Title of Invention

A METHOD AND APPARATUS FOR DISTRIBUTING A VISCOUS LIQUID OVER THE SURFACE OF A SUBSTRATE

Abstract It is shown a method and apparatus for distributing a viscous liquid over a surface of a substrate (1),e.g. a semi conductor wafer or a datastorage media, by conditioning the substrate thermally, locally specific before or during the spin coating process.
Full Text METHOD AND APPARATUS FOR CONTROL OF LAYER THICKNESSES
CROSS REFERENCE TO RELATED APPLICATON
This application claims priority of US Appl. No. 60/431,346,
which is incorporated herein by reference.
FIELD OF THE INVENTION
This invention generally relates to the field of spin
coating of substrates, especially to a method and apparatus
for controlling the thickness distribution of the coating
by controlling the temperature distribution of the coating
on the substrate.
BACKGROUND OF THE INVENTION
As is well known in the prior art, especially in the field
of semiconductor manufacturing but also in certain areas of
optics or biotechnology, a homogenous distribution of
liquids on a essentially plane substrate may be achieved by
rotating (spinning) a substrate around an axis normal to the
plane given by its surface. By applying a viscous liquid
onto the surface during spinning centrifugal forces affect a
distribution of the liquid radially outwards over the
surface. Such „spinning" technique is used to disperse e. g.
lacquer, resins, photo resist on semiconductor substrates.
Moreover it is utilised in the production of optical data
storage technology to provide an essentially homogeneous
layer of resin, lacquer, adhesive etc.. A special case is
the production of all type of DVD formats which require the
bonding of two half-disks.

A standard process for such distribution method is:
1) Dispensing a liquid on the substrate to be coated;
eventually rotating it slowly during this step to achieve a
advantageous initial spreading.
2) Spinning the disk at high speed (typically a few hundred
rpm up to 12.000 rpm) to homogeneously distribute the
liquid.
The thickness of the layer depends on parameters such as
viscosity, temperature, rotation speed and rotation time.
For substrates with a centre hole the profile of the spin
coated layer thickness shows a low-high trend from the inner
radius towards the outer edge. This is due the fact that
there is no liquid material at / close to the centre hole
which could flow outwards. This lack of material causes the
reduced thickness at small radii.
The variation of the thickness distribution therefore will
not be reduced to a minimized level by standard spin coating
process. In order to achieve an optimized coating condition,
an extra treatment during spin coating process is required.
Moreover, for substrates without a centre hole it is
difficult to achieve ramped thickness distributions, as
would be of interest e. g. for photo resist coating
thickness in mastering applications.
It is therefore desirable to have a method to influence the
radial thickness distribution during the spinning process.
The radial thickness dependence of a liquid's thickness is
dictated by the physics of the spinning process and cannot
be avoided with radially constant viscosity of the liquid.
The objective of the invention therefore is to provide a

method for controlling the viscosity of the liquid to be
distributed during spinning.
DESCRIPTION OP PRIOR ART
In semiconductor manufacturing the use of cooling or heating
chucks is widely known. Onto these chucks the semiconductor
substrates, normally a wafer, are clamped and by thermal
contact with the (heated or cooled) chuck the substrates'
temperature is adjusted according to the needs of the
particular processing step. However, such chucks seek to
adjust temperatures homogenously over the complete area of
the substrate.
A use and continuation of that principle is being shown in
US 6,242,044 B1. This document describes a method to adjust
the temperature of a CD radially from the centre to the
edge. This is achieved in an embodiment with a central
rotating shaft with a thereon mounted plate for carrying the
CD.
The bottom of the shaft only is being actively cooled and
via thermal conductivity a thermal gradient over the plate
is being formed. The drawbacks of this method are as
follows: The temperature gradient is being dependant on the
material of the chuck and the environmental conditions such
as ambient temperature. Moreover the system will need time
to achieve a stable condition, i. e. the thermal gradient
must develop.
Furthermore polycarbonate is a relatively good thermal
insulator, therefore cooling and/or heating a liquid
dispensed on the surface via the plastic substrate is
inefficient.

SUMMARY OF THE INVENTION
To influence the liquid's viscosity in a spin coating
process, especially the resin layer thickness distribution
of spin-coated substrates with a centre hole (e.g. optical
disks like DVD, CD, Blu-Ray...etc.), a temperature gradient
is created locally selectively before or during a spinning
process by a heat source directed to the side of the
substrate where the liquid is distributed on. Alternatively
a cooling source can be used to achieve such a temperature
gradient.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
One embodiment of the invention comprises a stream of hot
(temperature range 40-90°C) gas directed on the outer radius
of the disk during spinning, in order to change the liquid's
viscosity over the radius of the disk.
In another embodiment, the stream of hot gas is directed via
suitable means onto several areas of the substrate. Another
embodiment allows to control temperature and/or flow of gas
selectively to precisely control the liquid's viscosity and
thereby thickness distribution of the liquid on the spin
coated substrate. „Gas" is to be understood in the broadest
manner, such as simple air or cleaned gases provided from
gas reservoirs. Heating of the gas may be achieved
electrically via a resistance heating or other technical
suitable means.
This thermal conditioning may in another embodiment of the
invention be achieved by sources of electromagnetic
radiation. This may comprise lamps with essential visible
spectra or IR spectra.

