound, whcicin the mam PCB is formed with a sealing teimmal 302 for sealing the main sound hole 300a by soldering around the mam sound hole theieof to prevent distortion of a sound wave generated in a space between a main PCB 300 and the miciophone. Furthei, the main PCB 300 Is formed with connecting pads 304 corresponding to the connecting teiminais 123 and 125 of the miciophone If connecting the miciophone accoiding to the present invention with the main" PCB 300 by a soldei 310, the external sound is collected thiough the mam sound hole 300a of the mam PCB 300 and then passes thiough an area sealed by the sealing terminal 302. Then, the external sound is collected thiough the sojnd hole 120a of the microphone PCB 120 to the inside of the microphone.
21
According to a fust modification of a second embodiment accoidmg to the piesent invention, the case 110 and the PCB 120 ate welded by a laser, but they may be bonded by anothei means such as electric welding, soldering, udheiing by a conductive adhesive and the like
[Modification 2 of embodiment 2]
Fig 13 is an exploded perspective view of a second modification of a second embodiment according to the piesent invention, whoiein a icctangular paiallelepiped shaped metal case 210 is, welded to a PCB 220 by a lusei
Referring to Fig. V), the PCB 220 is formed with a sound hole 220a for collecting an external sound and ts mounted with the MEMS chip L0 and the ASIC chip 20 around the sound hole 220a Fmthei, the PCB is formed with a icctangular connecting pattern 221 on its portion which contacts the metal case 210. The connecting pattern 221 is foimed of a copper clad fiJm by a general PCB pattern foiming technology Although theie is not shown in the drawing, the PCB is formed with a sealing terminal for sealing the sound hole by soldeiing aiound the sound hole of a bottom surface ol the*PCB 220 to pi event distortion of a sound wave geneiated in a .space between the main PCB 300 in Fig 11 and the microphone
The metal case 210 has a rectangular parallelepiped shape having an opening
22
which faces the PCB 2lJ.O, wheiem, since the external sound is collected through the sound hole 220a of the l'CB, the bottom surface of the case is closed
Alter aligning the netal case 210 on the connecting pattern 221 of the PCB 220, a connecting poition therebetween is welded by a laser (not shown), theieby finishing packaging of the miciophone Heie, the connecting pattern 221 is connected with a gtouncl teinimal, wherein, if the metal case 210 is welded to the connecting pattern 221, theie is a merit m that it is easy to eliminate noise itself by interrupting noise collected from the outside.
Since a microphone assembly which is packaged as desci ibed above has. ihe same structure as the assembly shown in Fig 10, the further explanation will be omitted to avoid a repetition
[Modification 3 of embodiment 2]
Fig. 14 is an exploded perspective view of a third modification of a second embodiment accoiding lo the piesent invention, wherein a cylindrical metal case 1101 which is formed with a iikirt 116 pi ejected in a shape of " *-" from an opened end of the case is welded to a PCB 120 by a laser.
Referring to Fig. 14, the PCB ,120 is formed with a sound hole 120a for collecting an external sound and is mounted with the MEMS chip 10 and the ASIC chip 20.
23
Fuither, the PCB is formed with a cncular connecting pattern 121 on its portion which contacts the metal case L101 . Although theie is not shown in the drawing, the PCB 120 is formed with a sealing terminal foi sealing the sound hole by soldeung around the sound hole 120a of a bottom surface of the PCB 120 to prevent distortion oi a sound wave geneiated m a space between the mam PCB 300 m Fig 11 and the mitiophonc Since the PCB 120 is broader than the metal case, connecting pads oi connecting terminals for connecting with an external device can be freely disposed on ihc bioad PCB Prefeiably, the connecting pattern is foimed by forming a coppci clad tlnough a gcneial PCB manufactuung piocess and then plating the copper clad with Ni or Au Fuither, prefeiably, the width of the connecting pattern 121 accoidmg to the thud modification is widei than that of ihe connecting pattern of the first modification ol a second embodiment to correspond to the skn t 116 of the metal case.
The metal case 110' of third modification of a second embodiment has a cuculai shape having an openm;; which faces the PCB 120, wheiein, since the external sound is collected through the sound hole 120a of the PCB, a bottom surface of the case is closed. Further, a body 114 of the ca,se 110' is formed with the skut 116 projected outwardly on the opened end theieof
After aligning the skirt 116 of the metal case 110" on the connecting pattern 121 of the PCB, a connecting portion theiebetween is welded by a lasci (not shown),
24
whereby miciophone packaging is finished.
[Modification 4 of embodiment 2]
