Title of Invention

A JOINING MATERIAL FOR POSITIONING BRAZING MATERIAL ON A HONEYCOMB BODY AND A PROCESS OF PRODUCING A HONEYCOMB BODY

Abstract The joining material (1) according to the invention for positioning solder material (3) on at least one discrete joining region (18) of an at least partially metallic surface (7, 17) , is distinguished by the fact that a solder material (3) is formed discontinuously on a continuous carrier material (2). The joining material (1) according to the invention can particularly advantageously be used for the production of honeycomb bodies (19), since the joining material (1) makes it easy to join adjacent layers (7, 17) of the honeycomb body (19) only at discrete joining regions (18). It is in this way possible to produce honeycomb bodies (19) which are elastic and yet durable.
Full Text - 1 -
Joining material for positioning solder material,
process for producing a honeycomb body, and
corresponding honeycomb body
The present invention relates to a joining material for
positioning solder material on a metallic surface, to a
process for producing a honeycomb body using a joining
material of this type, to a corresponding honeycomb
body and to a motor vehicle having a corresponding
honeycomb body. These honeycomb bodies are preferably
used in the exhaust system of automobiles, in
particular as a catalyst support body or a filter body.
Honeycomb bodies are generally formed from ceramic
material or as a metallic honeycomb structure. A
distinction is drawn in particular between two typical
forms of metallic honeycomb bodies. An early form, of
which DE 29 02 779 Al shows typical examples, is the
helical form, in which substantially one smooth sheet-
metal layer and one corrugated sheet-metal layer are
placed on top of one another and wound helically. In a
different form, the honeycomb body is built up from a
multiplicity of alternately arranged smooth and
corrugated or differently corrugated sheet-metal
layers, with the sheet-metal layers initially forming
one or more stacks, which are then intertwined with one
another. In the process, the ends of all the sheet-
metal layers come to lie on the outer side and can be
joined to a housing or tubular casing, resulting in the
formation of numerous joins, which increase the
durability of the honeycomb body. Typical examples of
these forms are described in EP 0 245 737 Bl or
WO 90/03220.
If the honeycomb body is built up from metallic or at
least partially metallic layers, joining techniques
have to be used to connect these layers to one another

- 2 -
so as to obtain a durable honeycomb body. Since high
temperatures regularly occur in the exhaust system of a
motor vehicle, honeycomb bodies are generally soldered
at high temperatures, i.e. are subjected to what is
known as a brazing or hard-soldering process. In the
exhaust system, honeycomb bodies are exposed to high
mechanical loads, which are caused on the one hand by
shocks in the automobile which are also transmitted to
the honeycomb body, and on the other hand are thermally
induced. The high temperatures of the exhaust-gas
stream and the pulsating nature of the exhaust gas
cause high mechanical stresses in the honeycomb body.
In particular in the case of honeycomb bodies which are
used as a catalyst support body, these stresses are
amplified still further by the fact that the reaction
catalyzed by the catalyst applied to the catalyst
support body is generally exothermic. Overall, a
honeycomb body in the exhaust system is exposed to high
thermal gradients and transients. This exposes the
honeycomb body to high thermal deformation. If the
honeycomb body is rigid, i.e. the layers are joined to
adjacent layers in joining regions over the entire
cross section and length of the honeycomb body, thermal
fractures can easily occur, and for this reason a
honeycomb body which is as flexible as possible, and
therefore has the minimum possible number of joining
locations between the layers, is desirable. On the
other hand, an insufficient number of joining locations
leads to the occurrence of fatigue fractures at a
relatively early time.
Therefore, the aim is for the layers of honeycomb
bodies to be joined to one another only at defined,
discrete joining regions. For example, DE 103 38 360
has disclosed a process in which a binder in droplet
form is applied only to those locations of the layers
which are subsequently to be joined to one another.

- 3 -
After the layers have been wound or stacked and inter-
twined, solder in powder form is applied. A similar
process is known from EP 0 422 000, in which the binder
is applied using a sponge and then pulverulent solder
material is introduced. It is also known from
DE 37 11 626 to apply the solder by thermal spraying.
In this case, discrete joining locations are achieved
by the thermal spraying taking place through a
corresponding mask. Furthermore, DE 33 12 944 Al
discloses that the offset application of solder to
layers of a honeycomb body is advantageous for the
thermal expansion properties.
All the processes disclosed here for the application of
solder only in discrete joining regions are relatively
complex, since suitable measures have to be implemented
to ensure either that binder is applied only in certain
regions of the layers or that a mask is correspondingly
accurately positioned. It is also known to use
soldering foil or soldering wire to form the soldered
joins. These in each case form continuous soldering
materials which do not allow the formation of discrete
joining regions.
Working on this basis, the present invention is based
on the object of proposing a joining material which
allows discrete soldered joins to be formed between two
metallic structures. A further objective is to propose
a corresponding process for producing a honeycomb body,
a corresponding honeycomb body and a corresponding
motor vehicle.
This object is achieved by a joining material having
the features of claim 1, a process having the features
of claim 11, a honeycomb body having the features of
claim 27 and a motor vehicle having the features of
claim 33. Advantageous configurations form the subject

