Title of Invention

METHOD FOR MAKING A NANO-PARTICULATE MEDIUM

Abstract In a method for making a nano-particulate medium, platinum, silicon nitride and a nitride of a magnetic element which will disassociate under thermal processing in a vacuum are sputtered onto a substrate in predetermined quantities, the substrate is subjected to a rapid thermal-processing operation in a vacuum, in which the substrate is raised over a given period of time to a temperature at which the nitride of the magnetic element disassociates, releasing nitrogen by diffusion and leaving behind the magnetic element, and the substrate is allowed to cool. The magnetic element alloys with the platinum to form particles which are substantially mono-disperse and substantially uniformly distributed in the silicon nitride. The alloying process takes place immediately the nitride of the magnetic element disassociates. The magnetic element is preferably cobalt and the substrate is preferably also raised to a temperature which allows the formation of a PtCo alloy in a tetragonal crystalline form.
Full Text WO 2004/105007 PCT/GB2004/002118
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METHOD FOR MAKING A NANO-PARTICULATE MEDIUM
Field of the Invention
The invention relates to a method for malting a nano-particulate medium and to a
method for making a recordable magnetic medium involving the use of such a
method.
State of the Art
The relentless demand for increased capacity on all data storage systems is driving
continual increases in the areal density at which data must be stored on the
recording surface, m magnetic recording the thickness of the storage medium is
limited by the available write field so that any increase in areal density at a given
media thickness must be accompanied by a corresponding reduction in the physical
volume available to store 'one bit' of information. At current magnetic recording
densities, a single data bit is encoded as the presence or absence of a transition
from one magnetic domain to the next on a scale where each domain contains very
many particles or grains.
These groups of grains, which form a domain, switch their magnetisation
collectively, creating uncertainty in the final location of the transition. The useful
information is stored in the central part of the bit. At the boundaries of each bit the
poles of the magnetic bits directly oppose one another and these opposing magnets

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tend to destabilise each other and produce ill-defined transition regions. This adds
to the noise. In order to enhance the signal-to-noise level it is desirable to ensure
that the number of grains per bit is much higher than the number of bits at the
boundaries. This requires that each bit occupy an area of currently many hundreds
or thousands of grains. This is shown hi simplified form in Figure 1, hi which the
central region 10 can be seen to consist of a relatively large number of grains
having the same magnetic orientation, this then constituting a single bit.
If the recording density is to be increased, the domain size must become smaller
and therefore the scale of the individual magnetic particles (grains) that comprise
the domain must accordingly be reduced to maintain the number of particles per
domain constant in order not to suffer a degradation in the signal-to-noise ratio.
Unfortunately recording densities are now such that further decreases in particle
size will soon be blocked by the 'superparamagnetic limit'. This is the point at
which the thermal energy of the medium's environment becomes comparable with
the anisotropy energy of the magnetic particle. When the volume (V) of a particle
is reduced to the superparamagnetic limit the medium becomes essentially non-
ferromagnetic and loses all ability as a recording medium. Moreover long before
the superparamagnetic limit is actually reached, the probability of spontaneous
magnetisation reversal in very fine grained material becomes significant and the
integrity of recorded data is extremely reduced at typical hard-drive operating
temperatures. The acceptable minimum lifetime (standard) for recorded data is
currently ten years. To maintain the long-term integrity of recorded data when
developing media capable of supporting areal densities of around 1 x 1012bits per
square inch (1 Tera bits per square inch - the industry's goal by 2010), it is
necessary to devise procedures for extending the superparamagnetic limit.
Under the constraint imposed by the superparamagnetic limit, a desirable recording
medium is conceived as one consisting of an array of identically sized (mono-
disperse), single-domain particles of a material possessing high intrinsic magnetic
anisotropy and sufficiently dispersed so that any mutual magnetic interaction is
minimised.

