Title of Invention

ALUMINUM MAGNESIUM TITANATE CRYSTAL STRUCTURE, AND PROCESS FOR ITS PRODUCTION

Abstract The invention discloses an aluminum magnesium titanate crystal structure, which comprises a solid solution wherein at least some of Al atoms in the surface layer of aluminum magnesium titanate crystal represented by the empirical formula Mgx Al2(1-x)Ti(1+X)O5 (wherein 0.1<x<1) are substituted with Si atoms, and which has a thermal expansion coefficient of from -6X10-6(1/K) to 6X10-6(1/K) in a range of from 50 to 800°C at a temperature raising rate of 20°C/min, and a remaining ratio of aluminum magnesium titanate of at least 50%, that does not undergo any decomposition, when held in an atmosphere of 1,100°C for 300 hours. The invention is also for a process for protection of said crystal structure.
Full Text TECHNICAL FIELD
The present invention relates to an aluminum
magnesium titanate crystal structure, particularly to an
aluminum magnesium titanate crystal structure having high
mechanical strength, which can be used continuously and
stably at high temperatures, while maintaining its high
heat resistance, extremely small thermal expansion
coefficient and high corrosion resistance, and to a
process for its production.
BACKGROUND ART
Aluminum magnesium titanate is a homogeneous solid
solution formed over the entire compositional range of
aluminum titanate and magnesium titanate. A sintered
product of aluminum magnesium titanate has high heat
resistance, a small thermal expansion coefficient, and
excellent corrosion resistance. The melting point of
aluminum magnesium titanate is about 1,640°C e.g. in the
case of a sintered product wherein aluminum titanate and
magnesium titanate are solid-solubilized in an
approximately equivalent molar ratio. This temperature
is lower when compared with the melting point of aluminum

titanate of 1,870°C, but it is higher when compared with
the melting point of magnesium titanate of 1,600°C.
Therefore, in general, the upper limit of heat resistance
of aluminum magnesium titanate is inferior to that of
aluminum titanate, but it is still superior in comparison
with that of magnesium titanate.
On the other hand, an aluminum titanate sintered
product and a magnesium titanate sintered product are,
respectively, constructed from crystal grains having the
pseudobrookite type crystal structure, and their
coefficients of thermal expansion are anisotropic.
Therefore, when heating and cooling are carried out,
slippage by a thermal stress is likely to take place at
the crystalline interface, and there is a drawback such
that the mechanical strength tends to deteriorate due to
progress in micro cracks and apertures. Since aluminum
magnesium titanate also has the same drawback, the
aluminum magnesium titanate sintered product is also
insufficient in mechanical strength. Specifically, in a
case where the aluminum magnesium titanate sintered
product is used in an application in which high
temperatures and heavy loads are applied, it cannot
exhibit sufficient durability.
Further, the lower limit of the temperature for
synthesizing aluminum titanate is 1,280°C, while the
lower limit of the temperature for synthesizing magnesium
titanate is 900°C. Both are unstable in the temperature

range lower than the temperatures for their syntheses.
As a solid solution of these compounds, aluminum
magnesium titanate is also unstable at a temperature
lower than the temperature range for its synthesis like
aluminum titanate and magnesium titanate. Accordingly,
if aluminum magnesium titanate is used in a decomposing
temperature range for long time, it is likely to undergo
thermal decomposition to form TiO2 (rutile) and MgAl2O4
(spinel). Here, the decomposing temperature range for
aluminum magnesium titanate varies depending on a solid
solution ratio of aluminum titanate and magnesium
titanate, but it is usually from about 800 to 1,280°C.
For example, in the case of an aluminum magnesium
titanate sintered product, in which aluminum titanate and
magnesium titanate are solid-solubilized in an
approximately equivalent molar ratio, the aluminum
magnesium titanate sintered product thermally decomposes
into TiO2 (rutile) and MgAl2O4 (spinel) (Non-Patent
Document 1) if it is continuously used at a temperature
in the vicinity of 1,100°C for long time.
Therefore, a conventional aluminum magnesium titanate
sintered product could not be used continuously in such a
decomposing temperature range, and regardless of its high
heat resistance, extremely small thermal expansion
coefficient and excellent corrosion resistance, the use
of the conventional aluminum magnesium titanate was
limited, because it had low reliability due to problems