- 4 -
matter of the respective dependent claims.
The joining material according to the invention for
positioning solder material on at least one discrete
joining region of a metallic surface is distinguished
by the fact that a solder material is formed
discontinuously on a continuous carrier material.
A joining material of this type advantageously allows
discrete regions of solder material to be positioned on
joining regions of metallic surfaces without, for
example, a binder having to be applied prior to the
application of a solder. In particular, a joining
material of this type can be wound or shaped together
with the metallic surfaces which are to be joined. For
this purpose, it may be advantageous for the carrier
material and/or the solder material to be provided with
binder which fixes the joining material to the surfaces
to be joined and thus ensures that accurately defined
joining regions of the metallic surfaces can be
provided with solder material and subsequently joined.
The carrier material and/or the solder material may
have markings which facilitate positioning of the
joining material.
The present invention for the first time proposes a
continuous material which can be used to position
solder material in discontinuous regions. Continuous
solder materials, such as for example continuous
soldering foil, does not allow targeted application of
solder and therefore joining of discrete regions of the
at least partially metallic surface that is to be
soldered, whereas targeted application of solder to
discrete regions by application of a binder followed by
application of solder material is complex and requires
a high degree of accuracy in particular when producing
honeycomb bodies. The joining material according to the

- 5 -
invention advantageously facilitates the handling of
the solder material and simplifies the production of
discrete joins between at least partially metallic
surfaces. In the present context, an at least partially
metallic surface is to be understood as meaning a
surface which in particular has a metallic or partially
metallic surface. A surface of this type may be formed
by a sheet-metal layer, but also by a fibrous layer
which may also include ceramic fibers. By way of
example, an at least partially metallic surface can
also be formed by a mat which has been woven from metal
and ceramic fibers and can be used as a filter mat, for
example in diesel particulate filters.
According to an advantageous embodiment of the joining
material according to the invention, the solder
material is at least partially in the form of a
soldering foil.
According to a further advantageous embodiment of the
joining material according to the invention, the solder
material is at least partially in the form of solder
grains.
It is particularly advantageous for the solder material
to be formed as a soldering foil if planar surfaces are
to be joined to one another. Soldering foil also offers
the advantage that in the event of deformation of the
surfaces to be soldered, during which, for example, one
surface slides along the other surface, the joining
regions formed from soldering foil remain substantially
undeformed or unmoved. Forming the solder material from
solder grains may be advantageous in particular if it
is necessary to bend the joining material, for example
through contact with a curved metallic surface.
Moreover, forming the solder material from solder
grains allows it to be matched in particular, for

- 6 -
example, to the thickness and shape of the surfaces to
be soldered, since a different solder grain fraction is
advantageous depending on the thickness and shape of
the surfaces in order to ensure optimum attachment of
the metallic surfaces.
According to a further advantageous embodiment of the
joining material according to the invention, the solder
material is fixed on the carrier material using a first
adhesive.
The first adhesive used may, for example, be known
organic adhesives or water-based adhesives. This first
adhesive advantageously imparts good bonding between
carrier material and solder material, so that reliable
and accurate positioning of the solder material can be
achieved by positioning the carrier material relative
to the at least partially metallic surfaces that are to
be soldered.
According to a further advantageous embodiment of the
joining material according to the invention, the solder
material has a second adhesive on a side facing away
from the carrier material.
This may be advantageous in particular if the solder
material is to be transferred to the metallic surface
that is to be provided with solder material by a
rolling movement on the part of the joining material.
For this purpose, the joining material is rolled
longitudinally onto the at least partially metallic
surface, so that the solder material remains stuck to
the surface by the second adhesive. The carrier
material can then easily be pulled off the solder
material. The solder material is therefore stuck to the
at least partially metallic surface in a similar way to
a label. In this context, it is particularly

— 7 —
advantageous for a first adhesive force produced by the
first adhesive to be greater than a second adhesive
force produced by the second adhesive. It is also
advantageous in this context for the solder material to
be in the form of a soldering foil, since it is in this
case easy to apply the second adhesive.
According to a further advantageous embodiment of the
joining material according to the invention, a third
adhesive is formed on a side of the carrier material
which faces away from the solder material.
This third adhesive makes it easy to fix the joining
material. In particular, it is in this way also
possible to pre-fix the product that is to be soldered.
Furthermore, providing the third adhesive
advantageously increases the accuracy of positioning of
the solder material relative to the at least partially
metallic surface that is to be soldered, since
subsequent movement of the joining material relative to
the surface is prevented.
According to a further advantageous embodiment of the
joining material according to the invention, the
carrier material is formed from a metal, a plastic
and/or paper, preferably a plastic and/or paper.
Both plastics and metals and paper make it easy to
produce and handle the joining material. Carrier
materials which are known from the production of
adhesive labels can advantageously be used. A plastic-
coated paper can also be used as the carrier material
according to the invention.
According to a further advantageous embodiment of the
joining material according to the invention, the
carrier material has a critical temperature above which

- 8 -
the support material is destroyed and which is less
than or equal to the melting point of the solder
material. In this context, it is particularly-
preferable for the carrier material, when at least the
critical temperature is reached, to be at least
partially evaporated and/or at least partially
decomposed, preferably to be evaporated substantially
without leaving any residues and/or to be decomposed
substantially without leaving any residues.
This advantageously ensures that the soldered end
product preferably does not have any residues of the
carrier material. Evaporation may occur in particular
when the carrier material is at least partially formed
from plastic. Combustion of the carrier material
leaving virtually no residues is also possible and in
accordance with the invention.
A further aspect of the inventive concept proposes a
process for producing a honeycomb body with a honeycomb
structure having cavities which a fluid can at least
partially flow through, which comprises at least the
following steps:
A) at least providing an at least partially metallic
layer;
B) positioning solder material at least on joining
regions of at least one of the layers;
C) forming the honeycomb structure from the at least
one layer;
D) if appropriate, providing a tubular casing;
E) if appropriate, positioning solder material at
least on an attachment region of an outer surface
of the honeycomb structure and/or an inner surface
of the tubular casing;
F) if appropriate, introducing the honeycomb
structure into the tubular casing;
G) carrying out a soldering operation,

