Title of Invention

PANEL WITH A SOUND-INSULATION LAYER, AND A MANUFACTURING METHOD

Abstract The invention relates to a method for manufacturing a panet with a sound-insulation layer which comprises a multi layer consisting of several individual layers (1,2,3,4,5), the layers are made of carrier board (1) decorative paper (2) counteracting paper (3) or a wood veneer (3) and an additional layer in the form of a sheet (5) or a roll (5) having sound insulation property and the top layer is made of a abrasion resistance layer (4), at least one or more layers of the multi-layers impregnated with an aminoplastic and a compact layer Is formed by pressing two multi layers in a press under the influenced of heat at least 100°c, each compact layer is provided with a locking means with tongue (7) and grooves (6,8) to mount with a second compact layer to a plane having same locking means by pressing to cover large area.
Full Text PANEL WITH A SOUND-INSULATION LAYER, AND A
MANUFACTURING METHOD
The invention relates to a method for applying to a flooring panel a layer
designed to reduce the footfall sound on the floor, and a panel of this kind.
In the context of flooring, panels in the form of laminated flooring or
parquet flooring are already known. A laminated flooring panel consists of
a so-called carrier board, which is generally manufactured from HDF, MDF
or chipboard. A so-called decorative paper and another layer, which
ensures adequate resistance to abrasion on the upper surface, are generally
disposed above the carrier board. The decorative paper may, however,
already be designed to be abrasion-resistant. A so-called counteracting
paper is disposed beneath the carrier board.
In particular, the papers are impregnated with aminoplastics, especially,
with urea resins and/or melamine resins. Such resins will soften and harden
again, if the papers are pressed with the carrier board in a press under the
influence of temperature and pressure.
The decorative paper ensures the desired visual appearance of the flooring
formed from the panels. The counteracting paper is provided to ensure that
the carrier board and/or the panel are not distorted during the pressing of
the layers and/or papers.
Parquet panels differ from laminate, in particular, with reference to their
surface. The desired visual effect is achieved with wood instead of with a
printed paper. A parquet floor is made of solid wood, but may also provide
a carrier board made from HDF, MDF or chipboard. In this case, a wooden
veneer or paper is then applied to the upper surface. A special wood or
paper layer is applied to the underside as a counteracting layer.
If the panels are laid on an under-floor, a relatively loud footfall sound
occurs when the floor is walked over. To prevent the development of such
sound, the prior art provides a so-called footfall-sound-insulation. This is a
layer with sound-damping and/or sound-absorbing properties applied
beneath a panel. Additionally, or as an alternative, the layer may bring
about a shift in the frequency and amplitude of the sound produced, which
is then subjectively perceived as less disturbing.
The layer providing footfall insulation will be referred to in general below
as the "sound-insulation layer".
Sound-insulation layers are designed, in particular, as follows:
The sound-insulation layer is generally resiliently deformable by contrast
with the panel defined above. A layer of this kind may consist, for
example, of recycled polyurethane material, rubber, cork, foam,
thermoplastic materials, fibre matting or LDF (low density material). The
density is generally around 200 to 1000 kg/m3. Alternatively, a so-called
heavy foil can be used as a sound-insulation layer. This is characterised by
a weight of 1000 to 5000 g/m2.
A heavy foil glued to the laminate ensures good contact with the under-
floor, which improves application to the surface disposed beneath thereby
enhancing the perception of sound when walking on the floor. A typical
heavy foil consists of polyethylene with fillers.
With the prior art, it is disadvantageous that the sound-insulation layer is
glued onto the laminate panel in a subsequent manufacturing stage.
Accordingly, the panel is initially manufactured by pressing with the
associated gluing of layers and/or papers. The sound-insulation layer is
glued in place in a subsequent operational stage. PVA-glues, thermoplastics
or wood glues may be used, for example, to attach the sound-insulation
layer.
Retrospective gluing and the associated additional operational stage not
only makes the manufacturing process more expensive, but the edge seal is
also relatively poor. If a sound-insulation layer is attached in a separate
operational stage, it is hardly possible to achieve a successful flush edge
seal. In general, therefore, there is a region beneath the panel, which is
without a sound-insulation layer, because a flush seal is difficult to achieve
in practice and is unlikely to be of good quality. Accordingly, the desired
effect of the sound-insulation layer is impaired. Since this region is
generally adjacent to the tongues and grooves of the panel, the mechanical
stresses on these locking elements are particularly large when the floor is
walked over. Moreover, there is a risk, that the sound-insulation layer can
become detached from the panel during subsequent processing stages or
during floor laying.
Furthermore, a thermoplastic glue provides the disadvantage that it does
not bond the sound-insulation layer particularly firmly to the panel, and the
sound-insulation layer can easily become detached from the panel. This
leads to in handling problems and disadvantages in production, for
example, when the connecting elements are cut to size.
