Title of Invention

A SOLDERING APPARATUS AND A METHOD FOR REMOVING SOLDER OXIDES FLOATING ON MOLTEN SOLDER

Abstract

There are disclosed a soldering apparatus comprising a solder wave shape forming means for melting solder and forming solder wave shape, and a separating agent dusting means for dusting solder oxides with a separating agent which separates solder and solder oxides, wherein said separating agent is any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour, and peanut hull flour, or a combination thereof, as well as an agent and a method for separating solder and solder oxides.

Full Text

SPECIFICATION SOLDER AND SOLDER OXIDES EI.ELD OF THE INVENTION The present invention relates to an automated soldering apparatus and a solder recovering apparatus for use in the printed wiring board and the like, particularly relates to a soldering apparatus and a solder recovering apparatus which separate solder oxides with solder adhered thereto into solder and solder oxides and recover them. The present invention also relates to a method for separating solder oxides with solder adhered thereto into solder and solder oxides and a method for separating solder oxides in contact with molten solder into solder!' and solder oxides. The present invention also relates to a method for removing solder oxides from solder oxides floating on molten solder. The present invention also relates to a separating agent which can separate solder oxides from solder oxides with solder adhered thereto or solder oxides in contact with molten solder. The present invention further relates BACKGROUND OF THE INVENTION . A large amount of solder oxides are formed when electronic parts are soldered on the printed wiring board using a dip-type soldering apparatus or a flow-type soldering apparatus. Moreover, when the solder oxides are scooped up from molten solder or drained from a solder bath to solidify, a large amount of solder is observed to bo adhered to the solder oxides. Such the solder oxides with solder adhered thereto are sold to the regenerators at a low price. In order to prevent oxidation of solder, an anti-oxidizing agent such as heat-resistant mineral oil has been added to the surface of mo 1 ten solder, or a solder bath and its surroundings have been enclosed with an inert gas such as nitrogen gas so that the oxygen concentration is reduced to mi nim i ze oxidation of solder. On the other hand, a powdery product obtained by adding a potassium salt to ammonium borohydrochloride is commercially available as a separating/reducing agent for solder oxides, which can separate solder from solder oxides with solder adhered thereto to remove only said solder oxides (tradename / KI.EENOX OR-904P / sold by ELECTROVERT) . In addition, for example, JP-A-5-6334 9 and the 1 i ke proposed a wave solder bath equipped with A means for- flowing out solder oxides from the solder bath together ! with a heat-resistant fat and oil. However, the previous selling of the solder oxides to the regenerators has a great loss of solder because a large amount of expensive solder is adhered to solder oxides. The addition of the anti-oxidizing agent to the sur face of mol ten sol fier makes the solder bath stickily smeary with the anti-oxidizing oil and the like, which leads to not only troublesome cleaning but also adhering to the pr i nted wiring board and the like. The solder bath disclosed in JP-A-5-63 3 49 also has a si mi 1 ar problem that the heat-resistant, fat and oi 1 is accumulated in a solder reservoir or a duct for! solder is clogged with the fat and oil. The use of the inert gas results in a higher cost and requires larger and more complicated facilities. The powdery separating agent containing aminoni um borohydrochlori de as a main component is expensive at. about 6,000 yen/450 g and, upon handling, requires safety management such as paying attention so as not to make the agent., touch with a skin, wearing eyeglasses for protect, i ng eyes, and the like. QaJE£IS-.QF THE INVENTION A main object of the present invention is to provide a soldering apparatus and a solder recovering apparatus which can prevent a soldering apparatus from smearing wi th an anti-oxidizing agent such as a heat-resistant fat and oil, which is safe and non-polluting, and which can easily remove solder oxides floating on molten solder. An another object of the present invention is to provide a method for removing solder oxides which can prevent a soldering apparatus from smearing with an ant i~ oxi.dizi.ng agent such as a heat-resistant fat and oil, which is safe and non-polluti ng, and which can easily remove i solder oxides floating on molten solder. An another object of the present invent, ion is to provide a separating agent which can easily separate and remove only solder oxides when solder oxides with solder adhered thereto are immersed into molten solder, and a solder recovering apparatus using such the separating agent. An another object of the present invention is to provide a separating agent which can easily separating solder oxides from solder oxides with solder adhered thereto or from solder oxides in contact with molten solder. A further object of the present invention i s to provide a vessel for receiving solder oxides with solder adhered thereto or solder oxides in contact with molten sol Her - These objects as well as other objects and advantages of the present invention will become apparent from the followi ng description with reference to the attached drawings. SliMM&RY OF THE INVENTION In order to solve the aforementioned problems, the present inventions features a soldering app-n rat us, comprising a solder wave shape forming means for melt i ng solder and forming a solder wave shape, and a separating i agent dusting means for dusting solder oxide with a separating agent for separating solder and solder oxides, wherein said separating agent is a vegetable member, more particularly, any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour and peanut hull flour, or a combination thereof. The present invention features the aforementioned soldering apparatus, wherein said vegetable separating agent for separating solder and solder oxides is any one selected from the group consisting of offal (such as rice bran, bran, wheat bran, mixed barley bran, naked barley bran, mixed naked barley bran and the like), cereal grain or flour (such as foxtail, Deccan grass, millet and rice), bean flour (such as soybean, azuki bean, peanut, coconut and the like), and seed grain or flour (such as sesame, sunflower, palm, rapeseed, cotton and . the like), or a combination thereof. For example, the vegetable separating agent may a separating agent obtained by mixing rice bran and sesame flour in a ratio by weight ranging 100:20 ~ 100:5. E*y mixing sesame flour into offal, the duration of Separating i acti on is prolonged. , Of course, other combinations and a mixture of two or more separating agents may be arbitrarily used. In addition, the present invention features a method for separating solder oxides from molten solder, which comprises a step of scooping up solder oxides float, ing on molten solder (at around 280-290°C) into a vessel, a step of dusting said solder oxides with any one of the above separating agents (such as rice bran) or a combination thereof, a step of pulling out said vessel from a solder bath to separate solder and solder oxides, and a step of discharging separated solder oxides (oxidized draff). In addition, the present inventions features an another method for separating solder oxides, which comprises a step of dusting solder oxides float ing on mo1 ten solder with any one of the above separating agents (such as foxtail grain) or a combination thereof, a step of scooping up solder oxides floating on molten solder into a : t vessel, a step of pulling out said vessel from a solder bath to separate solder and solder oxides, and a step of-discharging separated solder oxides. In addition, the present invention features a vessel (which is used in the aforementioned soldering apparatus or method) for scooping up solder oxides floating on molten so Ider compr i ses -a netted basket having a mesh open i.nq (through hole) area of around 1-10 mm% desirably around 1 -2.2 5 mm'7, or a press-worked punching metal such as having a plurality of openings on an underside and each sidewnll, each of openings having an opening area of around 1-2.2'") mm'. A range sett ing of the opening area of 1-vlO