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The difficulties of finding commercially viable techniques for the physical
realisation of such a medium are manifold and challenging. The routes in this
direction currently being explored by the recording industry are:
(i) patterned media produced using lithographic and or etching processes, and
(ii) self-assembling particulate arrays produced via complex chemical or
biological routes.
Both of these are incompatible with current magnetic hard-disk production
techniques. Route (i) is limited in that it cannot within the foreseeable future
produce media structured at the 2.5nm to 12nm required, nor can it produce large
areas of media cost-effectively. Route (ii), although proven to produce, mono-
disperse particles of the size required, struggles to achieve uniformity over any
significantly useful recording area,
A second factor to be taken into account in the development of a magnetic
recording medium is the desirability of producing a so-called "perpendicular"
recording medium. There are two main recording techniques commonly employed
and these are illustrated in Figures 2(a) and 2(b).
In Figure 2(a) a so-called "longitudinal" recording arrangement is shown
comprising a recording medium 20 composed of a number of magnetic domains 22
and a read/write head 24. The domains can be seen to lie horizontally on the
diagram, or "longitudinally" along the major axis of the recording medium and in
addition the inductive write head is a double-pole magnet 26. By contrast, one
form of a known perpendicular recording system comprises for a recording
medium a series of domains which lie vertically (see Figure 2(b)) and face into or
out of a soft magnetic underlayer 28. This perpendicular arrangement also employs
a single-pole write head 30. It is generally accepted that the limit of capacity of a
longitudinal recording system is around 100-200 Gb/in2, whereas the limit with the
perpendicular system is held to be an order of magnitude greater.

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It can therefore be seen that it would be desirable to provide a magnetic recording
medium which contained mono-disperse, single-domain particles having a high
perpendicular anisotropy.
Scope of the Inverttion
The Scope of the Invention is defined in the numbered claims which follow the
description.
Brief Description of the Drawings
An embodiment of the invention will now be described, by way of example only,
with reference to the drawings, of which:
Figure 1 is a simplified diagram of a domain structure in a prior-art recording
medium;
Figure 2 is a perspective view of two types of recording arrangement: longitudinal
(Figure 2a) and perpendicular (Figure 2b);
Figures 3(a) and 3(b) show in front and plan view, respectively, equipment which
may be used to carry out the method according to the invention;
Figure 4 is a sectional view through a substrate on which are deposited sputtered
layers prior to heat treatment in a subsequent rapid thermal processing operation;
Figure 5 is a comparison between the performance of a known conventional
perpendicular medium and that of a recording medium manufactured under a
method according to the present invention; and
Figures 6 to 8 illustrate further developments/details.
Detailed Description of an Embodiment of the Invention
A method according to the invention for producing a magnetic recording medium
involves the use of apparatus such as that illustrated in Figures 3(a) and 3(b).

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In Figures 3(a) and 3(b), which are front and plan views, respectively, a sputtering
chamber 40 contains at one end, in conventional fashion, a negative electrode 42 in
contact with three targets 44, 46 and 48 composed of platinum, cobalt and silicon
nitride, respectively. At the other end of the chamber, again in known fashion, a
positive electrode 50 is provided, on which a number of substrates 52 are placed.
The substrates are preferably made of a high-temperature glass. The targets and
substrates having been placed inside the chamber, the chamber is evacuated
through a port 54 and an inert gas, which preferably consists of an argon/nitrogen
mixture, is introduced into the chamber through a second port 56. A high voltage is
then fed to the electrodes 42, 50, which sets up a plasma (glow discharge) 60 in the
intervening space. The plasma consists of positive ions of the inert gas. The ions
are accelerated towards the cathode and knock atoms off of the targets, these atoms
then impacting the anode and adhering to the substrates. This is a sputter 'up1
process in that the substrates are above the targets. Such a process is advantageous
when preparing recording media as particles cannot fall off the targets and
contaminate the media being formed.
Both DC and RF voltages are used in the spluttering process. The platinum and
cobalt are DC spluttered but the silicon nitride is RF sputtered as it is an insulator.
Cobalt nitride is produced by 'reactive' sputtering i.e. cobalt nitride is formed
when the cobalt reacts with the nitrogen in the sputtering.
During the sputtering process a heater 58 may assist the deposition process by
heating the substrates and the electrode 50 is made to rotate by some suitable
means. This rotation ensures that all of the substrates are coated equally by the
target atoms.
As each substrate moves round, it picks up atoms from each of the targets in turn,
which will therefore normally form in discrete layers on the substrate. The
thickness of the layers will depend largely on the speed of rotation of the substrate
electrode and the magnitude of the power supplied to the targets, and indeed, if the
rotational speed is high enough (and/or the target power is suitably low), the layers
will be so thin as to amount to one homogenous layer, once sputtering is

