Title of Invention

A PROCESS FOR PREPARING THE AGGREGATED CRYSTALLINE SILICON POWDER

Abstract A process for preparing the aggregated crystalline silicon powder having a BET surface area of 20 to 150 m2/g and which is doped with phosphorus, arsenic, antimony, bismuth, boron, aluminium, gallium, indium, thallium, europium, erbium, cerium, praseodymium, neodymium, samarium, gadolinium, terbium, dysprosium, holmium, thulium, lutetium, lithium, ytterbium, germanium, iron, ruthenium, osmium, cobalt, rhodium, iridium, nickel, palladium, platinum, copper, silver, gold or zinc characterized in that at least one vaporous or gaseous silane and at least one vaporous or gaseous doping material, an inert gas and hydrogen are subjected to heat in a hot wall reactor, the reaction mixture is cooled down or allowed to cool down and the reaction product is separated from the gaseous substances in the form of a powder, wherein the proportion of silane is between 0.1 and 90 wt.%, with respect to the sum of silane, doping material, hydrogen and inert gases and wherein the proportion of hydrogen, with respect to the sum of hydrogen, silane, inert gas and doping material is in the range 1 mol.% to 96 mol.%.
Full Text Nanoscale crystalline silicon powder
The invention provides a nanoscale crystalline silicon
powder and the preparation and use thereof.
It is known that an aggregated nanoscale silicon powder can
be prepared in a hot wall reactor (Roth et al., Chem. Eng.
Technol. 24 (2001), 3). The disadvantage of this process
has proven to be that the desired crystalline silicon is
produced along with amorphous silicon which is formed by
the reaction of silane at the hot reactor walls. In
addition, the crystalline silicon has a low BET surface
area.of less than 20 m2/g and thus is generally too coarse
for electronic applications.
Furthermore, Roth et al do not disclose a process in which
doped silicon powders are obtained. Such doped silicon
powders, with their semiconductor properties, are very
important in the electronics industry- Furthermore, it is a
disadvantage that silicon powder is deposited on the
reactor walls and acts as a thermal insulator. This changes
the temperature profile in the reactor and thus also
changes the properties of the silicon powder.
The object of the invention is the provision of a silicon
powder which avoids the disadvantages of the prior art. In
particular, the silicon powder should be one with a uniform
modification.
The invention is also intended to provide a process by
which this powder can be prepared on an industrial scale in
an economically viable manner.
The invention provides an aggregated crystalline silicon
powder with a BET surface area of 2 0 to 150 m2/g.

In a preferred embodiment, the silicon powder according to
the invention may have a BET surface area of 40 to
120 m2/g.
The expression aggregated is understood to mean that the
spherical or largely spherical particles which are
initially formed in the reaction coalesce to form
aggregates during the course of further reaction. The
extent of growth may be affected by the process parameters.
These aggregates may form agglomerates during the course of
further reaction. In contrast to aggregates, which
generally cannot or can only partly be broken down into the
primary particles, agglomerates form only a loose
association of aggregates which can easily be broken down
into the aggregates.
The expression crystalline is understood to mean that at
least 90% of the powder is crystalline. This degree of
crystallinity can be determined by comparing the
intensities of the [111] - [220] and [311] signals of the
powder according to the invention with those of a silicon
powder of known crystallinity and crystallite size.
In the context of the invention, a silicon powder with a
degree of crystallinity of at least 95%, particularly
preferably one with at least 98% crystallinity, is
preferred. The evaluation of TEM images and the counting of
primary particles which exhibit lattice lines, as a feature
of the crystalline state, is suitable for determining this
degree of crystallisation.
Furthermore, the silicon powder according to the invention
may be doped. The doping components may be phosphorus,
arsenic, antimony, bismuth, boron, aluminium, gallium,
indium, thallium, europium, erbium, cerium, praseodymium,
neodymium, samarium, gadolinium, terbium, dysprosium,
holmium, thulium, lutetium, lithium, ytterbium, germanium,