mm*7 in the netted basket or the punching metal was determined by an experiment such that solder separated from solder oxides is smoothly returned to a molten solder bath and oxidized dra f f (solder oxides) remains within the vessel. The const i tuent members of the netted basket or the punch i ng metal is made of a material such as stainless steel and the i i ke, to which no solder is adhered. The netted basket; is formed so that a diameter of constituent wires of the net is approximately 0.3-0.7 mm and a side of a rectangular opening is approximately 1.0-3 mm. Preferably, a diameter of constituent wires of the net is approximately 0.5 mm and a side of the rectangular opening is approximately 1.2 mm. The mechanism how each of the above separating agents separates solder oxides with solder adhered thereto or solder oxides in contact with (or floating on) molten solder into solder and solder oxides can be considered as follows: an oil component which constitutes the Separating agent: (organic acid R-(COOH)n component contained in the oil (that is, oleic acid, linolic acid, palmitic acid and the 1i ke) ) exert s the reducing effects on metal oxides as exemplified by the following equation: SnO, * 4RC00H » [RCOO] In addition, phosphorus (P) and the fats and o i.ls contained in the separating agent are considered to exert the function of prevent]ng solder oxidation. Moreover, fiber, hydrocarbon and the like wh i.ch countitute the separating agent are considered to associate wi th solder oxides (dross) to inhibit association[of solder ox ides with molten solder. It is considered that a component which is converted to carbon (C) by heating with molten solder reacts as reprosonted by the following equation: SnO. + C ~> Sn + CO, Carbon acts as a reducing agent. Moreover, when sodium (Na) is contained in the separating agent, it also acts as a reducing agent. Particle si ze distribution of each powdery separating agent is not necessarily required to be regulated. Particle size distribution resulted from a step of polishing unpolished rice or producing wheat flour may be used as such (a range of about 0.01jzm-l mm) . Incidentally, the components of rice bran, one example of brans, are exemplified as follows: not more than 2% of phosphorus (P), 13.4% of protein, 17.1% of crude fat, 7.9* of crude fiber, 10.2% of crude ash content, 0.06% of calcium (Ca), and major remaining portion of digestj ble components (poultry, swine, bovine and the like) (other components are omitted). Rice bran comprises triturates such as those of f rui t skin, seed coat and germ,! wh i.ch are obta i ned upon pol ishing hulled rice and the like. Commercial ava i .1 able rice bran for pick!es has an each s 1. ight amount of sa 11, sea tangle, red pepper and the like added and such the rice bran exhibits the efficacy as a separating agent equivalent to that of rice bran itself. in addition, a determined amount of an ant i. septic (such as benzoic acid compound) and an insect repel lent may be mixed into rice bran. Alternatively, rice bran may be anti sops is-or insect proof-treated. Next, of cereals, foxtail, millet and Deccan grass grains have the following components: Foxtail has 7.0 g of fat, 240 mg of phosphorus (P), 7 mg of sodium (Na), 21 mg of calcium (Ca), 5 mg of iron, and 9.9 g of protein (other components are omitted) in 100 g of an edible portion. Millet has 9.1 g of fat, 270 mg of phosphorus(p) , an extremely small amount of sodium (Na), 20 mg of calcium (Ca), 3.5 mg of iron, and 12.7 g of protein (other components are omitted) in 100 g of an edible portion. Deccan grass has B. 3 g of fat, 330 mg of phosphorus (P) , an extremely smal 1 amount of sodium (Na) , 33 mg of calcium (Ca) , 3. r> mg of iron, and 9.3 g of protein (other-components are omitted) in 100 g of an edible portion. Next, of beans, soybean has the following components: *17.r> q of fat, 470 mg of phosphorus (P) , 3 mg of sodium (Na) , 1.90 mg of calcium (Ca), 7 mg of iron, and 34.3 g of prote i n (other components are omi tted) .in 100 g of an edib.1 e portion (see "Kagakubinran" Applican Section, edited by Nihon Kagaku Gakkai, 1973, pp. 13 66-1367, 14 04-140f>/published by Maruzen K.K.). Therefore, the above respective separating agents other than ri ce bran also contain an oil component and i phosphorus, or an oil component and, thus, like rice bran, sepa rate solder oxides in contact with molten solder or solder oxides with solder adhered thereto into solder and so 1 dor oxides. I n partlcular, bean flour (soybean, azuki bean, peanut , coconut and the like) and seed grain or flour (sesame, sunflower, pa 1 m, rapeseed and the like) , wh i ch arc r i ch in oil and fat components/ are effective. Fatty acid in sesame contains a large amount of oleic acid and 1jnolic acid. Next, of cereals, foxtail grain is odor], ess and is easily fed at a constant quantity. Foxtail grain is generally spherical or popcorn-shaped and has approximately 1-2 mm of an outer diameter and approximately 1-2 mm of length, which can be used as such. Part ide size regulation and grinding process may be carried out as necessary. Upon separation of solder oxides, foxtail grain may be fed in an amount: equivalent to that of rice bran. In addition, the separating agent of the present invention may contai n one member or a combination of two or more members as mentioned above. In addi ti on, the present invention features a separating agent for separating solder oxides, wi th so 1 der adhered thereto or so Ider oxides in contact with molten so]der into solder and solder oxides, which comprises any one selected from the group consi sting of offal (such as r ice bran, bran, wheat bran, mixed barley bran, naked bar 1ey bran, mi xed naked barley bran and the 1 ike), bean f 1 our. (such as soybean, azuki bean, peanut, coconut and the like), soybean-cake flour, peanut hull flour, and seed f 1 our (such as sesame, sunflower, palm, rapeseed, col ton and the like), or a combination thereof. In addition, the present invention features a method for separating solder oxides with solder adhered thereto into solder and solder oxides, which comprises a step of placing solder oxides with solder adhered thereto into a vesse 1, a step of immersi ng said vessel into a mol ten sol der bath (around 2 80oC-2 90°C) to melt said solder- ox Ides with solder adhered thereto, a step of dusting ; the solder oxi dos with so] Her adhered thereto with any one of the above separating agents (for example, rice bran) or a combination thereof, and a step of pulling out said vessel from the molten solder bath to separate solder and solder oxides. In addition, the present invention features the aforementioned method for separating solder oxides with solder adhered thereto into solder and solder oxides, further comprising a step of pulling out said vessel from and immersing it into the solder bath, or moving said vessel up and down multiple times after dusting with the separating agent, as necessary. In addi tion, the present invention features an another method for separating solder oxides wi th so 1 dor adhered thereto i nt o solder and solder oxides, which cornpr i.ses a step of placing solder oxides oxides with solder adhered thereto with any one of the above separating agents (for example, rice bran) or a combination thereof, a step of immersing said vessel into a molten solder bath to melt said solder oxides with solder adhered thereto, and a step of pulling but said vessel from the solder bath to separate solder and solder oxides. In addition, the present invention features an another method for separating solder oxides with solder adhered thereto into solder and solder oxides, which comprises a step of immersing a vessel into a molten solder bath by about half, a step of placing solder oxides with solder adhered thereto into said vessel, a step of dusting said solder oxides with solder adhered thereto with any one of the above separating agents (for example, rice bran) or a combination thereof, and a step of pulling out said vessel from the solder bath after melting solder oxides with solder adhered thereto, to separate solder and solder oxides. i In addition, the present invention features a method i for separating solder oxides in contact with molten solder into solder and solder oxides, which comprises a step of scooping up solder oxides floating on molten solder into a vessel, a step of dusting said solder oxides with any one i of the above separating agents (for