- 9 -
in which in process step B) and/or E) , the solder
material (3) is at least partially positioned in the
form of a joining material (1) as claimed in one of
claims 1 to 10, and/or in which in process step B)
and/or E) solder material at least partially in the
form of soldering foil is adhesively bonded to at least
one joining region (18) and/or at least one attachment
region (23).
Therefore, the process according to the invention
allows the production of a honeycomb body from at least
partially metallic layers, the honeycomb body
comprising just one honeycomb structure, and a
honeycomb body which comprises a honeycomb structure in
a tubular casing, preferably a metallic tubular casing.
In this case, the joining material according to the
invention and/or the stuck-on soldering foil can be
used both to form the joins in the honeycomb structure
and to join the honeycomb structure to the tubular
casing. A combination of any other desired solder-
application processes is possible and in accordance
with the invention. The soldering foil can be stuck on
using known adhesives, for example water-based or
organic-based adhesives. The process according to the
invention for producing a honeycomb body for the first
time allows the economically viable production of
honeycomb bodies with offset soldered joins as
described in DE 33 12 944 Al.
The honeycomb bodies produced in this way are
particularly suitable for use in automotive
engineering, in particular in the exhaust system of a
motor vehicle, where a honeycomb body produced in
accordance with the invention can be used, for example,
as a catalyst support body, a filter body, an adsorber
body and/or a muffler. Accordingly, the at least
partially metallic layers can at least in part be

- 10 -
formed as sheet-metal layers, fibrous layers, filter
layers and/or composite layers. A composite layer is to
be understood, for example, as a layer which includes
both metallic and non-metallic fractions, for example a
ceramic fiber layer which is held within a porous metal
covering layer. Furthermore, in the context of the
present invention a layer may also comprise any desired
combination of sublayers, for example a fiber layer
reinforced with sheet-metal layer sections or the like.
In particular, it is also possible to produce honeycomb
bodies with large diameters, preferably of more than
15 0 mm (millimeters) using the processes according to
the invention. In the case of a honeycomb body which is
not circular in cross section, the term diameter is to
be understood as meaning a characteristic dimension of
this cross section, for example a maximum, minimum or
mean diameter.
The process according to the invention for producing a
honeycomb body makes it possible, with simple and
inexpensive positioning of the solder material, for
only defined, discrete joining regions of the layers to
be joined to one another and/or defined, discrete
joining regions between the honeycomb structure and
tubular casing to be joined. It is in this way possible
to produce honeycomb bodies which are flexible; the
flexibility may also, for example, be matched to the
subsequent use, i.e. in particular to the expected
exhaust-gas volumetric flows, the frequency of
pulsation of these flows and the momenta of these
flows. For example, it is advantageously possible to
produce honeycomb bodies of increased durability. These
honeycomb bodies can be produced in a simple and
inexpensive way using the joining material according to
the invention or by sticking on soldering foil. It is
preferably possible for a plurality of joining regions
to be formed on one layer, in particular also on both

- 11 -
longitudinal sides of a layer.
According to an advantageous configuration of the
process according to the invention, the soldering foil
is cut to the dimensions of the joining region prior to
or during process step B).
Therefore, the dimensions of the soldering foil after
it has been cut correspond to the desired dimensions of
the j oining region.
According to a further advantageous configuration of
the process according to the invention, the soldering
foil is joined to a carrier material.
A soldering foil on a carrier material of this type can
form a joining material as described above. However, it
is in this case also possible for there to be a
continuous soldering foil on carrier material, which is
in each case cut according to the required dimensions
of the joining regions. The continuous soldering foil
may have desired breaking locations, which lead to it
being cut to the desired dimensions.
According to a further advantageous configuration of
the process according to the invention, at least one at
least partially structured layer is provided in process
step A).
According to a further advantageous configuration of
the process according to the invention, at least one
substantially smooth layer is provided in process step
A).
By way of example, it is possible to produce a
honeycomb structure in which in process step C) at
least one at least partially structured layer and if

- 12 -
appropriate at least one substantially smooth layer are
wound helically. The term substantially smooth layer is
to be understood as meaning a layer which may be smooth
but may also have micro-structuring, the structure
amplitude of which is significantly smaller than that
of the at least partially structured layer. Structuring
is to be understood as encompassing in particular a
corrugation, for example a sinusoidal, sawtooth and/or
triangular corrugation. A structuring is preferably
periodic, i.e. has a characteristic repetition length,
such as for example a wavelength.
In process step C) , a honeycomb structure can for
example also be formed by at least one at least
partially structured layer and if appropriate at least
one substantially smooth layer being stacked to form at
least one stack, and at least one stack being
intertwined in the same direction or opposite
directions.
Depending on the detailed design of the layers, it is
in this way possible to form honeycomb bodies which
have a honeycomb structure with passages passing
through the honeycomb structure in a longitudinal
direction. It is also possible and in accordance with
the invention to form a honeycomb structure with
partially closed passages, with guide structures in the
passage wall, with perforations, turbulence-inducing
structures, etc.
According to a further advantageous configuration of
the process according to the invention, a structuring
of the at least partially structured layer has a
characteristic distance between two adjacent structure
extremes, in particular a wavelength, in the transverse
direction of the structuring, wherein at least some of
the joining regions, in the transverse direction of the