If the sound-insulation layers are easily detached from the panel, this
creates problems whenever the panels need to be shifted during laying,
because the sound-insulation layer could become detached from the panel
during laying. Providing a method and an associated panel, wherein the
sound-insulation layer is connected to the panel in an improved manner,
wherein the edge seals are improved and wherein production costs are more
favourable, is a desirable objective.
The adhesive matarials used may be associated wtlh environmental
problems. For example, the adheoives may contain solvants, which
pollute the environment. This leads to problems relating to the
disposal of the adhsstvss. Moreover, the adhesive to an additonal
component required in the production process. Avoiding the use of
an addttlonal adhesive for attaching a sound-insulalton layer to a
panel is therefore also desirable.
The object of the Invention Is to pmrtda a coaHavourabia method
together with an associated panel, which, by comparison with the
prior art, provides improved properties in a footfall and room
sound-insulation layer.
The further object of the present invention is to propose an method
for manufacturtng a sound insulator panel which help in recycling of
polyuraethane and environment friendly.
According to the invention, m the manufacture of a panel with a
carrier board, decorative paper, counteracting paper an/or a wood
veneer, an additional layer, preferably In the form of a sheet or a
roll, is provided. The material of this roll or sheet product is
designed to provide the desired sound-insultation properties as
described above ond/or provides these properties when a panel is
being walked over. The roll or sheet product to placed in a press
and pressed together with the othtr components at a temperature
of at least 100°C. Highar temperatures are preferably provided
during pressing, in particular temperature above 120°C. The
temperature ara3 typically above 200°C, but preferably 230°C to
250°C, In order to achieve short pressing times. Short pressing
times allow the panels to be manufactured more rapidly, ensuring
that the method Is cost favourable.
The sheet or roll product must be suitably temperature resistant. If
pressing takes place at 200°C, the material, from which the sound-
insulation layer is made, must be able to withstand the selected
temperature.
Selecting the appropriate materials in dependence upon a corresponding
pressing temperature, in order to achieve a cost-favourable manufacturing
process, can be left to a person skilled in the art.
In the manufacture of a laminate panel, the counteracting paper is
impregnated with an aminoplastic. During pressing, the aminoplastic
material bonds the sound-insulation layer to the panel.
The bond between the sound-insulation layer and the panel is considerably
more stable by comparison with the prior art.
The manufacturing process is also more cost favourable, because one
operational stage has been omitted. Additional adhesives are not required,
which also leads to cost advantages. Furthermore, the method is
environmentally friendly, because adhesives, which must be additionally
disposed of, are not required. Solvents present in the adhesives are also
avoided.
According to experience, after the manufacture of a large-format panel, the
panels are sawn into panels of, for example, 1.40 m x 0.20 m, and the
locking elements, such as tongues and grooves are milled into the panels. A
flush edge seal is achieved between the panel and the sound-insulation
layer, and accordingly, in this context, the disadvantages named above are
avoided.
Since the bond between the sound-insulation layer and the panel is very
strong, the milling stage can be carried out without difficulty. With the
prior art, this process presented difficulties, because the bond between the
panel and the footfall sound-insulation layer was relatively unstable.
If the sound-insulation layer is to be connected to a parquet panel, a short-
cycle press is used for this process. To provide the aminoplastic, a paper
can be placed between the lowest layer of the panel and the sound-
insulation layer. In this case, the paper may be impregnated or otherwise
provided with the aminoplastic.
In one embodiment of the invention, a recycled polyurethane material is
used, and the sound-insulation layer is formed from this material. The
material is cost favourable and provides very good sound-insulation
properties. It is obtained from the recycling industry and is therefore
environmentally compatible.
In this context, the sound-insulation layer should be at least 0.5 mm thick
in order to achieve good sound-insulation properties, which are acceptable
to the consumer. In practice, the layer made from recycled polyurethane
material can be up to 5 mm thick. If the sound-insulation layer is very
thick, noticeable disadvantages occur with reference to thermal
conductivity. Good thermal conductivity is relevant if under-floor heating
is to be installed or used. An excessively thick laminate floor is also
undesirable, because of the associated large structural height after laying.
This is disadvantageous to the consumer, for example, because doors may
have to be adapted, as occurs routinely, particularly in the context of
refurbishment.
Melamine resin and/or urea resin and/or mixtures thereof are preferred as
the aminoplastics. These are resins, which are typically used in decorative
papers and counteracting papers. If these resins are used, no additional
material components need to be provided for the manufacture of the
product.
The pressure applied in the press is typically between 5 and 70 kPa. The
sound-insulation layer is generally compressed during this process. When