Fig 15 is an exploded perspective view of a fouith modification of a second embodiment according to the piesent invention, whciem a ioctangular parallelepiped shaped metal case 210' which is formed with a skirt 216 piojected m a shape oltL-" fiom an opened end of the case is welded to a PCB 220 by a laser.
Referring to Fig. i;>, the PCB 220 is formed with a sound hole 220a for collecting an external sound and is mounted with the MEMS chip 10 and the ASIC chip 20. Further, the PCB is formed with a lectangular connecting pattern 22] on its poition which contacts the metal case 210' Although there is not shown m the drawing, the PCB 220 is ioimed wiih a sealing terminal foi sealing the sound hole by soldering around the sound hole 520a of a bottom suiface of the PCB 220 to pi event distoilion of a sound wave geneiated in a space between the main PCB 300 in Fig 11 and the microphone. Since the FCB 220 is broadei than the metal case 210, connecting pads oi connecting terminals foi connecting with an external device can be freely disposed on the broad PCB. Prefeiahly, the connecting pattern 221 is foimed by forming a coppei clad through a PCB manufacturing process and then plating the coppei clad with Ni or Au Piefeiably, the width of the connecting pattern 221 according to the jourlli
25
modification of a second embodiment is wider than that of the connccimg paUein of the second embodiment to correspond to the skirt 216 of a body 214 of the metal case 210' .
The metal case 210' has a shape of a idanguku parallelepiped having an opening which faces tlie PCB 220, wherein, since the external sound is collected through the sound hole 'i20a of the PCB, a bottom surface of the case 210' is closed. Further, a body 214 of the case is formed with the skirt 216 piojected outwaidly on the opened end thereof.
After aligning the ;.krrt 216 of the metal case on the connecting pattern 221 of the PCB, a connecting portion therebetween is welded by a lasei (not shown), whereby microphone packaging r; finished.
[Modification 5 of embodiment 2]
Fig. 16 is a sectional side view of a fifth modification of a second embodiment according to the present invention, wherein a PCB is formed with a sound hole on a portion where a MEMS chip JS positioned.
Referring to Fig. [6, the metal case 110 is firmly attached to the connecting pattern 121 of the PCB 120 which is mounted with the MBMS chip 10 and the ASIC chip 20 by laser welding
26
Further, the PCB 120 is formed with the sound hole 120a for collecting an external sound on a position where the MEMS chip 10 is mounted, and is formed with the sealing terminal 120a foi sealing the sound hole 120a by soldenng on the outside oi the sound hole to pie vent distortion of a sound wave in a space between the mam PCB 300 and the nuciophone. Further, the PCB 120 may be formed with the connecting terminals 12 5 and 125 for connecting with the external device on a bottom surface thereof, wherein the number of the connecting terminals 123 and 125 may be two to eight Each of the connecting terminals 123 and 125 is electrically connected through thiough-hole 124 to a chip pait surface of the PCB 120 Specially, according to the embodiment of the piesent invention, if extending me connecting teiminals 123 and 125 to a cncumfeience of the PCB 120, an electric t»oldcnng non is appiouched to an exposed surface of the terminals, whereby a lework operation can be easily peifoimed.
Accoidmg to the siructure of the fifth modification of a second embodiment, the external sound collected thiough the sound hole 120a passes thiough the sound hole of the back plate 13 of the MEMS chip 10 and then vibiates the .sound plate 11 to geneiate an electiical signal. Although theic is not shown in the drawing, in ordei to mount the microphone on the main PCB 300, the PCB 300 is formed with a hole conesponding the sound hole 120a and further is formed with a scaling terminal lor
27
sealing the hole by soldunng around the hole of the PCB 300 to prevent distortion of a sound wave generated m a space between the main PCB 300 in Fig 300 and the miciophone.
[Modification 6 of embodiment 2]
Tig. 17 is a sectional bide view of a sixth modification of a second embodiment according to the present invention In the embodiment of the picsont invention, whiic a sound collected from a J'CB side is called a front sound, a sound collected j mm a ca.se side is called a tear sound
Accoiding to the sixth modification of a second embodiment of the present invention, piovided is a structuie having directivity by forming a front sound inlet hole 120a on the portion of the PCB 120 which conesponds to a poition whcie the MEMS chip 10 is mounted in the fifth embodiment and forming a reai sound inlet hole 110a on the portion of the metal case 110 which corresponds to a portion where the MEMS chip 10 is positioned and then adding a sound lesistor 140 to the inside of the fiont sound inlet hole 120a oi the inside and outside of the reai sound inlet hole 110a.