In a further emodiment the invention's thermal source may
comprise several sub sources, which can advantageously be
directed to different locations of the substrate during
spinning. This results in a control of thermal conditions in
an essential circular region around the axis of rotation.
Technically this may be achieved by e. g. a plurality of
nozzles, directing heated or cooled gases to such regions of
the substrate. Another variety is to use a plurality of
lamps, such as IR radiators or halogen lamps, being arranged
to aim at different locations of the substrate.
In case of gas nozzles, thermal conditioning of the
substrate can easily be adjusted by regulating gas flow
and/or temperature of the gas. In case of lamps this can be
accomplished by regulating the power distributed to the
respective lamp. For both cases the angle of the nozzle or
lamp with respect to the plane of the substrate is a further
parameter to finetune the thermal conditioning.
An apparatus suitable to implement the invention may
comprise a rotatable support, dispensing means to spread a
liquid on the surface of the substrate and means to fasten
at least one thermal source in a position with respect to
the substrate, where it can influence the thermal condition
of the substrate. In one embodiment this fastening means may
comprise a cover with the thermal source and, eventually,
dispensing means affixed to it.
In a preferred embodiment the thermal sources are attached
to an arm, which extends over at least a portion of the
rotatable support. This arm, cover or in general fastening
means may be movable in a way to clear the area of the
substrate/support in order to load and unload the substrate
from and to the support.

BRIEF DESCRIPTION OF THE DRAWINGS
Figure 1 is a cross sectional view of a rotational support
with a substrate.
Figure 2 shows an embodiment of the invention with an arm
extending over the substrate with several thermal sources.
Figure 3 shows the result of an experiment according to the
invention
DETAILED DESCRIPTION OF THE DRAWINGS
Figure 1 shows a substrate 1 on a support 2. The substrate
has a centre hole which allows to centering it around a
rotation axis 3. The arrow indicates the rotation of support
and substrate. Driving means for rotation are not shown.
During rotation excess liquid is being spinned outwards,
shields 4 and 6 protect the environment from such excess
liquid.
Figure 2 shows the embodiment of Figure 1 with a movable arm
11 with a source of radiation 10. The movability of arm 11
is indicated by arrows 12. As can easily be understood, the
arm may be moved linearily, pivoted horizontally or
vertically or in any other suitable manner to clear the area
of substrate and support. This may be especially necessary
when the substrate is being loaded or unloaded from the
support. Loading and unloading mechanisms are not shown,
they can be construed according to the state of the art.
Arrows 13 indicate the effective direction of a plurality of
thermal sub sources.
In an application of the inventive method in an apparatus
according to the invention, substrate 1 is being placed by

suitable means on support 2. Substrate 1 may be a
semiconductor wafer, a datastorage media such as a CD, DVD
or alike or any essentially flat workpiece. In a preferred
embodiment arm 11 carries as well thermal sources as
dispensing means, so after placing the arm above the
substrate liquid could be dispensed. This way the liquid is
being spread upon the surface of substrate 1, eventually
while being rotated slowly. After spreading the liquid the
spinning of the substrate is initiated and in parallel to or
shortly after start of spinning the thermal conditioning
begins. The conditioning time can be defined by precedent
experiments, or alternatively contact free measurement means
determine the end of the thermal conditioning.
Furtheron edge effects, like the build up of droplets at the
edge of spin coated substrates can be avoided by selectively
directing a thermal source at such edge.
Basically the thermal source(s) locally influence the
viscosity of the liquid, such that a desired distribution,
homogenous or a selectively inhomogenous, on the surface of
the substrate is being achieved.
In another way of using the invention the order of steps may
be changed, in a way, that the substrate is being preheated
in the way described, the liquid being dispensed and spinned
afterwards. This may be advantageous for applications, where
e. g. mechanical, physical or chemical constraints do not
allow the order described beforehand. In this case the
thermal capacity of the substrate must be sufficient to hold
the thermal gradient until the liquid's visosity can be
influenced.