iron, ruthenium, osmium, cobalt, rhodium, iridium, nickel,
palladium, platinum, copper, silver, gold or zinc.
Particularly preferred, especially when used as a
semiconductor in electronic components, the doping
components may be the elements phosphorus, arsenic,
antimony, bismuth, boron, aluminium, gallium, indium,
thallium, europium, erbium, cerium, praseodymium,
neodymium, samarium, gadolinium, terbium, dysprosium,
holmium, thulium, ytterbium, lutetium. The proportion of
these present in silicon powder according to the invention
may be up to 1 wt.%. In general, a silicon powder is
required in which the doping component is present in the
ppm or even the ppb range. A range of 1013 to 1015 atoms of
doping component per cm3 is preferred.
Furthermore, it is possible for silicon powder according to
the invention to contain lithium as a doping component. The
proportion of lithium present in the silicon powder may be
up to 53 wt.%. Silicon powder with up to 20 to 40 wt.% of
lithium may be particularly preferred.
Similarly, silicon powder according to the invention may
contain germanium as a doping component. The proportion of
germanium present in the silicon powder may be up to
40 wt.%. Silicon powder with up to 10 to 30 wt.% of
germanium may be particularly preferred.
Finally, the elements iron, ruthenium, osmium, cobalt,
rhodium, iridium, nickel, palladium, platinum, copper,
silver, gold, zinc may also be doping components in the
silicon powder. The proportion of these present may be up
to 5 wt.% of the silicon powder.
The doping components may be uniformly distributed in the
powder or they may be enriched or intercalated in the shell
or the core of the primary particles. The doping components
may preferably be incorporated at silicon lattice sites.

This depends substantially on the type of doping material
and on reaction management.
A doping component in the context of the invention is
understood to be the element present in the powder
according to the invention. A doping material is understood
to be the compound used in the process in order to obtain
the doping component.
The silicon powder according to the invention may also have
a hydrogen loading of up to 10 mol. %, wherein a range of 1
to 5 mol.% is particularly preferred. NMR spectroscopic
methods such as, for example, 1H-MAS-NMR spectroscopy or IR
spectroscopy are suitable for determining this.
The invention also provides a process for preparing the
silicon powder according to the invention, characterised in
that
at least one vaporous or gaseous silane and
optionally at least one vaporous or gaseous doping
material, an inert gas and
hydrogen
are subjected to heat in a hot wall reactor,
the reaction mixture is cooled down or allowed to
cool down and
the reaction product is separated from the gaseous
substances in the form of a powder,
wherein the proportion of silane is between 0.1 and
90 wt.%, with respect to the sum of silane, doping
material, hydrogen and inert gases, and
wherein the proportion of hydrogen, with respect to
the sum of hydrogen, silane, inert gas and
optionally doping material is in the range 1 mol.%
to 96 mol.%.

Particularly advantageously, a wall-heated hot wall reactor
may be used, wherein the hot wall reactor has a size such
that as complete as possible conversion of the feedstock
and optionally of doping material is achieved. In general
the residence time in the hot wall reactor is between 0.1 s
and 2 s. The maximum temperature in the hot wall reactor is
preferably chosen in such a way that it does not exceed
1000°C.
Cooling the reaction mixture may be performed, for example,
by external wall-cooling of the reactor or by the
introduction of an inert gas in a quenching process.
A silane in the context of the invention may be a silicon-
containing compound which provides silicon, hydrogen,
nitrogen and/or halogens under the conditions of reaction.
SiH4, Si2H6, ClSiH3, Cl2SiH2, Cl3SiH and/or SiCl4 may
preferably used, wherein SiH4 is particularly preferred. In
addition, it is also possible to use N(SiH3)3, HN(SiH3)2,
H2N(SiH3), (H3Si)2NN(SiH3)2, (H3Si)NHNH (SiH3) , H2NN(SiH3)2.
Preferably, hydrogen-containing compounds of phosphorus,
arsenic, antimony, bismuth, boron, aluminium, gallium,
indium, thallium, europium, erbium, cerium, praseodymium,
neodymium, samarium, gadolinium, terbium, dysprosium,
holmium, thulium, ytterbium, lutetium, lithium, germanium,
iron, ruthenium, osmium, cobalt, rhodium, iridium, nickel,
palladium, platinum, copper, silver, gold, zinc can be
used. Diborane and phosphane or substituted phosphanes such
as tBuPH2, tBu3P, tBuPh2P and trismethylaminophosphane
((CH3)2N)3P are particularly preferred. In the case of
lithium as a doping component, it has proven most
beneficial to use the metal lithium or lithium amide LiNH2
as the doping material.
Mainly nitrogen, helium, neon or argon may be used as an
inert gas, wherein argon is particularly preferred.