Referring to Fig 17, in the packaged directional microphone assembly, the metal case 110 is firmly attached to the connecting pattern of the PCB 120 which is mounted with the MEMS chip 10 and the ASIC chip 20 by laser welding
28
The PCB 120 is formed with the hont bound inlet hole I20a lor collecting front sound on the petition thereof conespondmg to a portion wheie the MEMS chip 10 is mounted. The metal case 110 is loaned with the ieai sound mlct hole 110a for collecting rear sound on the portion thereof conespondmg to a position of the MEMS chip 10. The sound lesistoi 140 is attached to the inside oi (he reai sound inlet hole 110a Furthei, the PC1S 120 is formed with the sealing tcimmal 120a for sealing the sound hole 120a by soldering aiound the outside oi the sound hoic to prevent distortion of a sound wave in a t.pace between the mam PCB 300 and the miciophone. Further, the PCB 120 may be formed with the connecting terminals 123 dud 125 foi connecting with the external device on a bottom surface thereof, wheiein the number of the connecting terminals 123 and 125 may be two to eight Each of the connecting leiminals 123 and 125 may be electrically connected thiough through-hole 124 to a chip pan surface of the VCB 120.
According to this structuie of the sixth modification of a second embodiment, the sound collected througl the fiont sound inlet hole 120a or the lear sound inlet hole 110a passes thiough thi sound resistor 140 and then its phase is changed, theteby obtaining duectivity
[Embodiment 3J
29
[Modification 1 of embodiment 3]
Fig. IS is a perspective view of a first modification of a thud embodiment accoidmg to ttie preset't invention, Fig. 19 is a sectional side view of mounting a silicon based condensei microphone according to a third embodiment of the piescnt invention, and Fig. 20 is a sectional side view showing that a silicon based condensei miciophone accoiding IO a third embodiment accoiding to the present invention is mounted.
According lo a silicon based condenser microphone, as shown in Fig. 18, a cylindrical metal case 110 having a bottom surface which is closed is attached to a board 120 which is broadci than the metal case 110, wheiem the board is formed with connecting pads 122-1 to 122-4 1 which aie connected with connecting pads 304-1 lo 304-4 of a main PCB '!00 of a product using the miciophone on a part side 120c thereof. In the embodiment of the present invention, foui connecting teiminals aic provided, but the number is merely an example. That is, two to eight connecting terminals may be piovided. Further, if extending the connecting teiminals 122-1 and 122-4 to a encumference of the PCB 120 ot the reverse side of the pail side, a heal transfei oi an electric noil and the like is impioved, whereby a rework operation can be moie convenient.
The mam PCB 300 wheic the silicon based condenser miciophone is mounted, as
30
shown in Fig 18, is fanned with a cuculai mseitmg hole 306 lor mounting the case 110 of the silicon based condenser mictophone and the connecting pads 304-1 to 304-4 corresponding to the connecting terminals 122-1 to 122-4 which is formed on the board 120 of the microphone
Then, an example for mounting the silicon based condenser miciophonc on the mam PCB 300 will be explained with reference to Fig 19. Referring to Fig 19, the part side 120c of the microphone board which is fonned with a sound hole 120a for collecting sound from the outside and the connecting teiminals 122-1 to 122-4 and is provided with the metal case 1J0 having the bottom surface which is closed faces the mam PCB 300 and then the case 110 of the microphone is inserted into the hole 306 of the mam PCB 210 Then, the connecting pads 304-1 to 304-4 are connected with the connecting pads 122-1 to 122-4 by a soldering operation.
As such, accoiding to a structuie of Fig. 20 showing that the silicon based condensei nnciophone l > mounted on the main PCB 300, the metal case 110 projected from the central portion of the part side 120c of the board is nisei ted the inserting hole 306 of the mam PCB 300 and the connecting pads 304 ol the mam PCB and the connecting terminals 12'i of the microphone aie connected by a solder 310
Thus, according to a mounting method of the present invention, since the case 110 piojected from die board of the nnciophone is mseited into the inserting hole 306
31
of the main PCB 300, a total height t of an assembly according to the picsent invention is lower than that of an esscmbly assembled when the conventional miciophone having the boaid which is formed with the connecting terminals on the icverse bide oi the pait side thereof, theieby efficiently saving a space for mounting a pait of the pioducl.