- 13 -
structuring, have an extent which is greater than the
characteristic distance.
If the joining material or the soldering foil is
applied to a smooth layer, i.e. the solder material in
process step b) or B) has been positioned on a
substantially smooth layer, the preferred extent of the
joining regions ensures that at least one structure
extreme of the at least partially structured layer
comes to bear against the joining region, where it is
joined to the substantially smooth layer. In this
context, it is particularly preferable for the quotient
of the characteristic distance and the extent to be
between substantially 1.2 and substantially 5,
preferably between substantially 1.5 and substantially
3, particularly preferably between substantially 1.8
and substantially 2.5.
In addition to the joining material being applied to a
substantially smooth layer, it is also possible and in
accordance with the invention for the joining material
to be applied to an at least partially structured
layer. A combination of these two forms of application
in one honeycomb body is also possible and in
accordance with the invention.
In accordance with a further advantageous configuration
of the process according to the invention, the
dimensions of the carrier material of the joining
material substantially at least partially correspond to
the dimensions of at least one of the layers.
In the present context, the term at least partially
correspond means that a dimension of the joining
material substantially corresponds to a corresponding
dimension of one of the layers, i.e. by way of example
the joining material and a layer have the same length

- 14 -
and/or width. This allows the positioning of the
joining material and layer to be correspondingly-
oriented with respect to one another in a particularly
simple way.
According to a further advantageous configuration of
the process according to the invention, the joining
material and/or the solder material is fixed to the
layer in process step B) or is fixed to the outer
surface of the honeycomb structure and/or the inner
surface of the tubular casing in process step E).
This fixing can be achieved by means of corresponding
adhesives on the carrier material and/or the solder
material. If the solder material is fixed to the layer
or the outer surface of the honeycomb structure and/or
the inner surface of the tubular casing, the carrier
material can be pulled off, so that it is no longer
wound into the honeycomb body.
According to a further advantageous configuration of
the process according to the invention, before or
during process step B) or E) an adhesive is applied to
the solder material and/or to the carrier material.
The application of adhesive to the solder material
and/or the carrier material allows the joining
material, the solder material and/or the soldering foil
to be correspondingly fixed to the joining regions of
the layers which are to be joined.
According to a further advantageous configuration of
the process according to the invention, joining regions
are formed on both longitudinal sides of a layer, the
layer in each case having a joining region on only one
longitudinal side at a given coordinate.

- 15 -
The layer therefore does not have any point which has
joining regions on both longitudinal sides. This makes
it possible to construct honeycomb bodies with very
good thermal expansion properties, since a honeycomb
body composed of corresponding layers permits relative
movements of the layers perpendicular to the
longitudinal direction of the honeycomb body to a
certain extent without a soldered join breaking.
According to a further advantageous configuration of
the process according to the invention, the joining
regions are formed in such a way that at least two
subregions, in which joining regions are produced, are
formed in a longitudinal direction of the honeycomb
body, a layer on a longitudinal side only having
joining regions in a subregion.
A honeycomb body produced in this way has good thermal
expansion properties combined, at the same time, with a
good durability. In particular, the offset joining
regions also permit a relative movement of the
individual layers in the longitudinal direction of the
honeycomb body. The subregions are preferably formed on
the or adjacent to end sides of the honeycomb body. As
an alternative or in addition, it is possible and in
accordance with the invention for a further, third
subregion to be formed substantially in the
longitudinal direction centrally within the honeycomb
body. In this context, it is particularly advantageous
if, in the first and second subregions, the joining
regions are formed on a first longitudinal side of the
layers, while in the third subregion the joining
regions are formed on a second longitudinal side, which
is the opposite side from the first longitudinal side.
A concertina-like soldered arrangement of this nature
has proven particularly advantageous with regard to the
thermal expansion properties and the durability.

; - 16 -
A further aspect of the inventive concept proposes a
honeycomb body comprising a honeycomb structure with
cavities which a fluid can at least partially flow
through, composed of at least one at least partially
metallic layer, and if appropriate a tubular casing
surrounding the honeycomb structure, in which honeycomb
body a layer is soldered to itself and/or an adjacent
layer only in joining regions, and/or at least one
layer is soldered to the tubular casing only in
attachment regions, wherein the solder material has
been positioned or adhesively bonded as a soldering
foil in at least some of the joining regions and/or the
attachment regions by a joining material according to
the invention.
In particular, the honeycomb body according to the
invention may have been produced by the process
according to the invention for producing a honeycomb
body.
According to an advantageous embodiment of the
honeycomb body according to the invention, the
honeycomb body has a diameter of substantially greater
than or equal to 150 mm (millimeters).
According to a further advantageous configuration of
the honeycomb body according to the invention, the
honeycomb body comprises at least one layer which
comprises joining regions on both longitudinal sides,
the layer in each case having a joining region on only
one longitudinal side at a given coordinate.
According to a further advantageous configuration, the
joining regions are designed in such a way that at
least two subregions, in which joining regions are
produced, are formed in a longitudinal direction of the

- 17 -
honeycomb body, a layer on a longitudinal side, having
joining regions only in a subregion.
According to a further advantageous configuration of
the honeycomb body according to the invention, in each
case a subregion is formed in the region of or adjacent
to an end side of the honeycomb body.
According to a further advantageous configuration of
the honeycomb body according to the invention, a third
subregion is formed substantially in the longitudinal
direction centrally within the honeycomb body.
Furthermore, the invention proposes a motor vehicle
which comprises at least one honeycomb body according
to the invention or at least one honeycomb body
produced by the process according to the invention.
In the present context, a motor vehicle is to be
understood in particular as meaning a passenger
automobile, a truck, a motorized two-wheeler, a quad
bike, a boat and an aircraft.
The details and advantages which have been disclosed in
connection with the joining material according to the
invention, the processes according to the invention,
the honeycomb body according to the invention and the
motor vehicle according to the invention can in each
case alternatively also be applied and transferred to
the others.
In the text which follows, the invention is explained
in more detail with reference to the drawing, without
the invention being restricted to the exemplary
embodiments shown therein. In the drawing:
Fig. 1 diagrammatically depicts a plan view of an

