Title of Invention

APPARATUS FOR HOLDING AND POSITIONING A PLURALITY OF POWER SEMICONDUCTOR MODULES

Abstract The invention describes an apparatus, and an associated method, for holding and positioning a plurality of power semiconductor modules which are at a distance from one another, said apparatus having a positioning moulded body having a planar first main surface and a plurality of recesses for holding the power semiconductor modules. In this case, each recess has a stop means, as a result of which a main surface of a power semiconductor module is respectively positioned such that it is plane-parallel to, and aligned with, the first main surface of the positioning moulded body. The recess is designed to taper conically in the direction of the first main surface, at least in a partial section, starting from the second main surface.
Full Text FORM 2
THE PATENT ACT 1970 (39 of 1970)
The Patents Rules, 2003 COMPLETE SPECIFICATION (See Section 10, and rule 13)
1. TITLE OF INVENTION
APPARATUS FOR POSITIONING POWER SEMICONDUCTOR MODULES AND METHOD FOR TREATING THE SURFACE OF POWER SEMICONDUCTOR MODULES

2. APPLICANT(S)
a) Name
b) Nationality
c) Address

SEMIKRON ELEKTRONIK GMBH & CO. KG
GERMAN Company
POSTFACH 82 0251,
90253 NURNBERG,
GERMANY

3. PREAMBLE TO THE DESCRIPTION
The following specification particularly describes the invention and the manner in which it is to be performed : -

ENGLISH TRANSLATION VARIFICATION
CERTIFICATE u/r. 20(3)(b)
I, Mr. HIRAL CHANDRAKANT JOSHL, an authorized agent for the applicant, SEMIKRON ELEKTRONIK GMBH & CO. KG do hereby verify that the content of English translated complete specification filed in pursuance cf claiming German Priority No. 10 2005 052 798.1 Dated 05/11/2005 thereof is correct and complete.