using polyurethane (PUR), the layer is typically compressed, for example,
from 1.2 mm to 0.5 mm. However, because of the conservation of mass, the
sound-insulation properties are not significantly changed.
Recycled polyurethane material, for example, with a density between 110
kg/m3 and 750 kg/m3 may be used as a starting material.
The product manufactured according to the invention differs from the prior
art particularly in that the bond between a panel and the sound-insulation
layer is achieved with an aminoplastic. In particular, the bond is achieved
on the basis of aminoplastics, which are also used in the manufacture of a
panel. This is advantageous because it avoids the use of additional
materials.
In a further embodiment of the invention, as an alternative to recycled
polyurethane material, a material, from which a heavy foil is manufactured,
may be used. Polyethylene with fillers is preferred in this context.
Experiments have shown that the named materials, recycled polyurethane
material and polyethylene with the fillers, achieve particularly good sound-
insulation properties. Moreover, these materials can be processed without
difficulty and attached to a laminate or parquet flooring panel.
In manufacturing, products on a roll are used by preference, so that the
panels can be pressed using double-band press. Otherwise a short-cycle
press would have to be used, which would significantly increase
manufacturing costs, because short pressing times cannot be realised.
With the method according to the invention, a panel is manufactured, in
which a layer is bonded beneath the panel using an aminoplastic. Because
sawing and milling are carried out at a subsequent stage, the product is
essentially characterised by its very good edge seal. Accordingly, no gap is
left between the underside of the panel and the sound-insulation layer. This
means that the flush edge seal is an additional essential feature of the
product manufactured according to the method.
The sound-insulation layer terminates flush with the panel, in particular, at
the position where sawing or milling has been carried out. For example, the
flush seal can also be provided with a groove, which has been milled into
the underside of the panel, for example, for use in a non-glued connection
between panels.
A visible offset between the sound-insulation layer and the flooring panel
does not therefore occur, unless it is created in another, subsequent
operational stage.
The selected materials, recycled polyurethane material and polyethylene
with fillers, are heat-resistant, so that they can be pressed under the
influence of heat. They are also particularly suitable for this reason.
In the case of a laminate, the thickness of a panel is typically 5 to 14 mm.
With parquet flooring panels, the thickness is typically approximately 10 to
20 mm. The sound-insulation layer on the underside, which may be very
thin, is added to this.
The sound-insulation layer is preferably thinner than the panel, in
particular, thinner than the carrier board.
The invention will now be described in greater detail with reference to the
exemplary embodiment shown in the drawing.
The drawing shows a cross-section of a laminate panel, which has been
manufactured from a carrier board 1, a decorative paper 2, a counteracting
paper 3 and an abrasion-resistant layer 4. The carrier board consists of
MDF/HDF (but other materials are possible). This material is made from
wood fibres, which are first provided with glue and then pressed in a press
to form a board. The decorative paper 2 is first attached to the carrier board
1, and the abrasion-resistant layer 4 is attached above this. The
counteracting paper 3 is attached beneath the carrier board 1. The paper
layers and the abrasion-resistant layer are initially provided with a mixture
of a melamine resin and/or urea resin. Under the influence of heat and
pressure, the resins are softened. A strong bond between the various layers
is achieved through the subsequent hardening.
By way of difference from the prior art, according to the present invention,
a sound-insulation layer 5 was additionally pressed together with the other
layers named above. The sound-insulation layer, in this case, consists of
polyurethane (PUR). The initial layer thickness was 1.2 mm. As a result of
compression of the various layers, this thickness is reduced to 0.5 mm. The
sound-insulation layer 5 is bonded to the counteracting paper 3 by means of
the resins used.
After manufacturing the layered composite material, a groove 6 and a
tongue 7 were milled into the sides of the panel. A groove 8 is provided in
the underside of the panel (if required).
As a result of the manufacturing method, the transition from the sound-
insulation layer 5 to the panel is flush. This applies to the lateral limits of
the panel and also to the transitions which occur relative to the groove 8.
Metal plates, which connect two panels 1 together in the horizontal
direction, can be inserted into the groove 8 of one panel and the
corresponding groove 8 of another panel during floor laying. Accordingly,
a groove 8 is allocated to each tongue and each groove. For reasons of
clarity, only one groove 8 has been shown in the drawing. If the panel had
been drawn in its entirety, another groove 8, allocated to the tongue 7,
would be visible in mirror-image reversal.
WE CLAIM:
1. A method for manufacturing a sound insulator panel
comprises:
- a multi-layer consisting of several individual layers
( 1, 2, 3, 4, 5);
- an individual layer is made of a carrier board (1)
decorative paper (2) counteracting paper (3) or a
wood vaneer, (3) and an additional layer in the form