in the thermal decomposition property and mechanical
strength.
Non-Patent Document 1: Journal of American Ceramic
Society, 1998, 81 [10], pp. 2645-2653
DISCLOSURE OF THE INVENTION
OBJECT TO BE ACCOMPLISHED BY THE PRESENT INVENTION
The present invention is made on the basis of the
above problems, and its object is to provide an aluminum
magnesium titanate crystal structure having high
mechanical strength, which has a low thermal
decomposition property and can be used continuously and
stably at high temperatures, while maintaining its high
heat resistance, extremely small thermal expansion
coefficient and high corrosion resistance, and a process
for its production.
MEANS TO ACCOMPLISH THE OBJECT
In order to solve the above problems, the present
inventors have conducted extensive studies and found that
an aluminum magnesium titanate crystal structure which is
a solid solution wherein some Al atoms in the surface
layer of aluminum magnesium titanate crystal are
substituted with Si atoms, can accomplish the above
object by doping a silicon-containing compound having a
melting point in a specific temperature range, preferably
by doping an aluminosilicate compound, to an aluminum

magnesium titanate solid solution crystal represented by
the empirical formula MgxAl2(1-X)Ti(1+X)O5 (wherein 0.1 and have accomplished the present invention on the basis
of this finding.
Accordingly, the present invention provides the
following aluminum magnesium titanate crystal structure
and process for its production.
(1) An aluminum magnesium titanate crystal structure,
which is a solid solution wherein at least some of Al
atoms in the surface layer of aluminum magnesium titanate
crystal represented by the empirical formula
MgxAl2(1-X)Ti(1+X)O5 (wherein 0.1 Si atoms, and which has a thermal expansion coefficient
of from -6x10-6(1/K) to 6x10-6(l/K) in a range of from 50
to 800°C at a temperature raising rate of 20°C/min, and a
remaining ratio of aluminum magnesium titanate of at
least 50%, when held in an atmosphere of 1,100oC for 300
hours.
(2) The aluminum magnesium titanate crystal structure as
defined in (1), which is a solid solution wherein 0.1 to
1 mol% of Al atoms are substituted with Si atoms.

(3) The aluminum magnesium titanate crystal structure
according to (1) or (2), which has a three-point bending
strength of at least 25 MPa in accordance with JIS R1601.
(4) A process for producing the aluminum magnesium
titanate crystal structure as defined in (1), which
comprises firing at a temperature of from 1,200 to

1,700°C, a raw material mixture having 1 to 10 parts by-
mass of a silicon-containing compound having a melting
point of from 700 to 1,500°C, mixed to 100 parts by mass
of a mixture comprising a Mg-containing compound, Al-
containing compound and Ti-containing compound in the
same ratio as the metal component ratio of Mg, Al and Ti
in aluminum magnesium titanate represented by the
empirical formula MgxAl2(1-X)Ti(1+X)O5 (wherein 0.1 calculated as the respective oxides.
(5) The process according to (4), wherein aluminum
magnesium titanate crystal is formed in a liquid phase of
the silicon-containing compound.
(6) The process according to (4) or (5), wherein molding
assistants are added to the raw material mixture,
followed by firing a molded product.
(7) The process according to any one of (4) to (6),
wherein the raw material mixture is subjected to
prefiring within a temperature range of from 700 to
1,000°C, followed by firing.
(8) The process according to any one of (4) to (7) ,
wherein the silicon-containing compound is an
aluminosilicate.
(9) The process according to (8), wherein the
aluminosilicate is a mineral selected from plagioclase,
feldspathoid, mica clay mineral, zeolite and cordierite.
EFFECT OF THE INVENTION

As mentioned above, according to the present
invention, a novel aluminum magnesium titanate crystal
structure having high thermal decomposition resistance
and high mechanical strength is provided, while
maintaining its inherent high heat resistance, extremely-
small thermal expansion coefficient and excellent thermal
shock resistance. The reason as to why an aluminum
magnesium titanate crystal structure having such
excellent properties is obtainable in accordance with the
present invention is not clearly understood, but may
probably be as follows.
In the present invention, in a case where the above-
mentioned silicon-containing compound having a specific
melting point is doped with the mixture that forms
aluminum magnesium titanate, the silicon-containing
compound in a state of liquid phase melts at a
temperature of from 700 to 1,500°C, and the formation of
aluminum magnesium titanate i.e. the reaction of aluminum
magnesium titanate formation takes place in a liquid
phase, whereby dense crystals will be formed thereby
improving its mechanical strength. Further, the Si
component contained in the silicon-containing compound,
is substituted for some Al atoms in the crystal lattice
of aluminum magnesium titanate for solid-solubilization.
However, it will be solid-solubilized preferentially in
the aluminum titanate crystal system rather than in the
magnesium titanate crystal system. The reason for this