The invention also provides use of the powder according to
the invention to produce electronic components, electronic
circuits and electrically active fillers.
The silicon powder according to the invention is free of
amorphous constituents and has a high BET surface area. The
process according to the invention does not lead to the
deposition of silicon on the reactor wall, as is described
in the prior art. Furthermore, the process according to the
invention enables the production of doped silicon powder.

Examples;
Analytical techniques; The BET surface area is determined
in accordance with DIN 66131. The degree of doping is
determined using glow discharge mass spectrometry (GDMS) .
The hydrogen loading is determined using 1H-MAS-NMR
spectroscopy.
Apparatus used:
A tube with a length of 200 cm and a diameter of 6 cm is
used as a hot wall reactor. It consists of quartz glass or
Si/SiC with a quartz glass liner. The tube is heated to
1000 °C externally using resistance heating over a length
of 100 cm.
A SiH4/argon mixture (mixture 1) of 1000 sccm of
silane (standard centimetre cube per minute; 1 sccm = 1 cm3
of gas per minute with reference to 0°C and atmospheric
pressure) and 3 000 sccm of argon and a mixture of argon and
hydrogen (mixture 2) , 5000 sccm of each, are supplied from
above the hot wall reactor via a two-fluid nozzle. The
pressure in the reactor is 1080 mbar. The powdered product
is separated from gaseous substances in a downstream filter
unit.
The powder obtained has a BET surface area of 20 m2/g.

Examples 2 to 6 are performed in the same way as example 1,
but the parameters are modified. The parameters are given
in table 1.



WE CLAIM:
1. A process for preparing the aggregated crystalline silicon powder
having a BET surface area of 20 to 150 m2/g and which is doped with
phosphorus, arsenic, antimony, bismuth, boron, aluminium, gallium,
indium, thallium, europium, erbium, cerium, praseodymium,
neodymium, samarium, gadolinium, terbium, dysprosium, holmium,
thulium, lutetium, lithium, ytterbium, germanium, iron, ruthenium,
osmium, cobalt, rhodium, iridium, nickel, palladium, platinum, copper,
silver, gold or zinc characterized in that at least one vaporous or
gaseous silane and at least one vaporous or gaseous doping material,
an inert gas and hydrogen are subjected to heat in a hot wall reactor,
the reaction mixture is cooled down or allowed to cool down and
the reaction product is separated from the gaseous substances in the
form of a powder,
wherein the proportion of silane is between 0.1 and 90 wt.%, with
respect to the sum of silane, doping material, hydrogen and inert gases
and
wherein the proportion of hydrogen, with respect to the sum of
hydrogen, silane, inert gas and doping material is in the range 1 mol.%
to 96 mol.%.
2. A process as claimed in claim 1, wherein the silane is chosen from the
group of compounds SiH4, Si2H6, CISiH3, CI2SiH2, CI3SiH and/or SiCI4.
3. A process as claimed in claim 1 or 2, wherein the silane to be used is
chosen from the group of compounds N(SiH3)3, HN(SiH3)2, H2N(SiH3),
(H3Si)2NN(SiH3)2, (H3Si)NHNH(SiH3), H2NN(SiH3)2.

4. A process as claimed in claims 1 to 3, wherein the doping material is
chosen from the group of hydrogen-containing compounds of
phosphorus, arsenic, antimony, bismuth, boron, aluminium, gallium,
indium, thallium, europium, erbium, cerium, praseodymium,
neodymium, samarium, gadolinium, terbium, dysprosium, holmium,
thulium, ytterbium, lutetium, lithium, germanium, iron, ruthenium,
osmium, cobalt, rhodium, iridium, nickel, palladium, platinum, copper,
silver, gold, zinc.
5. A process as claimed in claims 1 to 4, wherein the doping material is
lithium metal or lithium amide (LiNH2).
6. A process as claimed in claims 1 to 5, wherein nitrogen, helium, neon,
argon are used as inert gases.