example, rice bran) or a combination thereof, and pulling out said vessel from the solder bath to separate solder and solder oxides. In addition, the present invention features an another method for separating solder oxides in contact with molten solder into solder and solder oxides, which comprises a step of dusting solder oxides floating on molten solder with any one of the above separating agents (for example, rice bran) or a combination thereof, a step of scooping up solder oxides floating on molten solder into a vessel, and pulling out said vessel from the solder bath to separate solder and solder oxides. Further, the present invention features a vessel for receiving solder oxides with solder adhered thereto or solder oxides in contact with molten solder, comprising a netted basket having a mesh opening (through hole) area of around 1-10 mm2, desirably around 1-2.25 mm2, or a press-worked punching metal such as having a plurality of openings on an underside and each sidewall, each of openings having an opening area of around 1-2.25 mm2. The constituent members of the netted basket or the punching metal is made of a material such as stainless steel and the like, to which no solder is adhered. The netted basket is formed so that a diameter of constituent wires of the net is approximately 0.3-0.7 mm and a side of a rectangular opening is approximately 1.0-3 mm. Preferably, a diameter of constituent wires of the net is approximately 0.5 mm and a side of the rectangular opening is approximately 1.2 mm. Pursuant to the aforementioned essential features, there can be provided a separating agent for separating solder and solder oxides, a soldering apparatus (or a solder recovering apparatus) and a method for separating solder and solder oxides, which are safe in working, at a low cost, harmless to human body and non-polluting. Moreover, according to the present invention, a work of separating solder oxides can be easily automated and an amount of solder to be discarded while adhering to solder oxides can be reduced. As the result, since utilization rate, recovery rate and the like of solder can be enhanced, it serves useful for protection of the earth environment. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1' is a sectional view of a main part of a soldering apparatus as one embodiment of the present invention. Figure 2 is a view illustrating a method for removing solder oxides using a soldering apparatus, a sectional view of a main part of which is shown in Figure 1. Figure 3 is a perspective view of a main part of a solder outflowing device which is one component of the soldering apparatus of Figure 1. Figure 4 is a side sectional view showing a main part of one embodiment of a separating agent dusting devise which is one component of the soldering apparatus of Figure 1. Figure 5 is a side sectional view showing a main part of an another embodiment of a separating agent dusting device which is one component of the soldering apparatus of Figure 1. Figure 6 is a side sectional view showing a main part of a still*another embodiment of a separating agent dusting device which is one component of the soldering apparatus of Figure 1. Figure 7 is a view schematically showing each step of a method for separating solder and solder oxides. DETAILED DESCRIPTION OF THE INVENTION The first embodiment of the present invention provides a soldering apparatus comprising a solder wave shape forming means for melting solder and forming a solder wave shape, and a means for dusting solder oxides with a separating agent for separating solder and solder oxides, wherein said separating agent is any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour and peanut hull flour, or a combination thereof. This soldering apparatus is harmless and non-polluting, and can extremely easily separate solder and solder oxides• Moreover, since utilization rate, recovery rate and the like of solder can be enhanced, it serves useful for protection of the earth ) environment. The second embodiment of the present invention provides the soldering apparatus according to the first embodiment, wherein said offal is any one selected from the group consisting of rice bran, bran, wheat bran, mixed barley bran, naked barley bran, and mixed naked barley bran, or a combination thereof, said cereal is any one selected from the group consisting of foxtail, millet, Deccan grass and rice, or a combination thereof, said bean is any one selected from the group consisting of soybean, azuki bean, peanut and coconut, or a combination thereof, and said seed is any one selected from the group consisting of sesame, sunflower, palm and rapeseed, or a combination thereof. According to this soldering apparatus, solder and solder oxides can be separated at an extremely low cost. In addition, wastes can be effectively utilized. In addition, the third embodiment of the present invention provides the soldering apparatus according to the first embodiment, further comprising a means for scooping up solder oxides. According to this soldering apparatus, the removal of solder oxides can be automated and the soldering work on the printed wiring board can be continuously performed. In addition, the fourth embodiment of the present invention provides the soldering apparatus according to the third embodiment, further comprising a discharging means for discharging scooped solder oxides from said vessel. According to this soldering apparatus, the removal of solder oxides can be automated and the soldering work on the printed wiring board can be continuously performed. In addition, the fifth embodiment of the present invention provides a method for separating solder oxides, which comprises a step of scooping up solder oxides floating on molten solder into a vessel, a step of dusting with any one of the separating agents in accordance with either the first or second embodiment, or a combination thereof, a step of pulling out said vessel from a solder bath to separate solder and solder oxides, and a step of discharging separated solder oxides (oxidized draff)• According to this method, the removal of solder oxides can be automated and the soldering work on the printed wiring board can be continuously performed. In addition, an amount of solder to be discarded while adhering to solder oxides can be reduced. As the result, since utilization rate, recovery rate and the like of solder can be enhanced, it serves useful for protection of the earth environment. in addition, the sixth embodiment of the present invention provides a method for separating solder and solder oxides, which comprises a step of dusting solder oxides floating on molten solder with any one of the separating agents in accordance with the first or second embodiment, or a combination thereof, a step of scooping up said .solder oxides floating on molten solder into a vessel, a step of pulling out said vessel from a solder bath to separate solder and solder oxides, and a step of discharging separated solder oxides (oxidized draff). According to this method, the removal of solder oxides can be automated and the soldering work on the printed wiring board can be continuously performed. In addition, an amount of solder to be discarded while adhering to solder oxides can be reduced. As the result, since utilization rate, recovery rate and the like of solder can be enhanced, it serves useful for protection of the earth environment. In addition, the seventh embodiment of the present invention provides the soldering apparatus according to the first embodiment, further comprising a solder oxides scraping means for scraping out solder oxides separated from molten solder from a solder bath. This soldering apparatus is harmless and non-polluting, and can extremely easily separate solder and solder oxides. Moreover, since utilization rate, recovery rate and the like of solder can be enhanced, it serves useful for protection of the earth environment. In addition, the eighth embodiment of the present invention provides the soldering apparatus according to the first embodiment, further comprising a solder oxides forcing means for forcing solder oxides separated from molten solder to flow with an inert gas. This soldering apparatus can extremely easily separate solder and solder oxides. In addition, since utilization rate, recover rate the like of solder can be enhanced, it serves useful for protection of the earth environment. In addition, the ninth embodiment of the present invention