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completed. A situation in which discrete layers are formed is shown in Figure 4.
Here the glass substrate 52 can be seen to be coated with a series of tri-layer
coatings 53 composed of platinum (Pt), cobalt nitride (C02N) and silicon nitride
(S13N4). (The order of these constituent parts is arbitrary.) The number of such
composite layers is determined by the number of passes of the substrate past each
of the targets. In the preferred realisation of the present method the total thickness
of each composite layer is between approximately 3nm and 5nm. Although the
three constituent layers form ing each composite layers are shown to be of identical
thickness, in practice they may well be of different thicknesses. This is discussed in
more detail later.
Once the desired number of coatings has been sputtered on and to the desired
depth, both the platinum and the cobalt targets are switched off (i.e. the negative
high-voltage feed to them is interrupted), leaving only the silicon nitride target still
energised. This then continues to apply a sputtered layer of silicon nitride to the
topmost layer of the substrates, this new layer constituting an outermost rugged
protective layer 62, which is particularly useful where the structure thus created is
to be employed as a recording medium in conjunction with a read/write head.
A preferred thickness of the protective layer 62 is between approximately 5nm and
10nm.
The sputtering process completed, the substrates are removed from the chamber 40
and inserted into a heating chamber (not shown), where they are subjected to a
rapid thermal processing (RTP) phase, in which they are very rapidly heated in a
vacuum by an optical heating process to a temperature of between 500 and 650°C
which is maintained for an interval of between 30 and 60 seconds, after which the
optical heat source is removed and the sample allowed to cool naturally in vacuum,
The cobalt nitride is unstable and the actual target temperature is chosen such that
the cobalt nitride disassociates, releasing nitrogen that escapes by diffusion and is
pumped away. The freed cobalt is left in a dispersed, very active quasi-vapour state
and readily alloys with the similarly dispersed platinum which, like the silicon

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nitride, is unaffected at the elevated temperatures employed. This process occurs
whether sputtering has produced discrete layers originally or one large
homogeneous layer, as mentioned as a possibility above.
The composition of this material - i.e. the relative thicknesses of the three
constituent layers - is chosen so that, on cooling, the density of the PtCo alloy
forming throughout the resulting silicon nitride matrix is insufficient for its
formation as a single layer, but is "condensed" into a dispersion of substantially
identically sized particles having volumes almost optimally spaced between the
single-domain and superparamagnetic limits. More precisely, the particles should
at their largest extreme be small enough to be in the single-domain state, where
their only magnetisation-reversal process is by coherent rotation against the
anisotropy field. If they are larger than this, reversal becomes easier as domain
growth processes become possible. At the lower extreme of particle size, the
volume of each particle should be such that its total magnetic energy is
considerably larger than the thermal energy of its surroundings, otherwise it will
become superparamagnetic instead of ferromagnetic and incapable of storing
information.
It should be noted that, because of the presence of the SiN/SisN-t, the particles do
not form a single layer (a "mono-layer") on the substrate, but are separated into a
plurality of layers, so that a magnetic bit is still formed by a number of particles, as
is currently the case in the prior art. This has the advantage of giving a larger
readout signal and hence, as with the known methods, a larger S/N ratio.
The relative thicknesses of the Pt, C0N/C02N and SiN/Si^ layers can, then, be
readily established by experiment and are produced by applying different DC
voltages to the three targets 44, 46, 48 in the chamber 40 (see Figures 3(a) and
3(b)).
In a preferred realisation of the invention, the temperature attained during the RTP
phase is such as not only to ensure disassociation of the C0N/C02N, but to ensure
that the PtCo alloy formed is in its crystalline form. This is desirable, since the