- 18 -
excerpt from a joining material according to
the invent ion;
Fig. 2 diagrammatically depicts an excerpt from a
cross section through a joining material
according to the invention;
Fig. 3 diagrammatically depicts a process step used
in the processes according to the invention
for producing a honeycomb body;
Fig. 4 shows a diagrammatic, perspective view of a
stack of a plurality of layers;
Fig. 5 diagrammatically depicts a cross section
through a stack of a plurality of layers;
Fig. 6 diagrammatically depicts a cross section
through a honeycomb body according to the
invention;
Fig. 7 diagrammatically depicts an excerpt from a
honeycomb body according to the invention;
Fig. 8 diagrammatically depicts a plan view of a
layer used to construct a honeycomb body
according to the invention;
Fig. 9 diagrammatically depicts a side view of a
layer used to construct a honeycomb body
according to the invention; and
Fig. 10 diagrammatically depicts a longitudinal
section through an excerpt from a honeycomb
body according to the invention.
Fig. 1 diagrammatically depicts a plan view of an

- 19 -
excerpt from a joining material 1 according to the
invention. The joining material 1 comprises a carrier
material 2 and a solder material 3, which is formed
discontinuously on the carrier material 2. The solder
material 3 may preferably be in the form of a soldering
foil or solder powder, particularly preferably
soldering foil. The regions of solder material 3 may
take various shapes and sizes.
Fig. 2 diagrammatically depicts a cross section through
an excerpt from a joining material 1 according to the
invention. The solder material 3 is fixed on the
carrier material 2 by means of a layer of a first
adhesive 4. A layer of a second adhesive 5, by which
the solder material can be fixed on an at least
partially metallic surface, is formed on a side which
faces away from the carrier material 2. This fixing can
be done, for example, in a similar way to sticking on a
label. As an alternative and/or in addition, it is
possible for a third adhesive 6 to be formed on a side
of the carrier material 2 which faces away from the
solder material 3, by means of which the carrier
material 2 is fixed on a surface, in particular an at
least partially metallic surface, which is to be
provided with solder material.
The adhesives 4, 5, 6 are selected in such a way that
the adhesive forces allow accurate positioning of the
solder material 3 on the corresponding surfaces. In
particular, the first adhesive 4 produces a first
adhesive force between carrier material 2, first
adhesive 4 and solder material 3, and the second
adhesive 5 produces a second adhesive force between
solder material 3, second adhesive 5 and surface to
which solder is to be applied, which are matched to one
another in such a way that the solder material 3 is
stuck onto the corresponding surface that is to be

- 20 -
provided with solder material while at the same time
the solder material 3 is detached from the carrier
material 2.
The carrier material 2 is preferably formed from
plastic and/or paper. In particular, it is preferable
for the carrier material 2 to be formed from a
substance which, at a crystal temperature which is
lower than the soldering temperature of the solder
material 3, evaporates as far as possible without
leaving any residues or decomposes as far as possible
without leaving any residues.
Fig. 3 diagrammatically depicts process step B) of one
of the processes according to the invention for
producing a honeycomb body. This shows, by way of
example, how solder material 3 is applied to a
substantially smooth layer 7. For this purpose, two
solder application units 8 are formed. These each
comprise a stock reel 9 of joining material 1,
corresponding guide rolls 10 and applicators 10. The
applicators 10 press the individual regions of solder
material 3, which have been provided with a second
adhesive 5 (not shown) , by means of a movement in the
application direction 13, onto the substantially smooth
layer 7 at predeterminable positions, so that
corresponding joining regions of the substantially
smooth layer 7 are provided with the solder material 3.
If appropriate, it is possible to form a pressure-
exerting roll 12, by which the solder material 3 is
subsequently fixed by applying pressure on in the
pressing direction 14. The removal of the used carrier
material 2 is not illustrated, for the sake of clarity.
The substantially smooth layer 7 is moved in the
direction of movement 15.
Fig. 4 diagrammatically depicts a stack 16 of a

- 21 -
plurality of substantially smooth layers 7 and at least
partially structured layers 17, which form passages 22.
The substantially smooth layers 7 have joining regions
18, in which solder material 3 has been applied to the
smooth layer 7. In the present example, each
substantially smooth layer 7 on one longitudinal side
has four joining regions 18 in each case in the edge
region of the layer 7 and, on the opposite, second
longitudinal side of the layer 7, two substantially
centrally located joining regions 18. Fig. 5 shows a
cross section through the stack shown in Fig. 4.
Fig. 6 diagrammatically depicts a cross section through
a honeycomb body 19 according to the invention. The
honeycomb body 19 comprises a honeycomb structure 20,
which is formed in a tubular casing 21. The honeycomb
structure 2 0 has been formed by folding over and then
intertwining three stacks 16. The at least partially
structured layers 17 have not been illustrated, for the
sake of clarity.
The intertwining operation produces the illustrated
pattern of joining regions 18, which are illustrated as
small circles. This type of arrangement of the joining
regions advantageously leads to an elastic, durable
honeycomb body 19, which can be used in particular as a
catalyst support body or filter body in the exhaust
system of a motor vehicle. The honeycomb structure 20
is fixed to the tubular casing 21 by way of attachment
regions 23 which have been positioned using a joining
material 1 according to the invention.
Fig. 7 diagrammatically depicts an excerpt from a
honeycomb body 19 according to the invention. A
substantially smooth layer 7 has been joined to an at
least partially structured layer 17 by means of a
joining region 18 formed by solder material 3. The at