A process for preparing the aggregated crystalline silicon powder having a BET
surface area of 20 to 150 m2/g and which is doped with phosphorus, arsenic,
antimony, bismuth, boron, aluminium, gallium, indium, thallium, europium,
erbium, cerium, praseodymium, neodymium, samarium, gadolinium, terbium,
dysprosium, holmium, thulium, lutetium, lithium, ytterbium, germanium, iron,
ruthenium, osmium, cobalt, rhodium, iridium, nickel, palladium, platinum, copper,
silver, gold or zinc characterized in that at least one vaporous or gaseous silane
and at least one vaporous or gaseous doping material, an inert gas and
hydrogen are subjected to heat in a hot wall reactor, the reaction mixture is
cooled down or allowed to cool down and the reaction product is separated from
the gaseous substances in the form of a powder, wherein the proportion of silane
is between 0.1 and 90 wt.%, with respect to the sum of silane, doping material,
hydrogen and inert gases and wherein the proportion of hydrogen, with respect
to the sum of hydrogen, silane, inert gas and doping material is in the range 1
mol.% to 96 mol.%.

Documents:

01748-kolnp-2006 abstract.pdf

01748-kolnp-2006 assignment.pdf

01748-kolnp-2006 claims.pdf

01748-kolnp-2006 correspondence others.pdf

01748-kolnp-2006 correspondence.pdf

01748-kolnp-2006 description(complete).pdf

01748-kolnp-2006 form-1.pdf

01748-kolnp-2006 form-18.pdf

01748-kolnp-2006 form-2.pdf

01748-kolnp-2006 form-3.pdf

01748-kolnp-2006 form-5.pdf

01748-kolnp-2006 international publication.pdf

01748-kolnp-2006 international search authority report.pdf

01748-kolnp-2006 pct form.pdf

01748-kolnp-2006 priority document.pdf

01748-kolnp-2006-correspondence others-1.1.pdf

1748-KOLNP-2006-CORRESPONDENCE-1.1.pdf

1748-kolnp-2006-correspondence.pdf

1748-kolnp-2006-examination report.pdf

1748-kolnp-2006-form 13.pdf

1748-kolnp-2006-form 18.pdf

1748-kolnp-2006-form 2.pdf

1748-kolnp-2006-form 3.pdf

1748-kolnp-2006-form 5.pdf

1748-kolnp-2006-granted-abstract.pdf

1748-kolnp-2006-granted-claims.pdf

1748-kolnp-2006-granted-description (complete).pdf

1748-kolnp-2006-granted-form 1.pdf

1748-kolnp-2006-granted-form 2.pdf

1748-kolnp-2006-granted-specification.pdf

1748-kolnp-2006-others-1.1.pdf

1748-KOLNP-2006-OTHERS.pdf

1748-kolnp-2006-pa.pdf

1748-KOLNP-2006-PETITION UNDER RULE 137.pdf

1748-kolnp-2006-reply to examination report.pdf

1748-KOLNP-2006.pdf


Patent Number 250115
Indian Patent Application Number 1748/KOLNP/2006
PG Journal Number 49/2011
Publication Date 09-Dec-2011
Grant Date 07-Dec-2011
Date of Filing 22-Jun-2006
Name of Patentee EVONIK DEGUSSA GMBH
Applicant Address RELLINGHAUSER STRASSE 1-11, 45128 ESSEN, GERMANY
Inventors:
# Inventor's Name Inventor's Address
1 DR. HARTMUT WIGGERS RIESWEG 33, 48734 REKEN
2 DR. FRANK-MARTIN PETRAT GRUNER WINKEL 31, 48151 MUNSTER
3 MICHAEL KRAMER DRESDENER STRASSE 30, 61137 SCHONECK-KILIANSTADTEN
4 DR. MARKUS PRIDOHL ROBERT-KOCH-WEG 7, 63538 GROBKROTZENBURG
5 PROF. PAUL ROTH TUMPWEG 17, 47906 KEMPEN
PCT International Classification Number C01B 33/02
PCT International Application Number PCT/EP2004/012890
PCT International Filing date 2004-11-13
PCT Conventions:
# PCT Application Number Date of Convention Priority Country
1 10353995.6 2003-11-19 Germany