HIRAL CHANDRAKANT JOSHI AGENT FOR SEMIKRON ELEKTRONIK GMBH & CO. KG

Description
The invention describes an apparatus for positioning a plurality of power semiconductor modules which are at a distance from one another as well as a method for treating the surface of the power semiconductor modules which have been positioned. The invention is based on power semiconductor modules which are disclosed, by way of example, in DE 196 30 173 Al and are arranged at a distance from one another using DE 103 58 834 Al, for example.
By way of example, the invention is based on a plurality of power semiconductor modules according to DE 196 30 173 Al which are arranged in a transportation pack according to DE 103 58 834 Al. Before transportation, a thermally conductive layer, for example, is intended to be applied to the substrate of the power semiconductor modules so that the power semiconductor modules can be immediately installed in an arrangement, for example a power converter, after transportation without further surface treatment.
Said power semiconductor modules have two main surfaces, the contact elements for electrical contact-connection being arranged on a second main surface. The first main surface is formed by a substrate. This substrate is fitted with power semiconductor components, on that side which faces the inside of the power semiconductor module, and is used, on that side which is remote from the inside of the power semiconductor module, for thermally conductive connection to a cooling assembly. This thermally conductive connection between the substrate and the cooling assembly is formed, according to the prior art, by an intermediate layer comprising a thermally conductive layer, a so-called thermally conductive paste.
This thermally conductive paste must be in the form of a homogeneous layer or a homogeneous distribution of individual layer elements in order to ensure that, after the power semiconductor module has been mounted on the heat sink, heat is
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efficiently transferred. However, such layers comprising thermally conductive paste have the disadvantage, as a pasty layer, of being sensitive to disruption of the homogeneity. For this reason, according to the prior art, the thermally conductive paste is preferably directly applied before the power semiconductor module is arranged on the heat sink. However, since this layer must have the greatest possible degree of homogeneity, that is to say a uniform layer thickness, screen printing methods, for example, which are not necessarily available at the mounting location are suitable for this purpose.
Transportation packs for the abovementioned power semiconductor module are disclosed in DE 103 58 834 Al. Such transportation packs arrange a plurality of power semiconductor modules at a distance from one another, which distance is defined with a tolerance of down to a few millimetres. Furthermore, these packs are configured in such a manner that the two main surfaces of the respective power semiconductor module do not come into contact with the transportation pack or come into contact with the transportation pack to only a slight but defined extent.
The invention is based on the object of presenting an apparatus for holding a plurality of power semiconductor modules, which are at a distance from one another, in order to position them with respect to one another, even with a tolerance of less than one millimetre, and of presenting an associated method for simultaneously treating the surface of this plurality of power semiconductor modules.
According to the invention, the object is achieved by means of the measures of the features of Claims 1 and 2. Preferred embodiments are described in the subclaims.
The inventive concept is based on a plurality of power semiconductor modules which are arranged laterally with respect to one another in a grid, which is not defined exactly, and whose horizontal position with respect to one another is
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likewise defined. The invention describes an apparatus for holding and positioning this plurality of power semiconductor modules which are at a distance from one another. A positioning moulded body having a planar first main surface and a plurality of recesses for holding the power semiconductor modules is proposed for this purpose.
Each of said recesses has a stop means in the direction of the normal to the first main surface, as a result of which a main surface of a power semiconductor module is respectively positioned such that it is plane-parallel to, and aligned with, the first main surface of the moulded body. Furthermore, starting from the second main surface of the positioning moulded body, the recesses have a conically tapering configuration, at least in a partial section, in the direction of the first main surface of said moulded body.
The associated method for simultaneously treating the surface of a plurality of power semiconductor modules uses the abovementioned apparatus to align and fix the position of the power semiconductor modules and then uses the correspondingly suitable coating method to coat the entire area of the first main surfaces, or sections of the first main surfaces, of the power semiconductor modules with a material.
The inventive solution will be explained in more detail with reference to the exemplary embodiments of Figs. 1 to 3.
Fig. 1 shows part of the positioning moulded body of the inventive apparatus.
Fig. 2 shows a section through the positioning moulded body of the inventive apparatus in various stages of the operation of positioning power semiconductor modules.
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Fig. 3 shows a three-dimensional illustration of part of the positioning moulded body of the inventive apparatus.
Fig. 1 shows a plan view of the first main surface (14) of part of the positioning moulded body (10) of the inventive apparatus. The positioning moulded body (10) preferably comprises aluminium and has a planar first main surface (14). The positioning moulded body (10) also has a multiplicity of recesses (12) whose lateral dimensions are slightly larger than the corresponding dimensions of a power semiconductor module (40) which is to be arranged. The method which is to be carried out using this positioning moulded body (10) determines the corresponding dimensions. Each recess (12) has a stop means (20) which limits displacement of the power semiconductor module (40), which is to be arranged, in the direction of the" normal to the first main surface (14) of the positioning moulded body (10). These stop means (20) are in the form of latching lugs and are arranged on two opposite sides of the recess (14) in the positioning moulded body (10). Depending on the demands imposed on the positioning accuracy, such latching lugs (20) may preferably be on all sides and there may even be a plurality of them on each side if required. Correspondingly designed latching lugs in the corners of the recesses (14) are likewise suitable.
Fig. 2 shows a section, along the line A-A according to Fig. 1, through the positioning moulded body (10) of the inventive apparatus in various stages of the operation of positioning power semiconductor modules (40).
The positioning moulded body (10) has a first main surface (14) which is used as a reference surface for the inventive method. Furthermore, the positioning moulded body (10) has recesses (12) for holding power semiconductor modules (40). These recesses (12) have a lateral extent which is slightly larger than the lateral extent of the housing (42) of the associated power semiconductor module (40). The lateral extent of the recess (12) is considerably larger than the housing dimensions (42) of the
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power semiconductor module (40) on the second main surface (16). Starting from this second main surface (16), the recess (12) tapers conically in the direction of the first main surface (14), at least in a partial section (18). This configuration is preferred since, although the power semiconductor modules (40) are arranged laterally with respect to one another in a grid, for example in part of a transportation pack (50), before being arranged in the positioning moulded body (10), the tolerances for this position are greater than the tolerances in the positioning moulded body (10).
The power semiconductor module (40) itself, which is to be arranged, has a housing (42) which surrounds a substrate (46), as a result of which the substrate (46) forms the first main surface of the power semiconductor module (40) and the housing (42) projects slightly beyond the substrate in the lateral direction. The substrate (46) projects beyond the housing (42) of the power semiconductor module (40) in the direction of the normal to this first main surface. The electrical connecting elements (44) are arranged on the second main surface of the power semiconductor module (40).
Each recess (12) has at least two stop means (20) which are preferably arranged opposite one another. These stop means (20) are preferably in the form of latching lugs, these latching lugs not projecting beyond the first main surface (14) of the positioning moulded body (10) in the direction of the normal to its surface. The latching lugs (20) are used to limit the movement of the power semiconductor module (40) in the direction of the normal to the first main surface (14) of the positioning moulded body (10). To this end, the housing part (42) of the power semiconductor module (40), which laterally projects beyond the substrate (46) and thus forms the stop edge (48), rests on the latching surfaces (22) of the latching lugs (20). In this case, the substrate (46) extends past the latching lugs (20) and forms, with the first main surface (14) of the positioning moulded body (10), a plane-parallel and aligned surface.
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As a result of the described apparatus having a positioning moulded body (10) and a body element (50) of a pack which has power semiconductor modules (40) arranged in it, the individual power semiconductor modules (40) are aligned with respect to one another with a lateral positional tolerance of 1 mm or less and a height tolerance between the planar first main surface (14) of the positioning moulded body (10) and the respective main surfaces of the power semiconductor modules (40), which are formed by the respective substrate (46), of less than 0.5 mm.
The inventive method for simultaneously treating the surface of the substrates of a plurality of power semiconductor modules (40) is based in this case, for example, on the arrangement of the power semiconductor modules (40) in a body element (50) of a pack having little lateral positioning accuracy. The positioning moulded body (10), which is positioned above the power semiconductor modules (40) in the direction of the normal to its second main surface, is used to align the semiconductor power modules laterally relative to one another down to the necessary tolerances. The position of the power semiconductor modules (40) is positioned using this inventive apparatus.
In a further step, the first main surfaces of the power semiconductor modules (40) can then be coated. This coating is effected either over the entire area, in which case the entire substrate (44) is coated with a layer having a homogeneous thickness, or in sections, in which case identical islands (60), for example, which are at the same distance from one another on the respective substrate (44) of the power semiconductor modules (40) are applied.
Said method can preferably be used to apply thermally conductive pastes and adhesives or else other materials to the substrates (44). Known screen printing or stencil printing methods are particularly preferred methods for this.
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Fig. 3 shows a three-dimensional illustration of a positioning moulded body (10) of the inventive apparatus. In this case, the configuration of the stop means (20) in the form of latching lugs and the conical profile (18) of the recesses (12) are particularly clear. Furthermore, the positioning moulded body (10) has at least two pegs (24) which are preferably arranged at opposite corners and are used as a positioning device. The frame of a screen (not illustrated) has corresponding recesses. The pegs (24) of the positioning moulded body are held in the associated recesses and thus position the printing screen relative to the power semiconductor modules (40), which are to be printed, during the screen printing process.
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WE CLAIM :
1. Apparatus for holding and positioning a plurality of power semiconductor modules (40) which are at a distance from one another, said apparatus having a positioning moulded body (10) having a planar first main surface (14) and a plurality of recesses (12) for holding the power semiconductor modules (40), each recess (12) having a stop means (20), as a result of which a main surface of a power semiconductor module (40) is respectively positioned such that it is plane-parallel to, and aligned with, the first main surface (14) of the positioning moulded body (10), and the recess (12) being designed to taper conically in the direction of the first main surface (14), at least in a partial section (18), starting from the second main surface (16).
2. Method for simultaneously treating the surface of a plurality of power semiconductor modules (40), the latter being arranged and fixed in this case in an apparatus according to Claim 1, and the entire area of the first main surfaces, or sections of the first main surfaces, of the power semiconductor modules (40) being coated with a material (60) using suitable methods.
3. Apparatus according to Claim 1,
the positioning moulded body (10) being arranged with respect to a body element (50) of a pack which has power semiconductor modules (40) arranged in it.
4. Apparatus according to Claim 1,
the stop means (20) being in the form of at least two lugs, which do not project beyond the first main surface (14) of the positioning moulded body (10) and are arranged inside the recesses (12), and resting on associated stop edges (48) of the power semiconductor modules (40).