is such that the strain of the octahedron constituting
the crystal structure of aluminum titanate is large among
pseudobrookite crystal structures, and the
crystallographic anisotropy is remarkable, whereby the
crystal structure is unstable as compared with magnesium
titanate.
Namely, Si is solid-solubilized preferentially in
the crystal lattice of aluminum titanate and mainly
occupies Al sites. At that time, rather than occupying
alone the Al sites where a fundamentally trivalent
electrical charge balance is maintained, tetravalent Si
will form a pair with bivalent Mg in the system so that
the pair of Si and Mg will be sexivalent in total and
will be substituted for adjacent two Al (sexivalent in
total). Thus, it is considered that by the simultaneous
presence of Si and Mg, diffusion of ions among the
respective cations can be suppressed even at high
temperatures, and a stable crystal structure can be
secured, whereby further improved thermal decomposition
resistance can be obtained.
BEST MODE FOR CARRYING OUT THE INVENTION
The aluminum magnesium titanate crystal structure of
the present invention is a solid solution wherein at
least some Al atoms in the surface layer of aluminum
magnesium titanate crystal represented by the empirical
formula MgxAl2(1-X)Ti(1+X)O5 are substituted with Si atoms.

In the present invention, at least Al atoms present in
the surface layer of aluminum magnesium titanate crystal
may be substituted with Si atoms, and of course, Al atoms
in the interior (deep layer) of aluminum magnesium
titanate may also be substituted with Si atoms. The
substitution with Si atoms is preferably as much as
possible within the range of the solid solubility limit.
Further, the value x is 0.1 preferably 0.25>x titanate crystal is preferably a solid solution in which
0.1 to 1 mol%, particularly preferably 0.2 to 0.7 mol%,
most preferably 0.25 to 0.45 mol% of Al atoms, are
substituted with Si atoms. In a case where this
substitution ratio is less than 0.1 mol%, stabilization
of crystals by solid-solubilization of Si atoms will be
insufficient, whereby high thermal decomposition
resistance will not be obtained. On the other hand, in a
case where this substitution ratio is more than 1 mol%,
it exceeds the solid solubility limit to a crystal of Si
atoms, whereby precipitation of an impurity phase will be
triggered, and such a substitution ratio does not
contribute to suppression of thermal decomposition and
causes an increase in the thermal expansion coefficient.
The crystal structure of the present invention, which
is a solid solution substituted with Si atoms, has an
extremely small thermal expansion coefficient of from
-6x10-6(l/K) to 6x10-6(l/K) and further from -3x10-6(l/K)

to 3xl0-6(l/K), when heated in a range of from 50 to 800°C
at a temperature raising rate of 20°C/min. As a result,
the heat shock resistance of the crystal structure is
extremely high and excellent.
Further, a characteristic of the aluminum magnesium
titanate crystal structure of the present invention
resides in high thermal decomposition resistance such
that the aluminum magnesium titanate crystal structure
can be used continuously and stably at high temperatures.
Such a thermal decomposition resistance is higher when
the remaining ratio of aluminum magnesium titanate held
in a high temperature atmosphere of 1,100°C for 3 00 hours
is at least 50%, higher when the remaining ratio is at
least 75%, and highest when the remaining ratio is at
least 90%. This is in contrast with Comparative Example
given hereinafter, wherein a conventional aluminum
magnesium titanate shows a remaining ratio of aluminum
magnesium titanate as low as about 35%. Accordingly, the
aluminum magnesium titanate crystal structure of the
present invention can provide a reliable material, which
can be used with stability for a long period of time at
high temperatures including a decomposing temperature
range of from 800 to 1,280°C as described above.
Furthermore, a characteristic of the aluminum
magnesium titanate crystal structure of the present
invention resides in its mechanical strength. That is,
on the basis of the measurement of a three-point bending

strength in accordance with JIS R16 01, the aluminum
magnesium titanate crystal structure has a three-point
bending strength of at least 25 MPa, preferably at least
30 MPa and most preferably at least 40 MPa. This is in
contrast with Comparative Example given hereinafter,
wherein a conventional aluminum magnesium titanate
crystal structure has a three-point bending strength as
low as about 10 MPa. Accordingly, the aluminum magnesium
titanate crystal structure of the present invention can
provide a material which is useful in a field where a
high mechanical strength is required and the conventional
aluminum magnesium titanate cannot be used.
The aluminum magnesium titanate crystal structure of
the present invention is produced by firing at a
temperature of from 1,200 to 1,700°C a raw material
mixture having 1 to 10 parts by mass of a silicon-
containing compound having a melting point of from 700 to
1,500°C, mixed to 100 parts by mass of a mixture
comprising a Mg-containing compound, Al-containing
compound and Ti-containing compound in the same ratio as
the metal component ratio of Mg, Al and Ti in aluminum
magnesium titanate represented by the empirical formula
MgxAl2(1-X)Ti(1+X)O5 (wherein 0.1 respective oxides.
The above Mg-containing compound, Al-containing
compound and Ti-containing compound to be used, are not
particularly limited so long as they are components

