| Title of Invention | A HEAT SINK, A HEAT SINK ASSEMBLY, AND A METHOD OF DISSIPATING HEAT FROM A MICROPROCESSOR |
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| Abstract | A heat dissipation device for an integrated circuit assembly is disclosed. A heat sink (100) for a microprocessor comprises a thermally conductive base (110) having a plurality of fin structures (120) upwardly extending from the thermally conductive base (110). The plurality of fin structures (120) having a first surface (123) comprises a plurality of surface area enhancer structures (130) to increase a convection surface area of the heat sink (100) for a given volume of a heat sink to enhance heat dissipation from the heat sink. |
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IN-PCT-2002-1052-KOL-CORRESPONDENCE.pdf
IN-PCT-2002-1052-KOL-FORM-15.pdf
in-pct-2002-1052-kol-granted-abstract.pdf
in-pct-2002-1052-kol-granted-claims.pdf
in-pct-2002-1052-kol-granted-correspondence.pdf
in-pct-2002-1052-kol-granted-description (complete).pdf
in-pct-2002-1052-kol-granted-drawings.pdf
in-pct-2002-1052-kol-granted-examination report.pdf
in-pct-2002-1052-kol-granted-form 1.pdf
in-pct-2002-1052-kol-granted-form 18.pdf
in-pct-2002-1052-kol-granted-form 3.pdf
in-pct-2002-1052-kol-granted-form 5.pdf
in-pct-2002-1052-kol-granted-gpa.pdf
in-pct-2002-1052-kol-granted-letter patent.pdf
in-pct-2002-1052-kol-granted-reply to examination report.pdf
in-pct-2002-1052-kol-granted-specification.pdf
| Patent Number | 220498 | ||||||||
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| Indian Patent Application Number | IN/PCT/2002/1052/KOL | ||||||||
| PG Journal Number | 22/2008 | ||||||||
| Publication Date | 30-May-2008 | ||||||||
| Grant Date | 28-May-2008 | ||||||||
| Date of Filing | 16-Aug-2002 | ||||||||
| Name of Patentee | INTEL CORPORATION | ||||||||
| Applicant Address | 2200 MISSION COLLEGE BOULEVARD, P.O.BOX 58119, SANTA CLARA, CA 95052-8119 | ||||||||
Inventors:
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| PCT International Classification Number | H01L 23/367 | ||||||||
| PCT International Application Number | PCT/US01/04087 | ||||||||
| PCT International Filing date | 2001-02-07 | ||||||||
PCT Conventions:
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