of a sheet (5) or a roll (5) having sound insulation
property and top layer is made of a abrasion-
resistance layer (4);
- at least one or more layers of the multi—layers
impregnated with an aminoplastic; characterized in
that:
- a compact layer is formed by pressing the multi-
layers in a press under the influence of heatf
- the hardening of compact layer developed by bonding
the wooden layer or paper layer with aminoplastic
material under the influence of heat and pressure and
- each compact panel to provided wich looking means with
tongue (7) and grooves (6, 8) to mount with a second
compact layer in a plane having sama locking means by
2. Method for manufacturing a panel as claimed in claim 1,
wherein the sound-insulation layer consists of a resently
deformable material.
3. Method for manuncturing a panel as claimed in claim 1 or 2,
wherein the insulation layer consists of recycled polyethylene
material, rubber, cork, foam, thermoplastic material fiber
matting, LDFor polyethylene.
4. Method for manufacturing a panel as claimed in any one of
the preceding claims, wherein the sound-insulation layer
provides a density of 20 to 24500 kg/m3.
5. Method for manuncturing a panel as claimed in any one of
layer to be pressed and the sound-insulation layer is
preferably thinner than the carrier board.
6. Method for manufacturing a panel claimed in any one of the
preceding claims, wherein a carrier board, which consists of
HDF, MDF, chipboard or wood, is used as the layer to be
pressed.
7. Method for manufacturing a panel as claimed in any one of
the proceding claims, wherein paper impregnated in an
aminoplastic are used as the layers to pressed.
8. Method for manufacturing a panel as claimed in any one of
the preceding claims, wherein a carrier board and a sound-
insulation layer are pressed with a paper impregnated with an
aminoplastic and disposed between them.
9. Method for manufacturing a panel as claimed in any one of
the preceding claims, wherein a melamine resin and/or a urea
resin is used as the aminoplastic.
10. Method for manufacturing a panel as claimed in any one
of the preceding claims, wherein at least one layer consisting
of wood, which preferably forms an upper layer in the layer
system to be pressed, is provided.
11. Method for manufacturing a panel as claimed In any one
of the preceding claims, wherein the sound-insulation layer
consists of a material, which is temperature-resistant above
100°C, preferably above 200°C..
12. Method for manufacturing a panel as claimed in any one
of the preceding claims, wherein the panel manufactured in
tha above manner is sawn after pressing .
13. Panel, capable of being manufactured using a method
as claimed in any one of the preceding claims, wherein a
panel by means of an aminoplastic, and the panel provides
locking elements,in particular, lateral tongues and groves.
14. Panel as claimed in the preceding claims, wherein the
sound-insulation layer consists of a reallenbly deformable
material.
15. Panel as claim in any one of the preceding devices
claims, wherein the sound-insulation layer consists of recycled
polyumethane material, rubber cork, foam, thermoplastic
materials, fiber matting, LDF or polyethylene.
16. Panel as claim in any one of the preceding devices
claims, wherein the sound-insulation layer provides a density
from 20 to 2500 kg/m3.
17. Panel as claim in any one of the preceding devices
claims, wherein the panel provides a carrier board, and the
sound-insulation layer is thinner than the carrier board.
18. Panel as claimed in any one of the preceding device
claims, wherein the panel provides a carrier board which
consists of HDF, MDF, chipboard or wood, and a decorative
paper or a wood veneer is applied above the carrier board.
19. Panel as claimed in any one of the preceding device
claims, wherein a paper provided wfth an aminoplastic to
20. Panel as claimed in any one of the preceding device
claims wherein a malamine resin and/or a urea resin is used
as the aminoplastic.
21. Panel as claimed in any one of the preceding device
claimes, wherein at least one layer consisting of wood, which
preferably forms an upper layer in the layer system, which
forms the panel, is provided.
22. Panel as claimed in any one of the preceding device
claims, wherein the sound-insulatlon layer consists of a
material, which is temperature-resistant above 100°C,
preferably above 200°C.
23. Panel as claimed in any one of the preceding device
claims, wherein the sound-insulation layer terminaates flush
with the panel at the sides.
24. Panel as claimed in any one of the preceding device
claims, wherein the panel is 5 to 20 mm thick, and the sound-
insulation layer is up to 5 mm thick.
25. Panel as claimed in any one of the preceding device
claims, wherein at least one groove is milled into the panel
from below, and tha sound-insulation layar means the groove
at both sides in a flush manner.
The invention relates to a method for manufacturing a panet with a
sound-insulation layer which comprises a multi layer consisting of
several individual layers (1,2,3,4,5), the layers are made of carrier
board (1) decorative paper (2) counteracting paper (3) or a wood
veneer (3) and an additional layer in the form of a sheet (5) or a
roll (5) having sound insulation property and the top layer is made
of a abrasion resistance layer (4), at least one or more layers of the
multi-layers impregnated with an aminoplastic and a compact
layer Is formed by pressing two multi layers in a press under the
influenced of heat at least 100°c, each compact layer is provided
with a locking means with tongue (7) and grooves (6,8) to mount
with a second compact layer to a plane having same locking
means by pressing to cover large area.