Refeinng again to Fig. 20, the boaid 120 is mounted with a MEMS chip 10 and an ASIC chip 20 within the metal case of the silicon based condenser microphone. Furthei, the boaid 120 is formed with a sound hole 120a for collecting sound fiom the outside in the ccntial portion thereof and is formed with a cncular connecting pattern 121 on thepoition thereof which contacts the metal case 110 having (he closed bottom side.
Meanwhile, although there is not shown in the drawing, il necessary, (he board may be mounted with a capacity OF a lesistor for shielding clcctiomagnetic waves or ESD Hcie, the board 120 may be selected among a PCB, a ceramic boaid, a FPCB, a metal PCB and the like. The metal case may be made of any one selected fiom the gioup of biass, copper, stainless steel, aluminum, nickel alloy and the like. Fuithei, the metal case may be plated with Au ot Ag
Further, as shown m Fig. 20, if extending the connecting terminal 122 through the cncuinferential part to the reveise side of the pait side, a heat transfer of an clectiic iron is improved, whereby a rework operation can be moie easily performed
32
Meanwhile, although there xs not shown in ihe drawing, the connecting terminal 122 may be extended up to the cncumfeiential pait of the boaid
[Modification 2 of embodiment 3J
Figs. 21A and 21]! are a perspective view of a second modification of a third embodiment accoiding to the pjesent invention, wheiem Fig. 21A is a view showing a silicon based condense microphone including a rectangular paiallclepipcd shaped metal case havjng a boitom side which is closed, and Fig 21B is a view showing a main PCB 300 of a product for mounting the silicon based condenser microphone having the rectangular p.iraiJelepiped shaped metal case
According to the silicon based condenser nuciophonc of the second modification of a thud embodiment of the pi esent invention, the lectangulai paiallelepipcd shaped metal case 210 having the closed bottom side is attached to a board 120, wheiein the boaid is foimcd with connecting pads 122 which aie connected wilh connecting pads 304 of a mam PCB of a produce using the microphone on a pait side 120c thereof Further, there is not shown in the diawing, the board 120 is formed with a sound hole 120a for collecting soum t fiom the outside on the cential poi lion thereof
The main PCB 300 of the pioduct where the silicon based condenser miciophone is mounted, as shown in Fig. 21B, is formed with a rectangular inseitmg hole 306 foi
33
mounting the case 210 of the silicon based condenser miciophone and the connecting pads 304 conespondmg to the connecting terminals 122 which aie loimed on the boaid 120 of the microponc
Then, a piocess for mounting the silicon based condenser miciophone on Ihc main PCB 300 will be explained with rcfeience to Fig 6, The mounting includes lhe steps of preparing the main PCB 300 which is formed with the hole 306 for inseiUng the miciophone and ths connecting pads 304 foi elcctncaliy connecting with the miciophone, prepaing ihe condenser microphone having the boaid which is formed with the rectangular paiallelepiped shaped metal case projected fioin ihc ccnlral portion of the part side 120c of the board and the connecting teiminals 122 for connecting with the connecting pads 304 on the part side thereof and is foimed wiih Ihe sound hole 120a, and soldcung the connecting pads 304 of the main PCB and the connecting teimmals 122 of the miciophone aftei mseiting the case 210 of the condenser miciophone into the hole 306 of the main PCB This piocess is substantially identical to the mounting piocess of the a first modification of a thud embodiment except that the case has I he lectangular paiallelepiped shape.
[Modification 3 of embodiment 3]
Fig 22 is a sectional side view of a thud modification of a Ihnd embodiment
34
according to the present invention.
According to the silicon based condense: microphone shown in Fig 22, the metal case 110/210 piojected horn the board is inserted the hole 306 of the main PCB 300, and the connecting teimmals 122 of the pait side 120c of the miciophone boaid aie connected with the connecting pads 304 of the main PCB by a solder 310. Further, the bouid J20 is formed with a hound hole 120a for collecting sound from the outside on the position where the MEMS chip 10 is mounted.
Here, according to the silicon based condenser miciophone oi the lirst or the second modification of the third embodiment of the present invention, while the metal case 110/210 is not formed with the sound hole and the bottom side thereof is closed, the board is foimed with the sound hole 120a for collecting sound from the outside on the position wheie the MEMS chip is mounted.
According to the simctuie shown in Fig 22, the external sound collected through the sound hole 120a of ihe PCB passes through the sound hole of the back plate 13 of the MEMS chip 10 and (hen vib] ates the sound plate 11 to geneiate an electiicat signal
(.Modification 4 of embodiment 3]
Fig 23 is a sectional side view of a fourth modification of a thud embodiment according to the present invention. In the embodiment of the fourth modification of a