capable of synthesizing aluminum magnesium titanate by
firing. The Mg-containing compound, Al-containing
compound and Ti-containing compound may not necessarily
be separate compounds respectively, and may be a compound
containing two or more metal components. Such compounds
may usually be suitably selected among those to be used
as starting materials for various ceramics, such as
alumina ceramics, titania ceramics, magnesia ceramics,
aluminum titanate ceramics, magnesium titanate ceramics,
spinel ceramics and aluminum magnesium titanate ceramics.
Specific examples of such compounds include oxides such
as Al2O3, TiO2 and MgO, composite oxides containing at
least two types of metal components, such as MgAl2O4,
Al2TiO5, and various spinel structures containing Mg and
Ti, compounds containing one or more metal components
selected from the group consisting of Al, Ti and Mg (such
as carbonates, nitrates or sulfates).
The blend ratio of the Mg-containing compound, Al-
containing compound and Ti-containing compound is such
that the ratio of the metal components contained in these
compounds would be a ratio similar to, preferably
substantially the same ratio as, the metal component
ratio of Mg, Al and Ti in aluminum magnesium titanate
represented by the above empirical formula
MgxAl2(1-X)Ti(1+X)O5 . By using the above respective
compounds as mixed in such a ratio, it is possible to
obtain aluminum magnesium titanate having the same metal

component ratio as the metal component ratio in the
mixture used as the starting material.
When the aluminum magnesium titanate crystal
structure of the present invention is to be formed, a
silicon-containing compound having a melting point of
from 700 to 1,500°C is mixed to the mixture comprising
the Mg-containing compound, Al-containing compound and
Ti-containing compound. In such a case, the melting
point of the silicon-containing compound to be used is
important. If the melting point is less than 700°C, the
additive will melt before the presintering, whereby no
crystal structure having a sufficient strength will be
formed in the molded product. Whereas, if the melting
point is higher than 1,500°C, melting of the additive
takes place after the reaction for forming aluminum
magnesium titanate, the reaction for forming aluminum
magnesium titanate cannot be carried out in a liquid
phase, whereby solid-solubilization of Si atoms becomes
difficult, and therefore, the object of the present
invention cannot be accomplished. For example, in a case
where SiO2 having the melting point of l,723°C was
employed, no Si atom was confirmed in the interior of the
crystal structure to be obtained, and it was rather
separately deposited in the vicinity of crystal grains in
the form of SiO2. The melting point of the silicon-
containing compound is preferably from 900 to 1,300°C and
particularly preferably from 1,000 to 1,200°C.

As the above silicon-containing compound, an
aluminosilicate is preferred. As the aluminosilicate, a
natural mineral or a synthesized compound may be employed,
but an aluminosilicate mineral is particularly preferred
in view of its availability and cost. The
aluminosilicate mineral may, for example, be plagioclase,
feldspathoid, alkali feldspar, mica clay mineral, zeolite
or cordierite. Among them, alkali feldspar, plagioclase
or feldspathoid is particularly effective for enhanced
sintering of aluminum magnesium titanate because of its
low melting point.
The amount of the silicon-containing compound to be
used, is preferably from 1 to 10 parts by mass, more
preferably from 3 to 5 parts by mass, per 100 parts by
mass of the total amount, as calculated as oxides, of the
Mg-containing compound, Al-containing compound and Ti-
containing compound, even though it depends on the ratio
of Al atoms in aluminum magnesium titanate crystal to be
substituted with Si atoms. In such a case, the total
amount of the mixture as calculated as oxides, is the
weight after carrying out heat treatment to remove
moisture or organic substances contained in the above
mixture, or when presintering is carried out, the weight
before the main firing after the presintering.
In the present invention, to the raw material mixture
comprising the Mg-containing compound, Al-containing
compound, Ti-containing compound and silicon-containing

compound, other additives may be added, as the case
requires, whereby the nature of the crystal structure
thereby obtainable, can be improved. As such other
additives, oxides such as SiO2, ZrO2, Fe2O3, MgO, A12O3,
TiO2, CaO and Y2O3, or oxides having a spinel structure
containing Mg, may, for example, be mentioned. At least
one of these additives may be added preferably in an
amount of at most 15 parts by mass, per 100 parts by mass
of the above mixture.
The raw material mixture comprising the Mg-containing
compound, Al-containing compound, Ti-containing compound
and silicon-containing compound is thoroughly mixed and
pulverized. The mixing and pulverization of the raw
material mixture are not particularly limited and can be
carried out by known methods. For example, they may be
carried out by means of a ball mill, a medium-stirring
mill, etc. The pulverization degree of the above raw
material mixture is not particularly limited, but the
average particle size is preferably at most 30 µm,
particularly preferably from 8 to 15 µm. The smaller the
average particle size, the better, so long as it is
within a range where no secondary particles will be
formed.
The above mixture can be fired as it is, but
preferably the mixture is preliminarily molded into a
final form to be used and then fired. At the time of
molding, molding assistants may preferably be