- 22 -
least partially structured layer 17 is corrugated, so
that in a transverse direction 24 of the structuring it
has a wavelength 25, i.e. a distance between two
structure maximums 27. The joining region 18 has an
extent 26 in the transverse direction 24 which is
greater than the wavelength 25.
Fig. 8 diagrammatically depicts a substantially smooth
layer 7 used to construct a honeycomb body 19 according
to the invention in the form of a plan view onto a
first longitudinal side 28. First joining regions 29
are formed on the first longitudinal side 28, while a
second joining region 31 is formed on a second
longitudinal side 30. This second joining region 31 is
indicated by dashed lines, to demonstrate that it is
formed on the second longitudinal side 30. The
substantially smooth layer 7 does not have any point at
which joining regions 29, 31 are formed on both
longitudinal sides 28, 30. Therefore, there are no
joining regions 29, 31 lying opposite at the same point
of the layer 7. A corresponding design of the joining
regions 29, 31 is likewise possible and in accordance
with the invention on an at least partially structured
layer 17. The number and layer of the joining regions
29, 31 is to be understood purely as an example.
Furthermore, Fig. 8 shows the subsequent longitudinal
direction 32 of the honeycomb body 19.
Fig. 9 shows a side view of the substantially smooth
layer 7 shown in Fig. 8. First joining regions 29 have
been formed on the first longitudinal side 28, while a
second joining region 31 has been formed on the second
longitudinal side 30.
Fig. 10 diagrammatically depicts a longitudinal section
through an excerpt from a honeycomb body 19 according
to the invention; the at least partially structured

- 23 -
layers 17, which are located between the substantially
smooth layers 7 shown, are not illustrated for the sake
of clarity. First joining regions 29 and second joining
regions 31 are diagrammatically indicated in the
drawing; the first joining regions 29 are in each case
formed on the first longitudinal side 2 8 of the
substantially smooth layers 7, while the second joining
regions 31 are in each case formed on the second
longitudinal side 3 0 of the substantially smooth layers
7. In the joining regions 29, 31, the substantially
smooth layer 7 is joined to adjacent at least partially
structured layers 17. The joining regions 29, 31 are
formed by solder material 3 which is positioned by
means of the joining material 1 according to the
invention or formed by stuck-on soldering foil.
A first subregion 33, a second subregion 34 and a third
subregion 35 are formed in a longitudinal direction 32
of the honeycomb body 19 in which medium can at least
partially flow through the passages 22 (not shown). The
first joining regions 29 are in each case designed in
such a way that an individual layer 7 on the first
longitudinal side 28 only has first joining regions 29
on the first longitudinal side 28 of the substantially
smooth layer 7. the first joining regions 28 of a layer
7 therefore belong either to the first subregion 33 or
to the second subregion 34. Consequently, there is
preferably no layer 7 which has first joining regions
29 in the first subregion 32 and in the second
subregion 34.
The first subregion 33 and the second subregion 34 are
preferably in the region of or adjacent to an end side
of the honeycomb body 19. The third subregion 35 lies
substantially centrally with respect to the extent of
the honeycomb body 19 and/or the layers 7.

- 24 -
A honeycomb body 19 designed as shown in Fig. 10 has
very good thermal expansion properties, since a
relative movement of the individual layers 7, 17, for
example caused by the thermal expansion properties of
the layers 7, 17, with respect to one another is
possible to a certain extent both in the longitudinal
direction 32 and in a transverse direction 24. At the
same time, a honeycomb body 19 of this type has a very
good durability.
The joining material 1 according to the invention can
particularly advantageously be used for the production
of honeycomb bodies 19, since adjacent layers 7, 17 of
the honeycomb body 19 can in a simple way be joined
only in discrete joining regions 18 by means of the
joining material 1. It is in this way possible to
produce honeycomb bodies 19 which are elastic and yet
durable.

- 25 -
List of designations
1 Joining material
2 Carrier material
3 Solder material
4 First adhesive
5 Second adhesive
6 Third adhesive
7 Substantially smooth layer
8 Solder application unit
9 Stock reel
10 Guide roll
11 Applicator
12 Pressure-exerting roll
13 Application direction
14 Pressing direction
15 Direction of movement
16 Stack
17 At least partially structured layer
18 Joining region
19 Honeycomb body
2 0 Honeycomb structure
21 Tubular casing
22 Passage
23 Attachment region
24 Transverse direction
25 Wavelength
26 Extent
27 Structure maximum
28 First longitudinal side
29 First joining region
30 Second longitudinal side
31 Second joining region
32 Longitudinal direction
33 First subregion

- 26 -
34 Second subregion
35 Third subregion

- 27 -
CLAIMS
1. A joining material (1) for positioning solder
material (3) on at least one discrete joining region
(18, 29, 31) of an at least partially metallic surface
(7, 17), characterized in that a solder material (3) is
formed discontinuously on a continuous carrier material
(2) .
2. The joining material (1) as claimed in claim 1,
characterized in that the solder material (3) is at
least partially in the form of a soldering foil.
3. The joining material (1) as claimed in claim 1 or
2, characterized in that the solder material (3) is at
least partially in the form of solder grains.
4. The joining material (1) as claimed in one of the
preceding claims, characterized in that the solder
material (3) is fixed on the carrier material (2) using
a first adhesive (4).
5. The joining material (1) as claimed in one of the
preceding claims, characterized in that the solder
material (3) has a second adhesive (5) on a side facing
away from the carrier material (2).
6. The joining material (1) as claimed in claim 5,
characterized in that a first adhesive force produced
by the first adhesive (4) is greater than a second
adhesive force produced by the second adhesive (5).
7. The joining material (1) as claimed in one of the
preceding claims, characterized in that a third
adhesive (6) is formed on a side of the carrier
material (2) which faces away from the solder material
(3) .