35
third embodiment accoiding to the piesent invention, while a sound collected fiom a PCB side is called a front sound, a sound collected lioin a case side is calied a leai sound.
According to the silicon based condenser microphone shown in Fig 23, the metal case 110/210 piojected horn the boaid is inserted the hole 306 of the main PCB 300, and the connecting terminals 122 of the pait side 120c of the miciophone boaid arc connected with the connecting pads 304 of the main PCB by a solder 310. The microphone boaid 120 is formed with the front sound inlet hole 120a foi collecting the front sound on the position where the MEMS chip 10 is mounted The metal case 110/210 is formed with the rear-sound inlet hole 110a for collecting the rear sound.
Here, according to the dneclional silicon based condenser miciophone of the third embodiment according to (he piesent invention, an additional sound resistor 140 is attached on the inside and outside of the fiont sound inlet hole 120a oi the inside and outside of the rear sound inlet hole 110a so that the microphone has ducctivity.
Accoiding to this stincture shown in Fig. 23, the sound collected through the front sound iniet hole 120a or the leai sound inlet hole 110a passes ihiough the sound lesistoi 140 and then its phase is changed, theieby obtaining a directivity
36
[Industnal Applicability]
Fiom the foregoing, the metal case is welded to the board by the lasei, iheieby stiengthening a bonding ibice and thus enhancing a mechanical firmness and highly lesistmg noise fiom the outside As a lesult, the piocess expense is saved, theieby shai-ply cutting a total manufacturing eost
Furthei, a curling process for joining a metal case with a PCB is removed jn a conventional miciopnone manufacturing process and the metal case is diieclly welded to the PCB which is mounted with condenser microphone pails, theieby enhancing an electrical conductivity between the case and the PCB and also enhancing a sound chaiactenstic by sealing the case so that a sound piessuie liom the outside does not enter the case.
Furthei, since a sh.ipe of the PCB is not limited by the size of the case, the PCB winch is used foi the microphone is fiecly designed, theieby ioiming various shapes of tciminals. Further, since an assembling work can be peifoimed without a physical force applied in the cuiling process, a thinnei PCB can be adapted As a result, the height of a product can be lowered, wheieby a thmncr miciophonc can be manufactured.
While the picsenl invention has been described m connection with what u>
37
presently eonsideied Lo he the mo:>l piaeucal and piciciicd unbodiments, it it, Lo be undcisiood thai Lho picsuit inveuLion is not limited lo the disclosed embodiment, bul, on the contraiy, n is intended to cover vaiious moditications and equivalent auangements included within the spnil and ^cope of the appeirled claims
l;uitbei, accoidmg 10 the silicon based condenser miciojihonc which is mounted on the main PC13 atcoiding to Die picsent invention, since the case piojected fiom the boaid of the nnuophone is inseitcd into the mseiting hole oJ the mam PCB, the total height of the assembly alter mounting the miciophone of the jjicsent invention us lowei than that of the conventional assembly, thcieby efficiently saving a pail space within Ihepioducl
3%
14£ "CLAIM:
[Claim 1]
A silicon based condenser miciopbonc compnsing a metal case' and
a boaid which is mounted with a MEMS rmciophone chip and an ASIC chip having a electric voltage pump and a buffci IC and is formed with a connecting pattern for bonding with the metal case, the connecting pattern being welded Lo the melal case fClaim 2]
The silicon basod condense) microphone according to claim I, whcicin (he melal
3£
case has any one of a cylindrical shape and a iectangular parallelepiped shape [Claim 3]
The silicon based condenser microphone accoiding to claim 2, wheiein an opened end of the metal case has any one of a stiaight line shape and a skill shape which is formed by bending the opened end outwaidly. [Claim 4]
The silicon based condenser miciophonc according lo claim 1, whet em the board is any one selected from the gioup of a PCB, a ceramic boaid, a FPCB and a metal PCB. [Claim 5]
The silicon based condenser microphone according to claim 1, wheiem the metal case is made of any one selected from the group of brass, aluminum and nickel alloy [Claim 6]
The silicon based condenser microphone accoiding to claim 1, wheiein the welding is laser welding [Claim 7]
The silicon based condensei microphone accoiding to claim 1, wherein the welding is electric welding. [Claim 8]
40
The silicon based condensei miciophone accoiding lo claim 1, vvhciein the welding is soldering [Claim 9]
The silicon based condensei miciophone according to claim 1, whciein the welding is bonding usm;; a conductive adhesive. [Claim 10]