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anisotropy of the alloy produced in this particular crystalline form is higher than
with other crystalline forms. The temperature at which crystallisation in this form
takes place is higher than that at which the C0N/C02N disassociates, hence the
actual temperature to which the substrate is taken during the RTP phase is the
higher of the two temperatures.
The RTP temperatures cited above are those at which the necessary disassociation
of the nitride of the magnetic element and, preferably also, the desirable crystalline
form of the resulting alloy take place. These temperatures in any evaluation of the
inventive process may or may not relate to the actual temperature of the substrate
in question. In testing the present method, for instance, the inventors measured not
the temperature being reached by the substrate in question, but that of a similar, but
unprocessed, substrate placed alongside the substrate in question. Thus it is
possible that the actual substrate temperature(s) at which the desired effect(s) are
observed are different from the temperatures being measured. This, however, is
immaterial, as long as the measured temperatures are accurately correlated with the
occurrence of these desired effects. A similar consideration applies'in respect of
the use of different compositions. Samples which are made with deliberately
different compositions (e.g. in which the ratio of the amount of C0N/C02N to the
amount of Pt is different) will have different optical absorptions. They will
therefore take up energy during the optically driven thermal-processing phase with
different efficiencies. Consequently, two different samples processed at the same
measured temperatures will reach different true temperatures and care must be
taken to ensure that each sample, whatever its composition, is raised to a
temperature sufficient for the required disassociation, and preferably also the
required crystallisation, to occur.
A very considerable degree of control over the properties of the recording medium
and the resultant recording characteristics is afforded by the precise manipulation
of the deposition parameters (including target voltage, substrate rotation rate, etc)
during sputtering and the time-temperature profiles employed during the RTP
phase.

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The RTP temperature determines not only whether disassociation and correct
crystallisation takes.place but also whether the final product has a higher or lower
coercivity. The initial pt, C02N and SisN ratios determine the final characteristics
of the resulting medium.
Although in the process described above the sputtering and RTP phases have been
assumed to take place in two distinct locations, they may be carried out in a single
piece of apparatus. This may take the form of a conventional sputtering chamber
which has been modified by the inclusion of an appropriate heating means for
heating the substrates up to the required temperature range.
In addition, whereas the described process has created particles made of PtCo, the
present invention also envisages the use of iron nitride (FeN) in place of cobalt
nitride, which would then result in the creation of PtFe particles instead of PtCo,
though it would be necessary to take into account a possible difference in target
temperature at which the FeN would disassociate compared with the C0N/C02N.
Another substitution that could be made is that of diamond-like carbon for the
silicon nitride of the final protective layer. Diamond-like carbon is the industry's
favourite interfacial layer for recording heads due to its extreme durability and
ruggedness and may therefore have advantages over the use of SiN/Si3N4 for this
function. It may well, however, have to be applied to the treated substrate in a
separate chamber (this is in contrast to the SiN/Si3N4 protective layer, which is
applied in the same chamber as the C0N/C02N4 and Pt), and this would
considerably complicate the production cycle.
Typical changes needed in order to create a medium with much better
characteristics include the substrate and protective overlayer being optimised to
low flying recording heads and the thickness of medium optimised to maximise
read out signal and a soft appropriate underlayer added to the production process.
The production routine described above uses plant and processes already in
common use in the hard-disk recording industry and delivers a near mono-disperse
medium uniformly across large areas. The medium has a high perpendicular