- 28 -
8. The joining material (1) as claimed in one of the
preceding claims, characterized in that the carrier
material (2) is formed from a metal, a plastic and/or
paper, preferably plastic and/or paper.
9. The joining material (1) as claimed in one of the
preceding claims, characterized in that the carrier
material (2) has a critical temperature above which the
carrier material (2) is destroyed and which is less
than or equal to the melting point of the solder
material (3) .
10. The joining material (1) as claimed in claim 10,
characterized in that the carrier material (2) , when at
least the critical temperature is reached, is at least
partially evaporated and/or at least partially
decomposed, preferably evaporated substantially without
leaving any residues and/or decomposed substantially
without leaving any residues.
11. A process for producing a honeycomb body (19) with
a honeycomb structure (20) having cavities (22) which a
fluid can at least partially flow through, comprising
at least the following steps:

A) at least providing an at least partially metallic
layer (7, 17);
B) positioning solder material (3) at least on
joining regions (18) of at least one of the layers
(7, 17);
C) forming the honeycomb structure (20) from the at
least one layer (7, 17);
D) if appropriate, providing a tubular casing (21);
E) if appropriate, positioning solder material (3) at
least on an attachment region (23) of an outer
surface of the honeycomb structure (20) and/or an
inner surface of the tubular casing (21);

- 29 -
F) if appropriate, introducing the honeycomb
structure (20) into the tubular casing (21);
G) carrying out a soldering operation,
characterized in that in process step B) and/or E), the
solder material (3) is at least partially positioned in
the form of the joining material (1) as claimed in one
of claims 1 to 10, and/or in that in process step B)
and/or E) solder material (3) at least partially in the
form of soldering foil is adhesively bonded to at least
one joining region (18) and/or at least one attachment
region (23).
12. The process as claimed in claim 11, characterized
in that the soldering foil is cut to the dimensions of
the joining region (18) prior to or during process step
B) .
13. The process as claimed in claim 11 or 12,
characterized in that the soldering foil is joined to a
carrier material (2).
14. The process as claimed in one of claims 11 to 13,
characterized in that at least one at least partially
structured layer (17) is provided in process step A) .
15. The process as claimed in one of claims 11 to 14,
characterized in that at least one substantially smooth
layer (7) is provided in process step A).
16. The process as claimed in claim 14 or 15, in which
a structuring of the at least partially structured
layer (17) has a characteristic distance between two
adjacent structure extremes (27), in particular a
wavelength (25), in the transverse direction (24) of
the structuring, characterized in that at least some of
the joining regions (18, 29, 31), in the transverse
direction (24) of the structuring, have an extent (26)

- 30 -
which is greater than the characteristic distance (25).
17. The process as claimed in claim 16, characterized
in that the quotient of the characteristic distance
(25) and the extent (26) is between substantially 1.2
and substantially 5, preferably between substantially
1.5 and substantially 3, particularly preferably
between substantially 1.8 and substantially 2.5.
18. The process as claimed in one of claims 11 to 17,
characterized in that the solder material (3) and/or
the joining material (1) is applied to a substantially
smooth layer (7).
19. The process as claimed in one of claims 11 to 18,
characterized in that the solder material (7) and/or
the joining material (1) is applied to an at least
partially structured layer (17).
20. The process as claimed in one of claims 11 to 19,
characterized in that the dimensions of the carrier
material (2) substantially at least partially
correspond to the dimensions of at least one of the
layers (7, 17).
21. The process as claimed in one of claims 11 to 20,
characterized in that the joining material (1) and/or
the solder material (3) is fixed to the layer (7, 17)
in process step B) and/or is fixed to the outer surface
of the honeycomb structure (20) and/or the inner
surface of the tubular casing (21) in process step E) .
22. The process as claimed in one of claims 11 to 21,
characterized in that before or during process step B)
or E) an adhesive (4, 5, 6) is applied to the solder
material (3) and/or to the carrier material (2).

- 31 -
23. The process as claimed in one of claims 11 to 22,
characterized in that joining regions (18, 29, 31) are
formed on both longitudinal sides (28, 3 0) of a layer
(7, 17), the layer (7, 17) in each case having a
joining region (18, 29, 31) on only one longitudinal
side (28, 30) at a given coordinate.
24. The process as claimed in claim 23, characterized
in that the joining regions (18, 29, 31) are formed in
such a way that at least two subregions (33, 34, 35),
in which joining regions (18, 29, 31) are produced, are
formed in a longitudinal direction (32) of the
honeycomb body (19), a layer (7, 17), on a longitudinal
side (28, 30), only having joining regions (18, 29, 31)
in a subregion (33, 34, 35).
25. The process as claimed in claim 24, characterized
in that in each case one subregion (33, 34) is formed
in the region of or adjacent to an end side of the
honeycomb body (19).
26. The process as claimed in claim 24 or 25,
characterized in that a third subregion (35) is formed
substantially in the longitudinal direction (32)
centrally within the honeycomb body (19).
27. A honeycomb body (19) comprising a honeycomb
structure (20) with cavities (22) which a fluid can at
least partially flow through, composed of at least one
at least partially metallic layer (7, 17) , and if
appropriate a tubular casing (21) surrounding the
honeycomb structure (20), in which honeycomb body a
layer (7, 17) is soldered to itself and/or an adjacent
layer (7, 17) only in joining regions (18, 29, 31) ,
and/or at least one layer (7, 17) is soldered to the
tubular casing (21) only in attachment regions (23),
characterized in that the solder material (3) has been