The silicon based condenser miciophone according to claim 1, whciein the board is formed with two to eight connecting terminals for connecting with an external device. [Claim 11]
The silicon based condensei miciophone accoidmg to claim 1, wheiein the boaid is formed with a leai sound inlet hole for collecting a rear sound, whereby the miciophone has directivity. [Claim 12]
A method for packaging a silicon based condensei miciophone, the method comprising the steps of
inputting a boaid which is mounted with a MEMS chip and an ASIC chip and is formed with a connecting pattern, inputting a metal case,
4)
aligning the metal case on the connecting pattern of the board, and
welding an opened end of the metal case to the connecting pattern of the boaid [Claim 13]
A silicon based condenser .microphone comprising.
a metal case having a bottom surface which is closed; and
a board which is formed with a sound hole for collecting an external sound and a sealing terminal for sealing the sound hole by soldering to pi event distoition of d sound wave in the space between a main PCB and the nuciophone, the boaid being mounted with a MEMS miciophone chip and an ASIC chip having an elecluc voltage pump and a buffer 1C, the boaid being formed with a connecting pattern f 01 connecting with the metal case so that the metal case is bonded on the connecting pattern by welding [Claim 14]
The silicon based condenser miciophone according to claim 13, wheiein the metal case has any one of a cylindrical shape and a rectangular parallelepiped shape [Claim 15]
The silicon based condenser microphone according lo claim 13, wherein an opened end of the metal case has any one of a straight Imc shape and a skut shape which is fonncd by bending the opened end
4Z
[Claim 16]
The silicon based condenser nuciophone according to claim 13, wheicin [he board is any one selected fiom the gioup of a PCB, a ceiamic boaid, a FPCB and a metal PCB [Claim 17]
The silicon based condenser microphone according to claim 13, wherein the metal case is made of any one selected irom the group of biass, aluminum and nickel alloy. [Claim 18]
The silicon based condensei nuciophone accoiding to claim 13, wheicin the board is formed with two to eight connecting terminals ioi connecting with an external device. [Claim 19]
The silicon based condenser nuciophone according to claim 13, wherein the sound hole of the boaid is formed on a poition wheie the MEMS chip is mounted and is not formed in the cenbal portion of the boaid. [Claim 20]
The silicon based condenser microphone accoiding to claim 19, wherein the case is formed with a sound hole for collecting an external sound and is mounted with a
43
sound resister on the inside and outside of the sound hole, whcicby the microphone has directivity. [Claim 21]
A silicon based condenser miciophone which is mounted on a main PCB having a inserting hole into which the condensei microphone is mseiled and connecting pads, the condenser microphone comprising:
a metal case which is inserted into the inserting hole ol' the mum PCB and has a closed bottom side;
a board which is broader than the metal case, the boaid being formed with a sound hole on the cential portion thereof and mounted with a MEMS microphone chip and an ASIC chip having a electric voltage pump and a buffer IC, the boaid being formed with a connecting pattern for bonding with the meLal case so that the metal case is bonded to the connecting pattern; and
connecting teimmals which are formed on a pait side of the boaid which is mounted with the metal case to connect with the connecting pads of the main PCB [Claim 22]
The silicon based condense! miciophone accoidmg to claim 21, wherein the metal case has any one of a cylindrical shape and a rectangular paiallelepiped shape [Claim 23]
44
The silicon based condense: miciophone accoiding to claim 21, wherein an end of the metal case has any one of a stiaight line shape and a skat shape which is formed by bending the end oulwaidly [Claim 24]
The silicon based condenser microphone according to claim 21, wheicin the boaid is any one selected fiom the gioup of a PCB, a ceramic boaid, a FPCB and a metal PCB. [Claim 25]
The silicon based condense! miciophone according to claim 21, wheicin the metal case is made ol any one selected fiom the gioup ol brass, aluminum and nickel alloy [Claim 26]
The silicon based condenser microphone according to claim 21, wherein the connecting terminals are formed with two to eight connecting leimmais. [Claim 27]
The silicon based condenser miciophone according to claim 21, wheiein the sound hole of the boaid is not foimed in the central portion of the boaid, but lbimed on the position where the MEMS chip is mounted. [Claim 28]
45"
The silicon based cundensei miuophone according (to clams 27, where the case is lound wall a sound hole lot collecting .sound lrom the outside and is mounted with an addniunal .sound rossler on the in side and outside of the sound iolc, wheieby the tontlesei mn-ioplione has Uueclilly.