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anisotropy and lias been produced during tests with high remanence and
coercivities in the range 2.5kOe to >16kOe. In initial recording experiments,
media having coercivities at the lower end of this range have already been
demonstrated to support perpendicular recording at densities approaching that
achieved by the most advanced current conventional media.
This is demonstrated by comparing Figure 5(a) with Figure 5(b). These recording
experiments were conducted using the stray field of longitudinal recording heads
not optimised perpendicular heads. Figures 5 illustrate the performance of a
recording medium made in accordance with the present invention, but employing
the relatively low RTP target temperature of 500°C and having as a consequence a
relatively low coercivity allowing the ready writing of data to the medium, even
without the use of a soft magnetic underlayer often employed with perpendicular
recording systems (cf. Figure 2(b)). It is worth noting that the substrate used in this
test was not specially prepared in any way, e.g. by special cleaning and smoothing.
It is also worth noting that the substrate used in this test was prepared with no
Si3N4 separator layers only an overcoat. The different traces correspond to
different data rates ranging from 3.2kfci (3200 flux changes per inch) to 128kfci.
The latter corresponds' to a data density of approximately 300 Mb/sq. inch. Figures
5, on the other hand, shows the performance of a known continuous thin-film
multi-layer medium made using known techniques and with readings taken using a
perpendicular recording system with soft magnetic underlayer to aid writability.
The substrate used here had been specially cleaned and smoothed, which has the
effect of enhancing the performance.
As can be seen, the performances of the two systems are very comparable. The
main difference, however, is that, although the known system is working at the
upper limit of its capacity, the purely experimental system illustrated is at the lower
end of its capability. Greater performance can be enjoyed by raising the sputtered
substrate to a higher temperature during the RTP phase, so as to give rise to smaller
particles of higher coercivity and anisotropy, which will enable much greater
quantities of data to be written to the medium - up to 1 Tb per square inch and

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beyond. la that case, however, it will be necessary to employ local optical heating
of the medium in order to be able to perform the writing operation.
Referring now to Figures 6 (a) and 6 (b), the material compared in the writing
experiments with the IBM material consists only of Cobalt nitride and Platinum
with a 10 nm over-layer of silicon nitride. There is no silicon nitride filling or
separator. The sample before RTP consisted of 72 'layers' of cobalt nitride and
Platinum each layer being 0.09Inm thick respectively. Note these are not layers in
accepted sense since they are sub-atomic thickness. Figure 6 (a) shows the RTP
heating profile of temperature as a function of time. It is seen that the sample is
kept at the plateau 'temperature' for 60 seconds. Figure 6(b) shows the saturated
magnetic hysteresis loop of this material in the perpendicular direction as obtained
using Polar Kerr effect.
As a second example of how we can vary characteristics consider a film deposited
in the same 4 minute time period as the above but now with silicon nitride
sputtered at the same time. The sample is composed of 108 'layers' of Cobalt
nitride, Platinum and Silicon nitride. The layer thickness are 0.091nm, 0.078nm
and 0.014nm respectively. Again the sample is over-coated by lOnm silicon
nitride. This sample is processed at a plateau temperature using the RTP profile of
Figure 7(a).
This produces the magnetic hysteresis loop in the perpendicular direction shown in
Figure 7(b) now obtained using the Faraday effect in an attempt to increase the
field available in the instrumentation. It is seen that this is a minor loop that is not
saturated in the field available. We are still endeavouring to produce a saturated
loop of this material which we expect to be square with a coercivity of around
20kOe. This material should support a very high recording density with good
stability.
Figure 8 is an example of a Faraday loop of the same material as in previous graph
but subjected to RTP at 500°C instead of 650°C. As can be seen the loop is much

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squarer saturates at approximately 20kOe and has a coercivity of approximately
10kOe.
While the present manufacturing process is mainly directed to the production of a
recording medium, it may also he put to use in other applications. One such is a
catalytic process involving alloys such as PtCo. The advantage of the present
method of manufacturing the mono-disperse, uniform distribution of PtCo particles
in a matrix is that, since the particles themselves are so small and substantially
spherical, the area-to-volume ratio of the particles is high, which can result in a
superior catalysis performance, since there is then relatively more surface area of
the PtCo particles available to perform the catalytic process. When used in a
catalytic application, the nano-particulate medium made in accordance with the
present invention will normally not require the protective layer described earlier.
In summary, when Pt is added CoPt alloy particles are formed and may be
developed to exhibit the full anisotropy of that alloy expressed perpendicularly.
The techniques described herein relate to HARM (Heat Assisted Recordable
Magnetic) media and can result in forming perpendicular HARM media with the
potential to store in excess of lTb/sq. in.
Whilst the magnetic element is preferably cobalt, in principle sputter from a cobalt
nitride target could also be used.