incorporated to the above mixture. As such molding
assistants, known agents such as a binder, a release
agent, a defoaming agent and a peptizer may be employed.
As the binder, polyvinyl alcohol, microwax emulsion,
methylcellulose or carboxymethylcellulose may, for
example, be preferred. As the release agent, a stearic
acid emulsion may, for example, be preferred; as the
defoaming agent, n-octyl alcohol or octylphenoxyethanol
may, for example, be preferred; and as the peptizer,
diethylamine or triethylamine may, for example, be
preferred.
The amounts of the molding assistants are not
particularly limited. However, in the case of the
present invention, they are preferably within the
following ranges, respectively, as calculated as solid
contents, per 100 parts by mass of the total content, as
calculated as the respective oxides, of the Mg-containing
compound, Al-containing compound and Ti-containing
compound to be used as the starting materials. Namely,
it is preferred to use the binder in an amount of from
about 0.2 to 0.6 part by mass, the release agent in an
amount of from about 0.2 to 0.7 part by mass, the
defoaming agent in an amount of from about 0.5 to 1.5
parts by mass, and the peptizer in an amount of from
about 0.5 to 1.5 parts by mass. The raw material mixture
having such molding assistants incorporated, is mixed,
kneaded and molded. As a method for molding, press

molding, sheet molding, cast molding, extrusion molding,
injection molding or CIP molding may, for example, be
employed.
The molded product obtained is preferably dried and
then fired at from 1,200 to 1,700°C, preferably from
1,300 to 1,500°C. The firing atmosphere is not
particularly limited and is preferably an oxygen-
containing atmosphere such as air which is commonly
employed. The firing time is not particularly limited so
long as the firing can be done until the sintering
proceeds sufficiently, and it is usually at a level of
from 1 to 2 0 hours.
Also with respect to the temperature raising rate or
the temperature lowering rate at the time of the above
firing, there is no particular restriction, and such
conditions may be suitably set so that no cracks will be
formed in the obtainable sintered product. For example,
it is preferred to gradually raise the temperature
without rapid rise of the temperature to sufficiently
remove moisture and the molding assistants such as a
binder, etc. contained in the above mixture. Further, if
necessary, prior to heating at the above-mentioned firing
temperature, presintering may be carried out preferably
within a temperature range of from 700 to 1,0 0 0°C for
from 10 to 3 0 hours under mild temperature rise, whereby
the1 stress in the sintered product which causes cracking
during the formation of aluminum magnesium titanate, can

be relaxed, and formation of cracks in the sintered
product can be suppressed to obtain a uniform sintered
product.
The sintered product thus obtainable has excellent
heat resistance and a low thermal expansion coefficient
and yet has a crystal structure stabilized, and will thus
be a crystal structure having excellent thermal
decomposition resistance and high mechanical strength.
EXAMPLES
Now, the present invention will be described in
further detail with reference to Examples. However, it
should be understood that the present invention is by no
means thereby restricted.
EXAMPLES 1 to 5
To 100 parts by mass of a mixture comprising 26.7
mass% (20 mol%) of easily sinterable α-alumina, 62.8
mass% (60 mol%) of anatase-type titanium oxide and 10.5
mass% (20 mol%) of periclase-type magnesium oxide present
as a natural mineral, from 1 to 10 parts by mass of an
alkali feldspar represented by the chemical formula
(Na0.6K0.4) AlSi3O8 was added so as to have a solid solution
ratio (substitution ratio) of Si atoms indicated in Table
1, and then 0.25 part by mass of polyvinyl alcohol as a
binder, 1 part by mass of diethylamine as a peptizer, and
0.5 part by mass of polypropylene glycol as a defoaming
agent, were further added and mixed for 3 hours in a ball