Documents:

522-kolnp-2004-granted-abstract.pdf

522-kolnp-2004-granted-claims.pdf

522-kolnp-2004-granted-correspondence.pdf

522-kolnp-2004-granted-description (complete).pdf

522-kolnp-2004-granted-drawings.pdf

522-kolnp-2004-granted-examination report.pdf

522-kolnp-2004-granted-form 1.pdf

522-kolnp-2004-granted-form 18.pdf

522-kolnp-2004-granted-form 2.pdf

522-kolnp-2004-granted-form 26.pdf

522-kolnp-2004-granted-form 3.pdf

522-kolnp-2004-granted-form 5.pdf

522-kolnp-2004-granted-reply to examination report.pdf

522-kolnp-2004-granted-specification.pdf

522-kolnp-2004-granted-translated copy of priority document.pdf


Patent Number 226775
Indian Patent Application Number 522/KOLNP/2004
PG Journal Number 52/2008
Publication Date 26-Dec-2008
Grant Date 24-Dec-2008
Date of Filing 20-Apr-2004
Name of Patentee M. KAINDL
Applicant Address WALSER WEG 12, A-5071 WALS/SALZBURG
Inventors:
# Inventor's Name Inventor's Address
1 RUHDORFER HERBERT WALSER WEG 12, A-5071 WALS/SALZBURG
PCT International Classification Number B32B 31/00
PCT International Application Number PCT/EP02/07149
PCT International Filing date 2002-06-28
PCT Conventions:
# PCT Application Number Date of Convention Priority Country
1 101 51 614.2 2001-10-23 Germany