provides a separating agent for separating solder oxides with solder adhered thereto or solder oxides in contact with molten solder into solder and solder oxides, which comprises any one selected from the group consisting of offal (rice bran, bran, wheat bran, mixed barley bran, naked barley bran, mixed naked barley bran and the like), bean flour (soybean, azuki bean, peanut, coconut and the like), soybean-cake flour, peanut hull flour, and seed flour (sesame, sunflower, palm, rapeseed and the like), or a combination thereof. This embodiment can provide a separating agent which is harmless to human living body, non-polluting and extremely low cost. Moreover, since utilization rate, recovery rate and the like of solder can be enhanced, it serves useful for protection of the earth environment. In addition, the tenth embodiment of the present invention provides a method for separating solder oxides i with solder adhered thereto into solder and solder oxides, which comprises a step of placing solder oxides with solder adhered thereto into a vessel, a step of immersing said vessel into a molten solder bath to melt said solder oxides with solder adhered thereto, a step of dusting with any one of the separating agents in accordance with the ninth embodiment or a combination thereof, and a step of pulling out said vessel from the solder bath to separate solder and solder oxides. According to this embodiment, the solder oxides separating work can be simply and easily performed and an amount of solder to be discarded while adhering to solder oxides can be reduced. As the result, since utilization rate, recovery rate and the like of solder can be enhanced, it serves useful for protection of the earth environment. In addition, the eleventh embodiment of the present invention provides a method for separating solder oxides with solder adhered thereto into solder and solder oxides, which comprises a step of placing solder oxides with solder adhered thereto into a vessel, a step of dusting said solder oxides with solder adhered thereto with any one of the separating agents in accordance with the ninth embodiment or a combination thereof, a step of immersing said vessel into a molten solder bath to melt said solder oxides with solder adhered thereto, and a step of pulling out said vessel from the solder bath to separate solder and solder oxides. According to this embodiment, the solder oxides separating work can be simply and easily performed and an amount of solder to be discarded while adhering to solder oxides can be reduced. As the result, since utilization rate, recovery rate and the like of solder can be enhanced, it serves useful for protection of the earth environment. In addition, the twelfth embodiment of the present invention provides a method for separating solder oxides with solder adhered thereto into solder and solder oxides, which comprises a step of immersing a vessel into a molten solder bath by around half, a step of placing solder oxides with solder adhered thereto into said vessel, a step of dusting said solder oxides with solder adhered thereto with any one of the separating agents in accordance with the ninth embodiment or a combination thereof, and a step of, after melting of solder which has been adhered to solder oxides, pulling out said vessel from the solder bath to separate solder and solder oxides. According to this embodiment, the solder oxides separating work can be simply and easily performed and an amount of solder to be discarded while adhering to spider oxides can be reduced. As the result, since utilization rate, recovery rate and the like of solder can be enhanced, it serves useful for protection of the earth environment. In addition, the thirteenth embodiment of the present invention provides a method for separating solder oxides in contact with molten solder into solder and solder oxides, which comprises a step of scooping up solder oxides floating on molten solder into a vessel, a step of dusting with any one of the separating agents in accordance with the ninth embodiment or a combination thereof, and a step of pulling out the vessel from the solder bath to separate solder and solder oxides. According to this embodiment, the solder oxides separating work can be simply and easily performed and an amount of solder to be discarded while adhering to solder oxides can be reduced. As the result, since utilization rate, recovery rate and the like of solder can be enhanced, it serves useful for protection of the earth environment. In addition, the fourteenth embodiment of the present invention provides a method for separating solder oxides in contact with molten solder into solder and solder oxides, which comprises a step of dusting solder oxides floating on molten solder with any one of the separating agents in accordance with the ninth embodiment or a combination thereof, a step of scooping up said solder oxides floating on molten solder into a vessel, and a step of pulling out said vessel from the solder bath to separate solder and solder oxides. According to this embodiment, the solder oxides separating work can be simply and easily performed and an amount of solder to be discarded while adhering to solder oxides can be reduced. As the result, utilization rate, recovery rate and the like of solder can be enhanced, it serves useful for protection of the earth environment. In addition, the fifteenth embodiment of the present invention provides a vessel for receiving solder oxides with solder adhered thereto or solder oxides in contact with molten solder, comprising a plurality of openings on an underside and each sidewall, each of the openings having an opening area of around 1-2.25 mm2. This vessel can easily and effectively separate solder and solder oxides. In addition, the sixteenth embodiment of the present invention provides a vessel for receiving solder oxides with solder adhered thereto or solder oxides in contact with molten solder, comprising a netted basket having a diameter of constituent wires of the net of 0.3-0.7 mm, and a side of a rectangular opening of 1.0-1.5 mm, preferably having a diameter of constituent wires of the net of approximately 0.5 mm, and a side of a rectangular opening of approximately 1.2 mm. This vessel can easily and effectively separate solder and solder oxides. EXAMPLES The following Examples illustrate the present invention in detail but are not to be construed to limit the scope thereof. Figure 1 is a sectional view of a main part of a soldering apparatus as one embodiment of the present invention. Figure 2 is a view illustrating one embodiment of a method for separating or removing solder oxides using the soldering apparatus of Figure 1. Figure 3 is a perspective view of a main part of a solder outflowing device which is one component of the present soldering apparatus. Referring to Figure 1, symbol 1 shows a solder outflowing nozzle, symbol 2 shows a front baffle plate, symbol 3 shows a rear baffle plate, symbol 4 shows a perforated plate, symbol 5 shows a solder bath, symbol 6 shows a solder wave shape of molten solder, symbol 7 shows solder oxides with solder adhered thereto, symbol 8 shows a separating agent (for example, rice bran), symbol 9 shows a vessel (for example, a netted basket), symbol 10 shows a sifting container for accommodating and scattering the separating agent, symbol 11 shows a partition plate, symbol 17 shows solder oxides (oxidized draff), symbol 20 shows a soldering apparatus, and symbol 30 shows a printed wiring board. Referring to Figure 3, symbol 12 shows a pore, symbol 13 shows a delivery pump, symbol 14 shows an axis, symbol 15 shows a duct for molten solder, symbol 16 shows an opening, and symbol 21 shows a solder outflowing device. Referring to Figures 1 and 3, a solder wave shape 6 is formed by molten solder which is circulated by a solder outflowing device 21, and solders printed wiring boards 30 which are directed along the arrow in a given pattern. The solder outflowing device 21 is located inside the solder bath. In the solder outflowing device 21, molten solder is drawn into the delivery pump 13 through the opening 16, and is flown out from the solder outflowing nozzle 1 via the duct 15 to form the desired solder wave shape with the front baffle plate 2 and the rear baffle plate 3. The perforated plate 4 provided in the middle level of the solder outflowing nozzle 1 is perforated to define a plurality of holes arranged in multiple rows and columns