Documents:

00832-kol-2006 abstract.pdf

00832-kol-2006 claims.pdf

00832-kol-2006 correspondence others.pdf

00832-kol-2006 description(complete).pdf

00832-kol-2006 drawings.pdf

00832-kol-2006 form-1.pdf

00832-kol-2006 form-2.pdf

00832-kol-2006 form-3.pdf

00832-kol-2006 form-5.pdf

00832-kol-2006 general power of authority.pdf

00832-kol-2006-assignment.pdf

00832-kol-2006-correspondence-1.1.pdf

832-KOL-2006-(02-04-2012)-CORRESPONDENCE.pdf

832-KOL-2006-(08-05-2012)-CORRESPONDENCE.pdf

832-KOL-2006-(09-10-2012)-CORRESPONDENCE.pdf

832-KOL-2006-(24-06-2013)-CORRESPONDENCE.pdf

832-KOL-2006-(24-06-2013)-OTHERS.pdf

832-KOL-2006-ABSTRACT 1.1.pdf

832-KOL-2006-ABSTRACT.pdf

832-KOL-2006-AMENDE CLAIMS.pdf

832-KOL-2006-AMENDED PAGES.pdf

832-KOL-2006-AMENDED-CLAIMS-1.1.pdf

832-KOL-2006-AMENDED-PAGES-1.1.pdf

832-KOL-2006-ANNEXURE FORM 3.pdf

832-KOL-2006-CANCELLED PAGES.pdf

832-KOL-2006-CORRESPONDENCE-1.1.pdf

832-KOL-2006-CORRESPONDENCE-1.3.pdf

832-KOL-2006-CORRESPONDENCE.1.2.pdf

832-KOL-2006-CORRESPONDENCE.pdf

832-KOL-2006-DRAWINGS 1.1.pdf

832-KOL-2006-DRAWINGS.pdf

832-KOL-2006-FORM 1.pdf

832-KOL-2006-FORM 2.1.1.pdf

832-KOL-2006-FORM 2.pdf

832-KOL-2006-FORM 3.1.1.pdf

832-KOL-2006-FORM 3.pdf

832-KOL-2006-FORM 5.1.1.pdf

832-KOL-2006-FORM 5.pdf

832-KOL-2006-OTHERS DOCUMENTS.pdf

832-KOL-2006-OTHERS-1.1.pdf

832-KOL-2006-OTHERS.pdf

832-KOL-2006-PETITION UNDER RULE 137-1.1.pdf

832-KOL-2006-PETITION UNDER RULE 137.pdf

832-KOL-2006-REPLY TO EXAMINATION REPORT.pdf

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Patent Number

257739

Indian Patent Application Number

832/KOL/2006

PG Journal Number

44/2013

Publication Date

01-Nov-2013

Grant Date

30-Oct-2013

Date of Filing

18-Aug-2006

Name of Patentee

BSE CO., LTD.

Applicant Address

4 LOT, 58 BLOCK, 626-3, GOJAN-DONG, NAMDONG-GU, INCHEON, 405-817

Inventors:

#	Inventor's Name	Inventor's Address
1	SONG, CHUNG-DAM	236-6, GAYANG-1-DONG, GANGSEO-GU, SEOUL, 157-801

PCT International Classification Number

H04R19/04

PCT International Application Number

N/A

PCT International Filing date

PCT Conventions:

#	PCT Application Number	Date of Convention	Priority Country
1	10-2005-0076522	2005-08-20	Republic of Korea
2	10-2005-0076521	2005-08-20	Republic of Korea