mill and then dried in a dryer at 120°C for at least 12
hours to obtain a raw material powder.
The obtained raw material powder was pulverized to
about 15 0 mesh and subjected to pressing under the
molding pressure of 60 MPa to obtain a 100 mm x 100 mm x
10 mm molded product.
The molded product thus obtained was further
subjected to firing in accordance with the following
heating pattern, followed by letting it stand to cool, to
obtain an aluminum magnesium titanate sintered product.
(Heating Pattern)
From room temperature to 14 0°C for 21 hours
Maintained at 14 0°C for 14 hours
From 140°C to 216°C for 21 hours
From 216°C to 295°C for 16 hours
From 295°C to 379°C for 46 hours
From 379°C to 458°C for 20 hours
From 4 5 8°C to 7 00°C for 28 hours
Maintained at 7 00°C for 3 hours
From 700°C to 1,000°C for 26 hours
From 1,000°C to 1,400°C for 3 hours
Maintained at 1,400°C for 4 hours
COMPARATIVE EXAMPLE 1
An aluminum magnesium titanate sintered product was
obtained in the same manner as in Examples 1 to 5 except
that the alkali feldspar was not added.
The sintered products obtained in Examples 1 to 5 as

the crystal structures were polished to prepare test
specimens. Such specimens were subjected to observation
under TEM (Transmission Electron Microscope) and to EDX
elemental analysis, whereby the presence of solid-
solubilized Si ions inside the crystal grains of Examples
1 to 5 were confirmed. Then, the crystal structures of
Examples 1 to 5 were further subjected to the 29Si
spectrum analysis by means of NMR (Nuclear Magnetic
Resonance), and as a result, Si atoms were found to be
present in the crystal structures as having a
coordination number of 6. This indicates that from the
silicon-containing compound, in which Si atoms have a
coordination number of 4, Al atoms (coordination number
of 6) are substituted by the reaction in the liquid phase
i.e. by solid-solubilization.
Further, diffraction peaks of aluminum magnesium
titanate crystal were examined from the results obtained
by means of the XRD measurement of the sintered products
of Examples 1 to 5 and the crystal structure of
Comparative Example 1. The diffraction peaks derived
from Examples 1 to 5 were shifted to low-angle side as
compared with Comparative Example 1, and each shift was
calculated so as to obtain the solid-solubility ratio
(substitution ratio) of Si atoms in the crystal.
Further, in accordance with JIS R1618, a test
specimen of 5 mm x 5 mm x 20 mm was cut out from each of
the sintered products of Examples 1 to 5 and Comparative

Example 1 and subjected to surface polishing, and then
the thermal expansion coefficient was calculated on the
basis of the expansion in a lengthwise direction when
heated in a range of from 50°C to 800°C at a temperature
raising rate of 2 0°C/min. The results are shown in Table
1.
Furthermore, a test specimen of 10 mm x 10 mm x 10 mm
was cut out from each of the sintered products of
Examples 1 to 5 and the crystal structure of Comparative
Example 1 and held in the atmosphere of 1,100°C, and then
the remaining ratio α (%) of aluminum magnesium titanate
upon expiration of 3 00 hours was calculated. The results
are shown in Table 1.
The remaining ratio of the aluminum magnesium
titanate was obtained by means of the XRD measurement in
accordance with the following method.
Firstly, when aluminum magnesium titanate undergoes
thermal decomposition, TiO2 (rutile) and MgAl2O4 (spinel)
will be formed. Accordingly, by using the integrated
intensity (ITIO2(110)) of the diffraction peak at the (110)
face of rutile and the integrated intensity (IMAT(023)) of
the diffraction peak at the (023) face of aluminum
magnesium titanate, the intensity ratio R of aluminum
magnesium titanate to rutile was obtained by the
following formula:
R=IMAT(023) / ( IMAT(023) + (ITIO2(110))
Further, also with respect to the sintered product

before carrying out the thermal treatment at 1,100°C, the
intensity ratio R0 of aluminum magnesium titanate to
rutile was obtained in the same manner.
Then, using R and R0 obtained as described above, the
remaining ratio α (%) of aluminum magnesium titanate was
obtained by the following formula:
α=(R/R0) x 100
Then, a test specimen of 3 mm x 4 mm x 40 mm was cut
out from each of the sintered products of Examples 1 to 5
and Comparative Example 1 and subjected to surface
polishing and edge grinding (removal of sharp edges).
The three-point bending strengths of such test specimens
were measured in accordance with JIS R1601. The results
are shown in Table 1.


As is evident from Table 1, the solid solution
wherein some Al atoms in aluminum magnesium titanate
crystal are substituted with Si atoms, has a high
remaining ratio of aluminum magnesium titanate crystal as
compared with Comparative Example 1, while maintaining
its low thermal expansion property. Further, the crystal
structures in Examples 1 to 5 have excellent mechanical
properties in comparison with Comparative Example 1.
EXAMPLES 6 to 10
To 100 parts by mass of a mixture comprising 26.7
mass% (20 mol%) of easily sinterable α-alumina, 62.8
mass% (60 mol%) of anatase-type titanium oxide and 10.5
mass% (20 mol%) of periclase-type magnesium oxide present
as a natural mineral, an aluminosilicate mineral having a
melting point and a chemical formula shown in Table 2 was
added so that it would be 1 part by mass as calculated as
SiO2.
Other than the above conditions, aluminum magnesium
titanate sintered products were obtained in the same
manner as in Examples 1 to 5. A test specimen was cut
out from each of the obtained sintered products in the
same manner as in Examples 1 to 5, and the thermal
expansion coefficient, remaining ratio a (%) of aluminum
magnesium titanate and three-point bending strength were
measured. The results are shown in Table 3.