at predetermined pitches for removing impurities, metal masses, lead wires and the like which have been mixed into molten solder. That is, the plate 4 plays a role as a filter. Molten solder flown down from the rear baffle plate 3 is circulated by the delivery pump 13 and, as the result, it contacts with air to form a large amount of solder oxides. The formed solder oxides move on the surface of molten solder toward the partition plate 11 shown in Figure 1 and accumulate therein. The solder oxides receiving vessel 9 is disposed in molten solder in the vicinity of the partition plate 11. The vessel 9 is composed of a mesh-like netted basket in which a diameter of constituent wires of the net is approximately 0.5 mm and a side of a rectangular opening is >> approximately 1.2 mm. Said vessel 9 may be lifted from a position (A) in the solder bath 5, stopped at a position (B) , or turned over to a situation (C) . Furthermore, the vessel may be stopped at an arbitral position such as a position (D) shown in Figure 2. The vessel 9 may be driven by a conventional and general mechanism such as a fluid cylinder and a pulse motor (not shown). In addition, the sifting container 10 is provided above the vessel 9 outside the solder bath 5. The sifting container 10 accommodates a powdery separating agent such as rice bran and scatters the separating agent, by oscillating or agitating, through a meshed portion at its bottom onto solder oxides which have been accumulated in the vicinity of the partition plate 11. Oscillating or agitating may be performed by utilizing an arbitrary and general means such as an electromagnetic vibrator and a combination of an eccentric cum, a motor and a linkage. A space for accumulating and receiving solder oxides (oxidized draff) 17 is also provided on the right side of the partition plate 11. (An exclusive container may be of course provided). Next, a method for separating solder oxides floating on molten solder using the soldering apparatus having the above essential features is explained. (Separating method 1) In tfhe first step, solder oxides 7 floating on molten solder are scooped up by a netted basket (vessel 9) to collect, and then the netted basket is lifted by around half (see Figure 2; the netted basket is at a position (D)) . In the second step, the sifting container 10 is agitated to dust (or scatter) the surface of solder oxides 7 with the accommodated separating agent 8 such as powdery rice bran. An amount of the separating agent to be scattered may be such that the surface of said solder oxides 7 is almost covered. For example, a little to 0.7 spoonful of the separating agent may be scattered per 100 ml of solder oxides 7. In the third step, the netted basket is moved up and down or from side to side so that solder oxides 7 are moved up and down from the molten solder surface. This operation is repeated several times. In the fourth step, after confirming that the bulk of solder oxides is reduced and solder which has been adhered (or attached) to solder oxides is separated, the netted basket is pulled up from the molten solder surface (Figure 1; position (B) ) . In the fifth step, the netted basket is turned over to discard oxidized draff 17 into a waste receiving member and the like (Figure 1; position (C)). By the aforementioned steps 1-5, the procedure for removing solder oxides which have been floated and accumulated on molten solder is finished. The working time taken for the procedure is approximately 1 minute. Furthermore, change in the order of, addition of a step or steps to, or deletion of a step or steps from the steps 1-5 may be optionally performed as follows: (Separating method 2) The above second step, that is, a step for dusting solder oxides 7 floating on molten solder with the powdery separating agent 8 may be performed first. Thereafter, a step of scooping up solder oxides floating on molten solder into a vessel, a step of pulling out said vessel from the solder bath to separate solder and solder oxides, and a step of turning over the netted basket to discard oxidized draff 17 into a waste receiving member may be successively performed (not shown). (Separating method 3) In accordance with an another separating method, in the first step, solder oxides (solder dross) 7 floating on molten solder is scooped up to collect by the netted basket (vessel 9) , and the netted basket is lifted to a given level above the molten solder surface (position (B) in Figure 1) . Upon this, solder is adhered to solder oxides. In the second step, the sifting container 10 is agitated to * dust (or scatter) the surface of solder oxides 7 with the accommodated separating agent 8 such as rice bran. An amount of the separating agent to be scattered may be such that the surface of said solder oxides 7 is almost covered. For example, the amount of the separating agent is from a little to 0.7 spoonful per 100 ml of solder oxides 7. In the third step, the netted basket is descended so that around half of the netted basket is . immersed into molten solder (position (D) in Figure 2). Thereafter, the netted basket is moved up and down or from side to side so that solder oxides 7 are moved up and down from the molten solder surface. This operation is repeated several times. In the fourth step, after confirming that the bulk of solder oxides is reduced and solder which has been adhered (or attached) to solder oxides is separated, the netted basket is pulled up from the molten solder surface (position (B) in Figure 1). In the fifth step, the netted basket is turned over to discard oxidized draff 17 into a waste receiving member and the like (position (C) in Figure 1) . Furthermore, although the netted basket was used as a vessel for receiving solder oxides 7 in the preceding description of separating method 1, 2 or 3, the vessel is not limited to the netted basket and, any other optional members may be used. For example, a vessel may be formed of a punching metal which is perforated to define a plurality of circular or rectangular openings. In one embodiment, rectangular openings having an opening area of approximately 1-2.25 mm2 are provided on an underside and each sidewall of a receiving vessel in multiple rows and columns (matrix fashion) at pitches of approximately 1.5-2.0 mm. Similarly, in the flow (wave)-type soldering apparatus, the solder outflowing nozzles may be provided at multiple sites, for example, at two sites. Moreover, in stead of scooping up separated solder oxides (oxidized draff) 17 by a vessel such as the netted basket and the like, they may be scraped by a heat-resistant squeegee, for example, a plate made of stainless steel and the like. It is a matter of course that the inert gas may be used to force solder oxides to flow from the molten solder surface into the waste receiving member. In addition, operation for removing solder oxides may be controlled by time switch setting so that it is automatically performed in a regular interval, for example in every two hours (not shown in Figures). Furthermore, the powdery separating agent dusting means may have any other structures as follows: the structure wherein a cascade (tub) and a hopper with a separating agent accommodated are electromagnetically vibrated as shown in Figure 4, the structure wherein a lower part of a hopper with a separating agent accommodated is provided with a sliding plate having through holes arranged therein as shown in Figure 5, and the structure wherein a lower part of a hopper with a separating agent accommodated is provided with a rotor having a plurality of notches arranged as shown in Figure 6. Furthermore, the aforementioned soldering apparatus may be utilized as a solder recovering apparatus for recovering solder from solder oxides with solder adhered thereto in addition to as an apparatus for soldering various electronic parts carried on a printed wiring board. Upon this, a method for recovering solder is to immerse solder oxides with solder adhered thereto into molten solder and separate and discharge only solder oxides by utilizing the reducing or anti-oxidizing activity of the aforementioned separating agent. A method for recovering solder of the present invention comprises, for example, a step of placing solder oxides with solder adhered thereto into a vessel having a plurality of openings on an underside and a sidewall, a step of immersing said vessel having received solder oxides with solder adhered thereto into molten solder, a