5. Apparatus according to Claim 4,
the stop edges (48) of the power semiconductor modules (40) being formed by the housing (42) of the respective power semiconductor module (40), which housing projects beyond an associated substrate (44), which forms the aligned main surface, in the direction of at least two edges, or in the direction of the corners, of the recess (12).
6. Apparatus according to Claim 1,
the height tolerance between the planar first main surface (14) of the positioning moulded body (10) and the respective associated main surfaces of the power semiconductor modules (40) being less than 0.5 mm.
7. Apparatus according to Claim 1,
the positioning moulded body (10) having at least two positioning devices (24) for a screen printing apparatus.
8. Method according to Claim 2,
coating being effected using screen printing or stencil printing.
9. Method according to Claim 2,
the material (60) being a thermally conductive paste or an adhesive.
Dated this 17th day of October, 2006
A
HIRAL CHANDRAKANT JOSHI
AGENT FOR
SEMIKRON ELECTRONIK GMBH & CO. KG
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ABSTRACT
The invention describes an apparatus, and an associated method, for holding and positioning a plurality of power semiconductor modules which are at a distance from one another, said apparatus having a positioning moulded body having a planar first main surface and a plurality of recesses for holding the power semiconductor modules. In this case, each recess has a stop means, as a result of which a main surface of a power semiconductor module is respectively positioned such that it is plane-parallel to, and aligned with, the first main surface of the positioning moulded body. The recess is designed to taper conically in the direction of the first main surface, at least in a partial section, starting from the second main surface.
To,
The Controller of Patents
The Patent Office
Mumbai.
(Fig- 2)

22 18 42 44 40 16 50
Fig. 2
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14 20 46 12 48 60 10