As is evident from Table 3, the aluminum magnesium
titanate crystal structures obtained in Examples 6 to 10,
which were subjected to liquid-phase sintering by a Si-
containing compound that melts at the temperature at
which aluminum magnesium titanate crystal is formed, had
low thermal expansion properties, high remaining ratio a
(%) of aluminum magnesium titanate crystal and high
mechanical strength, as compared with Comparative

Example 1.
INDUSTRIAL APPLICABILITY
According to the present invention, a novel aluminum
magnesium titanate crystal structure having high thermal
decomposition resistance and high mechanical strength is
provided while maintaining its excellent heat resistance,
extremely small thermal expansion coefficient and
excellent thermal shock resistance. Such a crystal
structure may, for example, be employed suitably in a
wide range of fields e.g. a jig for furnace such as a
crucible, a setter, a sagger or a refractory lining; a
catalyst carrier or a filter for cleaning exhaust gas
from e.g. a diesel engine or a gasoline engine; parts for
a power generator; and an electronic component such as a
substrate or a capacitor.

We Claim :
1. An aluminum magnesium titanate crystal structure,
which comprises a solid solution wherein at least some of
Al atoms in the surface layer of aluminum magnesium
titanate crystal represented by the empirical formula
Mgx Al2(1-x)Ti(1+x)O5 (wherein 0.1 atoms, and which has a thermal expansion coefficient of
from -6X10-6(1/K) to 6X10-6(1/K) in a range of from 50 to
800 °C at a temperature raising rate of 20°C/min, and a
remaining ratio of aluminum magnesium titanate of at least
50%, that does not undergo any decomposition, when held
in an atmosphere of 1,100°C for 300 hours.
2. The aluminum magnesium titanate crystal structure as
claimed in Claim 1, wherein the solid solution is a solid
solution wherein 0.1 to 1 mol% of Al atoms are substituted
with Si atoms.
3. The aluminum magnesium titanate crystal structure as
claimed in Claim 1 or 2, which has a three-point bending
strength of at least 25 MPa in accodance with JIS R1601.
4. A process for producing the aluminum magnesium
titanate crystal structure as claimed in Claim 1, which
comprises firing at a temperature of from 1,200 to

1,700°C, a raw material mixture having 1 to 10 parts by
mass of a silicon-containing compound such as herein
described having a melting point of from 700 to 1,500°C
mixed to 100 parts by mass of a mixture comprising a Mg-
containing compound such as herein described, Al-
containing compound such as herein described and Ti-
containing compound such as herein described in the same
ratio as the metal component ratio of Mg, Al and Ti in
aluminum magnesium titanate represented by the empirical
formula Mgx Al2(1-X)Ti(1+x)O5 (wherein 0.1 as the respective oxides.
5. The process as claimed in Claim 4, wherein aluminum
magnesium titanate crystal is formed in a liquid phase of
the silicon-containing compound.
6. The process as claimed in Claim 4 or 5, wherein molding
assistants are added to the raw material mixture, followed
by firing a molded product.
7. The process as claimed in any one of Claims 4 to 6,
wherein the raw material mixture is subjected to prefiring
within a temperature range of from 700 to 1000°C followed
by firing.
8. The process as claimed in any one of Claims 4 to 7,

wherein the silicon-containing compound is an
aluminosilicate.
9. The process as claimed in claim 8, wherein the
aluminosilicate is a mineral selected from plagioclase,
feldspathoid, mica clay mineral, zeolite and cordierite.
10. A process for producing the aluminum magnesium
titanate crystal structure, which comprises firing at a
temperature of from 1,200 to 1,700°C, the raw material
mixture having 1 to 10 parts by mass of a silicon-
containing compound selected from plagioclase,
feldspathoid, mica clay mineral, zeolite or cordierite,
which has a melting point of from 700 to 1,500°C, mixed to
100 parts by mass of a mixture comprising a Mg-containing
compound, Al-containing compound and Ti-containing
compound in the same ratio as the metal component ratio of
Mg, Al and Ti in aluminum magnesium titanate represented
by the empirical formula Mgx Al2(1-x)Ti(1+x)O5 (wherein
0.1