step of dusting solder oxides with solder adhered thereto with a separating agent, and a step of pulling out said vessel from molten solder, wherein said separating agent is any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour, and peanut hull flour, or a combination thereof. In addition, in a solder recovering apparatus, a stationery-type (dip-type) solder bath where solder wave shape is flat may be used instead of a flow-type (wave) solder bath. (Separating method 4) Next, Figure 7 is a view showing an embodiment of a method for separating solder and solder oxides. Referring to Figure 7, symbols 1-7 enclosed in parenthesis show each step of the separation procedure. In the first step, a vessel 9 (netted basket, in which a diameter of constituent wires of the net is approximately 0.5 mm and a side of a rectangular opening is approximately 1.2 mm) for receiving solder oxides with solder adhered thereto is immersed into a dip-solder bath or a flow-solder bath (wave solder bath) by around half. A temperature of molten solder is set at approximately 280-290°C (a flow-solder bath 5 is shown in Figure 7). In the second and third steps, a mass of solder oxides 7 with solder adhered thereto (solder oxides to which solder is attached/solder dross) is placed into the netted basket 9 to a degree of its around half volume. A vessel for scooping up solder dross 7 may be an optional means such as a spoon, a nipper, a pincette and the like. In the fourth step, the aforementioned separating agent 8 such as rice bran is scooped up with a spoon, and the surface .of solder oxides with solder adhered thereto 7 is dusted (or scattered) therewith. An amount of the separating agent to be scattered may be such that the surface of said solder oxides 7 is almost covered. For example, an amount of the separating agent may be from a little to 0.7 spoonful per 100 ml of solder oxides 7. In the fifth step, the netted basket 9 is moved up and down or from side to side so that solder oxides with solder adhered thereto 7 is pulled up and down from the molten solder surface 18. This operation is repeated several times. In the sixth step, after confirming that the bulk of solder oxides with solder adhered thereto 7 is reduced and solder which has been adhered (or attached) to solder oxides is molten, the netted basket 9 is pulled out from the molten solder surface 18. In the seventh step, oxidized draff (solder oxides) 1.7 which remains in the netted basket 9 is discarded into a waste receiving member and the like. By the aforementioned steps 1~7, the procedure for separating "solder and solder oxides is finished. The working time taken for the procedure is approximately one to two minutes. According to this procedure, above ninety percents of solder which has been adhered to solder oxides can be recovered and the bulk of solder oxides themselves can be reduced to approximately ten to twenty percents of the original bulk. According to the method of the present invention, the separation of solder oxides and solder can be extremely easily performed in a short time and safely. The method of the present invention does not require wearing a protecting equipment upon handling the separating agent. In addition, since rice bran is used as a separating agent, the method of the present invention is performed at an extremely low cost. It also serves useful for protection of the environment, since rice bran which has been handled as a waste in many cases, can be effectively utilized. In this method, the separating agent is not limited to rice bran. Separation of solder oxides can also be accomplished by using any one selected from the group consisting of offal (bran, wheat bran, mixed barley bran, naked barley bran, mixed naked barley bran and the like), bean flour (soybean, azuki bean, peanut, coconut and the like), soybean-cake flour, peanut hull flour and seed flour (sesame, sunflower, palm, rapeseed and the like) described above or a>:> combination thereof. In particular, seed flour exerts the better separating effect. An amount of the separating agents other. than rice bran to be scattered is also similar to that of rice bran and is a little to 0.7 spoonful per 100 ml of solder oxides. Moreover, change of the order of, deletion of a step or steps from the steps 1-7 may be optionally performed. For example, a step for placing solder oxides with solder adhered thereto into a vessel outside molten solder (outside the solder bath or above the molten solder surface) may be performed first. Thereafter, a step of dusting said solder oxides with solder adhered thereto with any one of the separating agents described above or a combination thereof, a step of immersing said vessel into the molten solder bath to melt solder oxides with solder adhered thereto, and a step of pulling out the vessel from the solder bath to separate solder and solder oxides may be successively performed. In addition, a step of placing solder oxides with solder adhered thereto into a vessel outside a molten ■0 solder, a step of immersing said vessel into the molten solder bath to melt solder oxides with solder adhered thereto, a step of dusting said solder oxides with solder adhered thereto with any one of the aforementioned separating agents or a combination thereof, and a step of pulling out said vessel from the solder bath to separate solder and solder oxides may be successively performed. (Separating method 5) Next, a method for separating solder oxides floating on molten solder into solder and solder oxides (Separating method 5) is described as an another embodiment of the present invention. The separating agent to be used in this case is the same as that in (Separating method 4) (such as rice bran) . An amount of rice bran to be scattered to solder oxides is also similar to that in (Separating method 4). The order of the steps of separating solder and solder oxides is as follows: In the first step, a receiving vessel for scooping solder oxides (a netted basket, in which a diameter of constituent wires of the net is approximately 0.5 mm and a side of a rectangular opening is approximately 1.2 mm) is immersed into a dip- or flow-solder bath to a degree that the upper edge of the vessel is hidden. In the second step, solder oxides floating on molten solder (solder dross) is scooped up by the netted basket to collect, and then the netted basket is lifted by around half. In the third step, the separating agent such as rice bran according to the present invention is dusted (or scattered) onto the surface of the solder oxides floating on molten^ . solder using a spoon. An amount of the separating agent to be scattered may be such that the surface of solder oxides is almost covered. For example, the amount may be from a little to 0.7 spoonful per 100 ml of solder oxides. In the fourth step, the netted basket is moved up and down or from side to side so that solder oxides is moved up and down from the molten solder surface. This operation is repeated several times. In the fifth step, after confirming that the bulk of solder oxides is reduced and solder which has been adhered (attached) to solder oxides is melted, the netted basket is pulled out from the molten solder surface. In the sixth step, oxidized draff (solder oxides) which remains in the netted basket is discharged into a waste receiving member and the like. By the aforementioned steps 1-6, the procedure for separating solder and solder oxides is finished. The working time taken for the procedure is approximately one minute (not shown). According to this procedure (Separating method 5), the separation of solder and solder oxides can be extremely easily performed in a short time and at a low cost. Furthermore, change in the order of, addition of a step or steps to, or deletion of a step or steps from the ■*■> steps 1-6 may be also optionally performed. For example,' by changing the order of the third step, a step for dusting solder oxides floating on molten solder with any one of the aforementioned separating agents or a combination thereof may be performed first. Thereafter, a step of scooping up solder oxides floating on the molten solder into a vessel, and a step of pulling out said vessel from the solder bath to separate solder and solder oxides may be successively performed (not shown). In the aforementioned two embodiments (Separating methods 4 and 5), the use of the netted basket is described as a vessel for receiving solder oxides with solder adhered