The inventive method may be performed at a single process
station, where the thermal source, dispensing means and
rotatable means are being joined. However it may be
beneficial to distribute the steps of thermal conditioning,
dispensing and spinning to several process modules.
Figure 3 shows results of a single heat source (flow of
heated air) being directed to an outer region of an optical
storage media during spin coating with resin. Comparison to
an unconditioned sample shows significant improvement of
layer homogeneity. In contrast to not heated substrates with
monotone increasing thickness as a function of the radius,
the thickness of the partially heated substrates decreases
after reaching a maximum at a radius of about 35-45 mm.
The thermal gradient applied between different areas of a
substrate was just a few degrees, in case of a bonding
lacquer on a DVD half disk about 4° C. Depending on
viscosity and other environmental conditions a thermal
gradient of about 10° C is sufficient for most applications.

We Claim:
1. A method for distributing a viscous liquid over a surface of a substrate,
comprising the steps:
- placing a substrate essentially horizontal on a support
- applying a viscous liquid onto a surface of said substrate
- rotating the substrate to distribute the liquid radially outwards and
- conditioning the liquid on the substrate thermally, to influence its
viscosity locally in a specific way by creating a locally selective
temperature gradient;
- said thermal conditioning being effected by a thermal source of
heat or cold placed above the surface of the substrate and directing
a stream of heated or cooled gas or by a source of electromagnetic
radiation to the substrate.
2. A method as claimed in claim 1, wherein the source of radiation is a lamp
with essentially visible spectra or an IR radiator.

3. A method as claimed in claim 1, wherein the thermal source comprises at
least two sub sources.
4. A method as claimed in claim 3, wherein the sub-sources are directed to
different positions with regard to the radius on the substrate.
5. Apparatus for thermal conditioning a liquid on a rotating substrate
comprising:

- a rotatable support,
- dispensing means for a liquid to be distributed on the substrate
surface and
- fastening means for at least one thermal source placed above the
substrate;
- said thermal source adopted to create a locally selective
temperature gradient;
- Said thermal source being a stream of hot or cool gas, or one of at
least a source of radiation, a lamp, an IR radiator.

6. Apparatus as claimed in claim 5, wherein the fastening means comprise a
cover, extending over at least a part of the support.
7. Apparatus as claimed in claim 5, wherein the fastening means is
construed as an arm, extending over at least a portion of the support.,
8. Apparatus as claimed in claim 5, wherein the dispensing means are
mechanically affixed to the fastening means.
9. Apparatus as claimed in claim 5, wherein the fastening means are
movable with respect to substrate and support in order to remove the arm
at least during loading and unloading of the substrate.
10. A method for distributing a viscous liquid over a surface of a substrate,
comprising the steps:

- rotating the substrate on an essentially horizontal support and
- conditioning the substrate thermally, locally specific by creating a
locally selective temperature gradient

- said thermal conditioning being effected by a thermal source of
heat or cold placed above the surface of the substrate and directing
a stream of heated or cooled gas to the substrate.
- applying a liquid onto a surface of said substrate
- rotating the substrate such that the liquid is being radially
distributed according to a desired distribution.

It is shown a method and apparatus for distributing a viscous liquid over a
surface of a substrate (1),e.g. a semi conductor wafer or a datastorage
media, by conditioning the substrate thermally, locally specific before or during the spin coating process.

Documents:

1300-KOLNP-2005-FORM 27.pdf

1300-KOLNP-2005-FORM-27.pdf

1300-kolnp-2005-granted-abstract.pdf

1300-kolnp-2005-granted-assignment.pdf

1300-kolnp-2005-granted-claims.pdf

1300-kolnp-2005-granted-correspondence.pdf

1300-kolnp-2005-granted-description (complete).pdf

1300-kolnp-2005-granted-drawings.pdf

1300-kolnp-2005-granted-examination report.pdf

1300-kolnp-2005-granted-form 1.pdf

1300-kolnp-2005-granted-form 13.pdf

1300-kolnp-2005-granted-form 18.pdf

1300-kolnp-2005-granted-form 2.pdf

1300-kolnp-2005-granted-form 3.pdf

1300-kolnp-2005-granted-form 5.pdf

1300-kolnp-2005-granted-form 6.pdf

1300-kolnp-2005-granted-gpa.pdf

1300-kolnp-2005-granted-reply to examination report.pdf

1300-kolnp-2005-granted-specification.pdf


Patent Number 231458
Indian Patent Application Number 1300/KOLNP/2005
PG Journal Number 10/2009
Publication Date 06-Mar-2009
Grant Date 04-Mar-2009
Date of Filing 05-Jul-2005
Name of Patentee OERLIKON TRADING AG
Applicant Address TRUEBBACH, HAUPTSTRASE, CH-9477
Inventors:
# Inventor's Name Inventor's Address
1 CHIEH OU-YANG 458 N. OAKHURST DR., UNIT #103, CA, BEVERLY HILLS 90210
PCT International Classification Number B05C 1/08
PCT International Application Number PCT/CH2003/000791
PCT International Filing date 2003-12-02
PCT Conventions:
# PCT Application Number Date of Convention Priority Country
1 60/431,346 2002-12-05 U.S.A.