ABSTRACT

ALUMINIUM MAGNESIUM TITANATE CRYSTAL
STRUCTURE, AND PROCESS FOR ITS PRODUCTION
The invention discloses an aluminum magnesium titanate
crystal structure, which comprises a solid solution
wherein at least some of Al atoms in the surface layer of
aluminum magnesium titanate crystal represented by the
empirical formula Mgx Al2(1-x)Ti(1+X)O5 (wherein 0.1 substituted with Si atoms, and which has a thermal
expansion coefficient of from -6X10-6(1/K) to 6X10-6(1/K)
in a range of from 50 to 800°C at a temperature raising
rate of 20°C/min, and a remaining ratio of aluminum
magnesium titanate of at least 50%, that does not undergo
any decomposition, when held in an atmosphere of 1,100°C
for 300 hours.
The invention is also for a process for protection of said
crystal structure.

Documents:

03089-kolnp-2006 abstract.pdf

03089-kolnp-2006 claims.pdf

03089-kolnp-2006 correspondence others.pdf

03089-kolnp-2006 description(complete).pdf

03089-kolnp-2006 form-1.pdf

03089-kolnp-2006 form-3.pdf

03089-kolnp-2006 form-5.pdf

03089-kolnp-2006 general power of authority.pdf

03089-kolnp-2006 international publication.pdf

03089-kolnp-2006 international search authority report.pdf

03089-kolnp-2006 pct others.pdf

03089-kolnp-2006 priority document.pdf

3089-KOLNP-2006-ABSTRACT 1.1.pdf

3089-KOLNP-2006-AMANDED PAGES OF SPECIFICATION.pdf

3089-KOLNP-2006-ASSIGNMENT.pdf

3089-KOLNP-2006-CLAIMS.pdf

3089-KOLNP-2006-CORRESPONDENCE.pdf

3089-KOLNP-2006-DESCRIPTION (COMPLETE) 1.1.pdf

3089-KOLNP-2006-EXAMINATION REPORT REPLY RECIEVED.pdf

3089-KOLNP-2006-EXAMINATION REPORT.pdf

3089-KOLNP-2006-FORM 1 1.1.pdf

3089-KOLNP-2006-FORM 13.pdf

3089-kolnp-2006-form 18.pdf

3089-KOLNP-2006-FORM 2.pdf

3089-KOLNP-2006-FORM 3 1.1.pdf

3089-KOLNP-2006-FORM 3.pdf

3089-KOLNP-2006-FORM 5.pdf

3089-KOLNP-2006-GPA.pdf

3089-KOLNP-2006-GRANTED-ABSTRACT.pdf

3089-KOLNP-2006-GRANTED-CLAIMS.pdf

3089-KOLNP-2006-GRANTED-DESCRIPTION (COMPLETE).pdf

3089-KOLNP-2006-GRANTED-FORM 1.pdf

3089-KOLNP-2006-GRANTED-FORM 2.pdf

3089-KOLNP-2006-GRANTED-SPECIFICATION.pdf

3089-KOLNP-2006-OTHERS 1.1.pdf

3089-KOLNP-2006-OTHERS.pdf

3089-KOLNP-2006-PETITION UNDER RULE 137.pdf

3089-KOLNP-2006-REPLY TO EXAMINATION REPORT 1.1.pdf

3089-KOLNP-2006-TRANSLATED COPY OF PRIORITY DOCUMENT.pdf


Patent Number 253627
Indian Patent Application Number 3089/KOLNP/2006
PG Journal Number 32/2012
Publication Date 10-Aug-2012
Grant Date 07-Aug-2012
Date of Filing 25-Oct-2006
Name of Patentee OHCERA CO., LTD.
Applicant Address 1-19, UCHIHONMACHI 2-CHOME CHUOU-KU OSAKA-SHI OSAKA 540-0026
Inventors:
# Inventor's Name Inventor's Address
1 FUKUDA TSUTOMU 785-1, KUNIKANE KAMISO-CHO KAKOGAWA-SHI HOYOGO
2 FUKUDA MASAAKI 785-1, KUNIKANE KAMISO-CHO KAKOGAWA-SHI HYOGO
3 YOKO TOSHINOBU 31-1-120, TODOMONNOMAE UJI-SHI KYOTO
4 TAKAHASHI MASAHIDE KYODAI SHOKUINSHUKUSHA 1-113 GOKASHO KANYUCHI UJI-SHI KYOTO
5 FUKUDA MASAHIRO 94-1-603, OCHIAI MAKISHIMA-CHO UJI-SHI KYOTO
PCT International Classification Number C04B 35/478
PCT International Application Number PCT/JP2005/008226
PCT International Filing date 2005-04-28
PCT Conventions:
# PCT Application Number Date of Convention Priority Country
1 2004-134662 2004-04-28 Japan