thereto or solder oxides floating on molten solder. But the vessel is not limited to the netted basket, and any optional members can be used. For example, the vessel may be formed of a punching metal provided with a plurality of circular or rectangular openings. In one embodiment, the receiving vessel is formed such that a plurality of rectangular openings having an opening area of approximately 1-2.25 mm2 are provided in multiple rows and columns (matrix fashion) at pitches of approximately 1.5-2.0 mm on an underside and each sidewall thereof. In addition, instead of the flow (wave) type soldering apparatus, the stationery dip-type soldering apparatus may be used. Furthermore, in stead of scooping up separated solder oxides (oxidized draff) by the netted basket, the solder oxides may be scraped off with a heat-resistant plate or the like, or may be forced to flow off the molten solder surface with an inert gas or the like. 1. A soldering apparatus comprising a solder wave shape forming means for melting solder and forming solder wave shape, and a separating agent dusting means for dusting solder oxides with a separating agent which separates solder and solder oxides, wherein said separating agent is any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour, and peanut hull flour, or a combination thereof. 2. The soldering apparatus according to claim 1, wherein said offal is any one selected from the group consisting of rice bran, bran, wheat bran, mixed barley bran, naked barley bran and mixed naked barley bran or a combination thereof, said cereal is any one selected from the group consisting of foxtail, Deccan grass, millet and rice or a combination thereof, said bean is any one selected from the group consisting of soybean, azuki bean, peanut and coconut or a combination thereof, and said seed is any one selected from the group consisting of sesame, sunflower, palm, rapeseed and cotton or a combination thereof. 3. The soldering apparatus according to claim 1 or 2, further comprising a solder oxides scooping up means for scooping up solder oxides floating on molten solder. 4. The soldering apparatus according to claim 3, wherein the scooping up means is a vessel provided with a discharging means for discharging scooped up solder oxides from said vessel. 5. The soldering apparatus according to claim 4, wherein said vessel is provided with a plurality of openings having 1-2.25 mm2 of an opening area on an underside and sidewalls thereof. >> 6. The soldering apparatus according to claim 5, wherein said vessel is formed of a punching metal. 7. The soldering apparatus according to claim 5, wherein said vessel comprises a netted basket having 0.3-0.7 mm of a diameter of constituent wires of the net and 1.0-1.5 mm of a side of a rectangular opening. 8. A soldering apparatus comprising a solder wave shape forming means for melting solder and forming solder wave shape, and a separating agent dusting means for dusting solder oxides with a separating agent which separates solder and solder oxides, a solder oxides scraping means for scraping solder oxides floating on molten solder, wherein said separating agent is any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour, and peanut hull flour, or a combination thereof. 9. A soldering apparatus comprising a solder wave shave forming means for melting solder and forming solder wave shape, a separating agent dusting means for dusting solder oxides with a separating agent which separates solder and solder oxides, and a solder oxides forcing means for forcing solder oxides floating on molten solder to flow with an inert gas, wherein said separating agent is any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour, and>peanut hull flour, or a combination thereof. 10. A method for removing solder oxides, which comprises a step of scooping up solder oxides floating on molten solder into a vessel, a step of dusting said solder oxides with any one separating agent selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour, and peanut hull flour, or a combination thereof, a step of pulling out said vessel from a solder bath to separate solder oxides from molten solder, and a step of turning over said vessel to discharge solder oxides. 11. A method for removing solder oxides according to claim 10, wherein said offal is any one selected from the group consisting of rice bran, bran, wheat bran, mixed barley bran, naked barley and mixed naked barley bran or a combination thereof, said cereal is any one selected from the group consisting of foxtail, Deccan grass, millet and rice or a combination thereof, said bean is any one selected from the group consisting of soybean, azuki bean, peanut and coconut or a combination thereof, and said seed is any one selected from the group consisting of sesame, sunflower, palm, rapeseed and cotton or a combination thereof. 12. A method for removing solder oxides according to claim 10 or 11, which further comprises a step of, after dusting with a separating agent, pulling out the vessel from the solder bath or immersing the vessel into the solder bath so that the vessel is moved up and down a plural times. 13. A method for removing solder oxides, which comprises' a step of dusting solder oxides floating on molten solder with any one separating agent selected from the group consisting of offal, cereal grain or flour, bean flour, seed brain or flour, soybean-cake flour, and peanut hull flour, or a combination thereof, a step of scooping up solder oxides floating on molten solder into a vessel, a step of pulling out said vessel from the solder bath to separate solder oxides from molten solder, and a step of turning over said vessel to discharge solder oxides. 14. The method for removing solder oxides according to claim 13, which further comprises a step of, after dusting with a separating agent, pulling out said vessel from the solder bath or immersing the vessel into the solder bath so that the vessel is moved up and down a plural times. 15. The method for removing solder oxides according to any one of claims 10-14, wherein the solder oxides is dusted with the separating agent so that the surface thereof is almost covered. 16. A solder recovering apparatus comprising a solder heating means for heating solder to melt/ and a separating agent dusting means for dusting solder oxides with a separating agent which separates solder and solder oxides, wherein said separating agent is any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour, and peanut hull flour, or a combination thereof. 17. The solder recovering apparatus according to claim 16, wherein said offal is any one selected from the group consisting of rice bran, bran, wheat bran, mixed barley bran, naked barley bran and mixed naked barley bran or a combination thereof, said cereal is any one selected from the group consisting of foxtail, Deccan grass, millet and rice or a combination thereof, said bean is any one selected from the group consisting of soybean, azuki bean, peanut and coconut or a combination thereof, and said seed is any one selected from the group consisting of sesame, sunflower, palm, rapeseed and cotton or a combination thereof. 18. The solder recovering apparatus according to claim 16, further comprising a solder oxides scooping up means for scooping solder oxides floating on molten solder. 19. The solder recovering apparatus according to claim 18, wherein the scooping up means is a vessel provided with a discharging means for discharging scooped up solder oxides from the vessel. 20. The solder recovering apparatus according to claim 19, wherein the vessel is a netted basket having 0.3-0.7 mm of a diameter of constituent wires of the net and 1.0-1.5 mm of a side of rectangular opening. 21. A solder recovering apparatus comprising a solder heating means for heating solder to melt, a separating agent dusting means for dusting solder oxides with a separating agent which separates solder and solder oxides, and a solder oxides scraping means for scraping solder oxides floating on molten solder, wherein said separating agent is any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour, and peanut hull flour, or a combination thereof. 