NAME OF APPLICANT: SEMIKRON ELEKTRONIK GMBH & CO. KG
APPLICATION NO. : / /

NO. OF SHEETS : 02
SHEET NO. : 01


Fig.1
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HIRAL CHANDRAKANT JOSHI
AGENT FOR
SEMIKRON ELEKTRONIK GMBH & CO.KG

NAME OF APPLICANT: SEMIKRON ELEKTRONIK GMBH & CO. KG NO. OF SHEETS : 02
. APPLICATION NO. / / SHEET NO. : 01


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14 20 46 12 48



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22 18 42 44 40

16 50

Fig. 2



Fig. 3

HIRAL CHANDRAKANT JOSHI AGENT FOR SEMIKRON ELEKTRONIK GMBH & CO.KG

Documents:

1733-mum-2006-abstract(19-10-2006).pdf

1733-MUM-2006-ABSTRACT(30-11-2010).pdf

1733-mum-2006-abstract(granted)-(6-1-2011).pdf

1733-mum-2006-abstract.pdf

1733-MUM-2006-CANCELLED PAGES(23-12-2010).pdf

1733-MUM-2006-CANCELLED PAGES(30-11-2010).pdf

1733-mum-2006-claims(19-10-2006).pdf

1733-MUM-2006-CLAIMS(AMENDE)-(30-11-2010).pdf

1733-MUM-2006-CLAIMS(AMENDED)-(23-12-2010).pdf

1733-mum-2006-claims(granted)-(6-1-2011).pdf

1733-mum-2006-claims.pdf

1733-mum-2006-correspondence(28-11-2006).pdf

1733-MUM-2006-CORRESPONDENCE(30-11-2010).pdf

1733-mum-2006-correspondence(ipo)-(23-12-2009).pdf

1733-mum-2006-correspondence(ipo)-(7-1-2011).pdf

1733-mum-2006-correspondence-po.pdf

1733-mum-2006-correspondence-received.pdf

1733-mum-2006-description(complete)-(19-10-2006).pdf

1733-mum-2006-description(complete).pdf

1733-mum-2006-drawing(19-10-2006).pdf

1733-MUM-2006-DRAWING(30-11-2010).pdf

1733-mum-2006-drawing(granted)-(6-1-2011).pdf

1733-MUM-2006-ENGLISH TRANSLATION(30-11-2010).pdf

1733-mum-2006-form 1(19-10-2006).pdf

1733-mum-2006-form 1(29-11-2006).pdf

1733-MUM-2006-FORM 1(30-11-2010).pdf

1733-mum-2006-form 2(19-10-2006).pdf

1733-mum-2006-form 2(granted)-(6-1-2011).pdf

1733-mum-2006-form 2(title page)-(19-10-2006).pdf

1733-MUM-2006-FORM 2(TITLE PAGE)-(30-11-2010).pdf

1733-mum-2006-form 2(title page)-(granted)-(6-1-2011).pdf

1733-mum-2006-form 3(19-10-2006).pdf

1733-MUM-2006-FORM 3(30-11-2010).pdf

1733-mum-2006-form 5(19-10-2006).pdf

1733-MUM-2006-FORM 5(30-11-2010).pdf

1733-mum-2006-form-1.pdf

1733-mum-2006-form-18.pdf

1733-mum-2006-form-2.doc

1733-mum-2006-form-2.pdf

1733-mum-2006-form-3.pdf

1733-mum-2006-form-5.pdf

1733-mum-2006-general power of attorney(19-10-2006).pdf

1733-MUM-2006-GENRAL POWER OF ATTORNEY(30-11-2010).pdf

1733-MUM-2006-PETITION UNDER RULE 137(30-11-2010).pdf

1733-MUM-2006-REPLY TO EXAMINATION REPORT(23-12-2010).pdf

1733-MUM-2006-REPLY TO EXAMINATION REPORT(30-11-2010).pdf

1733-MUM-2006-SPECIFICATION(AMENDED)-(30-11-2010).pdf

abstract1.jpg


Patent Number 245188
Indian Patent Application Number 1733/MUM/2006
PG Journal Number 02/2011
Publication Date 14-Jan-2011
Grant Date 06-Jan-2011
Date of Filing 19-Oct-2006
Name of Patentee SEMIKRON ELEKTRONIK GMBH & CO. KG
Applicant Address POSTFACH 820251, 90253 NURNBERG,
Inventors:
# Inventor's Name Inventor's Address
1 JAKOB JOST EICHENWEG 12 90579 LANGENZENN,
PCT International Classification Number H01L21/68
PCT International Application Number N/A
PCT International Filing date
PCT Conventions:
# PCT Application Number Date of Convention Priority Country
1 102005052798.1 2005-11-05 Germany