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CLAIMS
1. A method for making a nano-particulate medium, comprising:
(a) sputtering onto a substrate platinum, silicon nitride and a nitride of a
magnetic element which will disassociate under thermal processing in a
vacuum, the sputtering being such as to produce predetermined relative
quantities of the platinum, silicon nitride and the nitride of a magnetic
element;
(b) subjecting the thus treated substrate to a rapid thermal-processing
operation in a vacuum, in which the substrate is raised over a given period
of time to a temperature at which the nitride of the magnetic element
disassociates, releasing nitrogen by diffusion and leaving behind the
magnetic element, and
(c) allowing the substrate to cool,
whereby the magnetic element alloys with the platinum to form particles which
are substantially mono-disperse and substantially uniformly distributed in the
silicon nitride.
2. Method as claimed in Claim 1, wherein cobalt nitride is used for the nitride of a
magnetic element and the formed particles are PtCo particles.
3. Method as claimed in Claim 2, wherein the rapid thermal-processing operation
heats the substrate from ambient temperature to >500°C over a period of
between 30 and 60 seconds.
4. Method as claimed in Claim 2 or Claim 3, wherein the temperature reached
during step (b) is such as to ensure the formation of PtCo particles in a
tetragonal crystalline form.
5. Method as claimed in Claim 4, wherein the rapid thermal-processing operation
heats the substrate from ambient temperature to between 600 and 650°C over a
period of between 30 and 60 seconds.

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6. A method for making a perpendicular heat assisted recordable magnetic
medium, comprising a method for making a nano-particulate medium as
claimed in any one of the preceding claims and further comprising the step of
providing a protective outermost layer.
7. Method as claimed in Claim 6, wherein the protective outermost layer is a
silicon nitride layer produced by allowing the sputtering of the silicon nitride in
step (a) to continue after the sputtering of the platinum and cobalt nitride has
ceased.

8. Method as claimed in Claim 7, wherein said continued sputtering is sufficient to
produce a protective layer of between approximately 5nm and 10nm thickness.
9. A catalytic apparatus, wherein the catalyst comprises a PtCo nano-particulate
medium made in accordance with a method as claimed in any one of Claims 2
to 5.
10. A method for making magnetic nano-particles substantially as hereinbefore
described with reference to any appropriate combination of the accompanying
text and drawings.

In a method for making a nano-particulate medium, platinum, silicon nitride and a nitride of a magnetic element which will disassociate under thermal processing in a vacuum are sputtered onto a substrate in predetermined quantities, the substrate is subjected to a rapid thermal-processing operation in a vacuum, in which the substrate is raised over a given period of time to a temperature at which the nitride of the magnetic element disassociates, releasing nitrogen by diffusion and leaving behind the magnetic element, and the substrate is allowed to cool. The magnetic element alloys with the platinum to form particles which are substantially mono-disperse and substantially uniformly distributed in the silicon nitride. The alloying process takes place immediately the nitride of the magnetic element disassociates. The magnetic element is preferably cobalt and the substrate is preferably also raised to a temperature which allows the formation of a PtCo alloy in a tetragonal crystalline form.

Documents:


Patent Number 219069
Indian Patent Application Number 02354/KOLNP/2005
PG Journal Number 17/2008
Publication Date 25-Apr-2008
Grant Date 23-Apr-2008
Date of Filing 23-Nov-2005
Name of Patentee COVENTRY UNIVERSITY
Applicant Address PRIORY STREET, COVENTRY CV1 5FP, GREAT BRITAIN
Inventors:
# Inventor's Name Inventor's Address
1 NEWMAN, DAVID, MICHAEL 4 BELLE VUE CLOSE, KENN, EXETER EX6 7UU GREAT BRITAIN
2 WEARS, MAVIS, LESLEY 1 COMPASS QUAY, HAVEN ROAD, EXETER EX2 8GW, GREAT BRITAIN
3 JOLLIE, MICHAEL, JAN 221 LYNDON ROAD, SOLIHULL, WEST MIDLAND B92 7QN, GREAT BRITAIN
PCT International Classification Number G11B 7/24
PCT International Application Number PCT/GB2004/002118
PCT International Filing date 2004-05-17
PCT Conventions:
# PCT Application Number Date of Convention Priority Country
1 0311568.0 2003-05-20 U.K.