22. A solder recovering apparatus comprising a solder heating means for heating solder to melt, a separating agent dusting means for dusting solder oxides with a separating agent which separates solder and solder oxides, and a solder oxides forcing means for forcing solder oxides floating on molten solder to flow with an inert gas, wherein said separating agent is any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour, and peanut hull flour, or a combination thereof. ^> 23. A separating agent for separating solder oxides with solder adhered thereto or solder oxides in contact with molten solder, which comprises cereal as a member for separating solder and solder oxides. 24. The separating agent for separating solder oxides with solder adhered thereto or solder oxides in contact with molten solder according to claim 23, wherein the cereal is any one selected from the group consisting of foxtail, Deccan grass, millet and rice, or a combination thereof. 25. The separating agent for separating solder oxides with solder adhered thereto or solder oxides in contact with molten solder according to claim 23 or 24, wherein the cereal is grain or flour, or a combination thereof. 26. A separating agent for separating solder oxides with solder adhered thereto or solder oxides in contact with molten solder, which comprises offal as a member for separating solder and solder oxides. 27. The separating agent for separating solder oxides with solder adhered thereto or solder oxides in contact with molten solder according to claim 26, wherein the offal is any one selected from the group consisting of rice bran, bran, wheat bran, mixed barley bran, naked barley bran, and mixed naked barley bran, or a combination thereof. 28. A separating agent for separating solder oxides with solder adhered thereto or solder oxides in contact with molten solder, which comprises bean flour as a member for separating solder and solder oxides. 29. The separating agent for separating solder oxides with solder adhered thereto or solder oxides in contact with molten solder according to claim 28, wherein the bean is any one selected from the group consisting of soybean, azuki bean, peanut and coconut, or a combination thereof. 30. A separating agent for separating solder oxides with solder adhered thereto or solder oxides in contact with molten solder, which comprises soybean-cake or peanut hull flour as a member for separating solder and solder oxides. 31. A separating agent for separating solder oxides with solder adhered thereto or solder oxides in contact with molten solder, which comprises seed flour as a member for separating solder and solder oxides. 32. The separating agent for separating solder oxides with solder adhered thereto or solder oxides in contact with molten solder according to claim 31, wherein the seed is any one selected from the group consisting of sesame, sunflower, palm, rapeseed and cotton, or a combination thereof. 33. A method for separating solder oxides with solder adhered thereto, which comprises a step of placing solder oxides with solder adhered thereto into a vessel, a step of immersing said vessel into a molten solder bath, a step of dusting said solder oxides with solder adhered thereto with the separating agent according to any one of claims 26-32, and a step of pulling out said vessel from the solder bath to separate solder and solder oxides. 34. The method for separating solder oxides with solder adhered thereto according to claim 33, which further comprises a step of, after dusting with the separating agent, pulling out the vessel from the solder bath or immersing the vessel into the solder bath so that the vessel is moved up and down a plural times. 35. The method for separating solder oxides with solder adhered thereto according to claim 33 or 34, wherein the solder oxides with solder adhered thereto is dusted with the separating agent according to any one of claims 26-32 so that the surface thereof is almost covered. 36. A method for separating solder oxides with solder adhered thereto, which comprises a step of placing solder oxides with solder adhered thereto into a vessel, a step of dusting said solder oxides with solder adhered thereto with the separating agent according to any one of claims 26-32, a step of immersing said vessel into a molten solder bath to melt said solder oxides with solder adhered thereto, and a step of pulling out said vessel from the solder bath to separate solder and solder oxides. 37. A method for separating solder oxides with solder adhered thereto, which comprises a step of immersing a vessel into a molten solder bath by around half, a step of placing solder oxides with solder adhered thereto into said vessel, a step of dusting said solder oxides with solder adhered thereto with the separating agent according to any one of claims 26-32, and a step of pulling out said vessel from the solder bath to separate solder and solder oxides. 38. A method for separating solder oxides in contact with molten solder, which comprises a step of scooping up solder oxides floating on molten solder into a vessel, a step of dusting said solder oxides with the separating agent according to any one of claims 2 6-32, and a step of pulling out said vessel from the solder bath to separate solder oxides from said molten solder. 39. The method for separating solder oxides in contact with molten solder according to claim 38, which further .comprises a step of, after dusting with., the separating agent, pulling out the vessel from the solder bath or immersing the vessel into the solder bath so that the vessel is moved up and down a plural times. 40. The method for separating solder oxides in contact with molten solder according to claim 38 or 39, wherein solder oxides is dusted with the separating agent according to any one of claims 26-32 so that the surface thereof is almost covered. 41. A method for separating solder oxides in contact with molten solder, which comprises a step of dusting solder oxides floating on molten solder with the separating agent according to any one of claims 26-32, a step of scooping up solder oxides floating on molten solder into a vessel, and a step of pulling out said vessel from a solder bath to separate solder oxides from said molten solder. 42. The method for separating solder oxides with solder adhered thereto or solder oxides in contact with molten solder according to any one of claims 33-41, wherein the vessel is formed of a netted basket or a punching metal having a plurality of openings. 43. The method for separating solder oxides with solder adhered thereto or solder oxides in contact with molten solder according to claim 42, wherein the vessel has a plurality of openings having an opening area of 1-2.25 mm2 on an underside and sidewalls thereof. 44. A vessel for receiving solder oxides with solder adhered thereto or solder oxides in contact with molten solder, comprising a plurality of openings having an opening area of 1-2.25 mm2 on an underside and sidewalls thereof. 45. The vessel for receiving solder oxides with solder adhered thereto or solder oxides in contact with molten solder according to claim 44, wherein the vessel is formed of a punching metal. 46. A vessel for receiving solder oxides with solder adhered thereto or solder oxides in contact with molten solder, comprising a netted basket having 0.3-0.7 mm of a diameter of constituent wires of the net and 1.0-1.5 mm of a side of rectangular openings. 47. A method for separating solder oxides with solder adhered thereto or solder oxides in contact with molten solder, which comprises dusting the solder oxides with the separating agent according to any one of claims 26-32, and heating the solder oxides with molten solder to separate solder and solder oxides. 48. A method for separating solder oxides with solder adhered hereto or solder oxides in contact with molten solder, which comprises dusting the solder oxides with the separating agent according to any one of claims 26-32, heating the solder oxides with molten solder, and removing the solder oxides with a netted basket. 49. A separating agent for separating solder oxides, which comprises a combination of at least two selected from offal, bean flour, soybean-cake flour, peanut hull flour and seed flour as a member for separating solder and solder oxides.

Documents:

209-mas-1999- abstract.pdf

209-mas-1999- claims duplicate.pdf

209-mas-1999- claims original.pdf

209-mas-1999- correspondence others.pdf

209-mas-1999- correspondence po.pdf

209-mas-1999- description complete duplicate.pdf

209-mas-1999- description complete original.pdf

209-mas-1999- drawings.pdf

209-mas-1999- form 1.pdf

209-mas-1999- form 26.pdf

209-mas-1999- form 3.pdf

209-mas-1999- form 4.pdf