- 32 -
positioned or adhesively bonded as a soldering foil in
at least some of the joining regions (18) and/or the
attachment regions (23) by the joining material (1) as
claimed in one of claims 1 to 10.
28. The honeycomb body (19) as claimed in claim 27,
characterized in that the honeycomb body (19) has a
diameter of substantially greater than or equal to
150 mm (millimeters).
29. The honeycomb body (19) as claimed in claim 27 or
28, characterized in that the honeycomb body (19)
comprises at least one layer (7, 17) which comprises
joining regions (18, 29, 31) on both longitudinal sides
(28, 30) , the layer (7, 17) in each case having a
joining region (18, 29, 31) on only one longitudinal
side (28, 3 0) at a given coordinate.
30. The honeycomb body (19) as claimed in claim 29,
characterized in that the joining regions (18, 29, 31)
are designed in such a way that at least two subregions
(33, 34, 35), in which joining regions (18) are
produced, are formed in a longitudinal direction (32)
of the honeycomb body (19) , a layer (7, 17) , on a
longitudinal side (28, 30), having joining regions (18,
29, 31) only in a subregion (33, 34, 35).
31. The honeycomb body (19) as claimed in claim 30,
characterized in that in each case a subregion (33, 34)
is formed in the region of or adjacent to an end side
of the honeycomb body (19).
32. The honeycomb body (19) as claimed in claim 3 0 or
31, characterized in that a third subregion (35) is
formed substantially in the longitudinal direction (32)
centrally within the honeycomb body (19).

- 33 -
33. A motor vehicle comprising at least one honeycomb
body (19) as set forth in one of claims 7 to 32 or at
least one honeycomb body (19) produced by the process
as claimed in one of claims 11 to 26.

The joining material (1) according to the invention for positioning solder material (3) on at least one discrete joining region (18) of an at least partially metallic surface (7, 17) , is distinguished by the fact that a solder material (3) is formed discontinuously on a continuous carrier material (2). The joining material (1) according to the invention can particularly advantageously be used for the production of honeycomb bodies (19), since the joining material (1) makes it easy to join adjacent layers (7, 17) of the honeycomb body (19) only at discrete joining regions (18). It is in this way possible to produce honeycomb bodies (19) which are elastic and yet durable.

Documents:

01903-kolnp-2007-abstract.pdf

01903-kolnp-2007-claims.pdf

01903-kolnp-2007-correspondence others 1.1.pdf

01903-kolnp-2007-correspondence others 1.2.pdf

01903-kolnp-2007-correspondence others.pdf

01903-kolnp-2007-description complete.pdf

01903-kolnp-2007-drawings.pdf

01903-kolnp-2007-form 1.pdf

01903-kolnp-2007-form 18.pdf

01903-kolnp-2007-form 2.pdf

01903-kolnp-2007-form 3.pdf

01903-kolnp-2007-form 5.pdf

01903-kolnp-2007-gpa.pdf

01903-kolnp-2007-international publication.pdf

01903-kolnp-2007-international search report.pdf

01903-kolnp-2007-pct request form.pdf

01903-kolnp-2007-priority document.pdf

01903-kolnp-2007-translated copy of priority document.pdf

1903-KOLNP-2007-(30-10-2012)-CORRESPONDENCE.pdf

1903-KOLNP-2007-(30-10-2012)-PA.pdf

1903-KOLNP-2007-ABSTRACT.pdf

1903-KOLNP-2007-CLAIMS.pdf

1903-KOLNP-2007-CORRESPONDENCE OTHERS 1.3.pdf

1903-kolnp-2007-correspondence.pdf

1903-KOLNP-2007-DESCRIPTION (COMPLETE).pdf

1903-KOLNP-2007-DRAWINGS.pdf

1903-KOLNP-2007-EXAMINATION REPORT REPLY RECIEVED.pdf

1903-kolnp-2007-examination report.pdf

1903-KOLNP-2007-FORM 1-1.1.pdf

1903-KOLNP-2007-FORM 1.pdf

1903-kolnp-2007-form 18.pdf

1903-KOLNP-2007-FORM 2.pdf

1903-kolnp-2007-form 3.1.pdf

1903-KOLNP-2007-FORM 3.pdf

1903-kolnp-2007-form 5.pdf

1903-KOLNP-2007-FORM-27.pdf

1903-kolnp-2007-gpa.pdf

1903-kolnp-2007-granted-abstract.pdf

1903-kolnp-2007-granted-claims.pdf

1903-kolnp-2007-granted-description (complete).pdf

1903-kolnp-2007-granted-drawings.pdf

1903-kolnp-2007-granted-form 1.pdf

1903-kolnp-2007-granted-form 2.pdf

1903-kolnp-2007-granted-letter patent.pdf

1903-kolnp-2007-granted-specification.pdf

1903-KOLNP-2007-OTHERS.pdf

1903-kolnp-2007-others1.1.pdf

1903-KOLNP-2007-PA.pdf

1903-KOLNP-2007-PETITION UNDER RULE 137.pdf

1903-kolnp-2007-reply to examination report.pdf

1903-kolnp-2007-translated copy of priority document.pdf

abstract-01903-kolnp-2007.jpg


Patent Number 247385
Indian Patent Application Number 1903/KOLNP/2007
PG Journal Number 14/2011
Publication Date 08-Apr-2011
Grant Date 04-Apr-2011
Date of Filing 28-May-2007
Name of Patentee EMITEC GESELLSCAHFT FUR EMISSIONSTECHNOLOGIE MBH
Applicant Address HAUPTSTRASSE 128, 53797 LOHMAR
Inventors:
# Inventor's Name Inventor's Address
1 ALTHOFER, KAIT HOHE FUHR 1, 51674 WIEHL
2 BRUCK, ROLF FROBELSTRASSE 12, 51429 BERGISCH GLADBACH
PCT International Classification Number B23K 1/00,B23K 35/02
PCT International Application Number PCT/EP2005/012631
PCT International Filing date 2005-11-25
PCT Conventions:
# PCT Application Number Date of Convention Priority Country
1 10 2004 063 546.3 2004-12-30 Germany